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公开(公告)号：US09625963B2
公开(公告)日：2017-04-18
申请号：US14836572
申请日：2015-08-26
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Mehdi Saeidi
CPC classification number: G06F1/206 , G06F1/3234 , G06F1/324 , G06F1/3296 , H03K19/0008 , Y02D10/126 , Y02D10/16 , Y02D10/172
Abstract: A performance setting technique is disclosed for a clocked circuit such as a processor in an integrated circuit. The technique determines a maximum power consumption for the clocked circuit as a function of a total thermal resistance of a mobile device incorporating the integrated circuit. The total thermal resistance is a sum of a system thermal resistance for the mobile device and a device thermal resistance for the integrated circuit.
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12.发明申请PACKAGE-ON-PACKAGE (POP) DEVICE COMPRISING BI-DIRECTIONAL THERMAL ELECTRIC COOLER 有权封装包装（POP）装置，包含双向热电冷却器公开(公告)号：US20160334845A1
公开(公告)日：2016-11-17
申请号：US14709276
申请日：2015-05-11
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Hee Jun Park , Peng Wang , Mehdi Saeidi , Arpit Mittal
CPC classification number: G06F1/206 , G01K7/04 , G05D23/1906 , H01L23/34 , H01L23/3677 , H01L23/38 , H01L23/49811 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/1094 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.
Abstract translation: 封装封装（PoP）器件包括第一封装，第二封装和双向热电冷却器（TEC）。 第一封装包括第一基板和耦合到第一基板的第一管芯。 第二个包装耦合到第一个包装。 第二包装包括第二基板和耦合到第二基板的第二管芯。 TEC位于第一模具和第二基板之间。 TEC适于在第一包装和第二包装之间动态地散发热量。 TEC适于在第一时间段内将热量从第一管芯散热到第二管芯。 TEC进一步适于在第二时间段内将热量从第二管芯传送到第一管芯。 TEC适于通过第二衬底将热量从第一裸片散发到第二裸片。
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公开(公告)号：US10114443B2
公开(公告)日：2018-10-30
申请号：US15441124
申请日：2017-02-23
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Madan Krishnappa , Rajit Chandra , Mohammad Tamjidi
Abstract: A thermal controller for managing thermal energy of a multi-core processor is provided. The cores include a first core processing a load and remaining cores. The thermal controller is configured to determine that a temperature of the first core is greater than a first threshold, determine a temperature of a second core of the remaining cores in response to determining that the temperature of the first core is greater than the first threshold, and determine whether the temperature of the second core is greater than or less than a second threshold. The thermal controller is configured to transfer at least a portion of the load of the first core to the second core in response to determining that the temperature of the first core is greater than the first threshold and based on whether the temperature of the second core is greater than or less than the second threshold.
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14.发明授权公开(公告)号：US10007310B2
公开(公告)日：2018-06-26
申请号：US15205678
申请日：2016-07-08
Applicant: QUALCOMM Incorporated
Inventor： Mehdi Saeidi , Melika Roshandell , Rajat Mittal
CPC classification number: G06F1/206 , G06F1/203 , G06F1/3287 , G06F1/3296 , Y02D10/172
Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device; and processing the temperature information to generate voltage reduction steps based on an observed rate of change of the temperature information.
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公开(公告)号：US09983557B2
公开(公告)日：2018-05-29
申请号：US14882158
申请日：2015-10-13
Applicant: QUALCOMM Incorporated
Inventor： Hee Jun Park , Rajat Mittal , Mehdi Saeidi
CPC classification number: G05B15/02 , G06F1/1616 , G06F1/206
Abstract: A method, an apparatus, and a computer program product for performance management are provided. The apparatus may be an electronic device. The electronic device detects a change of form factor mode or ambient wind using a detection circuit or at least one sensor. The change of form factor mode may include at least one of folding the electronic device, unfolding the electronic device, rolling the electronic device, changing a flexible shape of the electronic device, or equipping a cover on the electronic device. A set of thermal control parameters may be determined based on the detected change. The set of thermal control parameters may be retrieved from a lookup table or calculated using a mathematical model. The electronic device adjusts the performance based on the set of thermal control parameters.
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Patent Agency Ranking
公开(公告)号：US20180143862A1
公开(公告)日：2018-05-24
申请号：US15373067
申请日：2016-12-08
Applicant: QUALCOMM INCORPORATED
Inventor： Mehdi Saeidi , Vivek Sahu , Taravat Khadivi , Ryan Coutts , Ronald Alton , Palkesh Jain , Rajat Mittal
CPC classification number: G06F9/5044 , G06F1/206 , G06F9/5094 , Y02D10/22
Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device, wherein a first one of the temperature sensors is physically located at a first processing unit of the computing device; processing the temperature information to identify that the first temperature sensor is associated with temperature that is at or above a threshold; and assigning a processing thread to a first core of a plurality of cores of a second processing unit in response to identifying that the first temperature sensor is associated with temperature that is at or above the threshold and based at least in part on a physical distance between the first core and the first temperature sensor.
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公开(公告)号：US09971368B2
公开(公告)日：2018-05-15
申请号：US14963790
申请日：2015-12-09
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Mehdi Saeidi , Arpit Mittal , Emil Rahim
CPC classification number: G05F1/463 , G01K13/00 , G06F1/206 , G06F1/3206
Abstract: In one embodiment, a temperature management system comprises a plurality of temperature sensors on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the temperature sensors, to determine a plurality of power values based on the temperature readings, to determine a plurality of temperature values based on the determined power values, the determined temperature values corresponding to a plurality of different locations on the chip, and to estimate a temperature of a hotspot on the chip based on the determined temperature values.
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公开(公告)号：US09746889B2
公开(公告)日：2017-08-29
申请号：US14709276
申请日：2015-05-11
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Hee Jun Park , Peng Wang , Mehdi Saeidi , Arpit Mittal
IPC: H01L29/15 , H01L21/20 , G06F1/20 , H01L23/34 , H01L23/38 , H01L25/065 , H01L25/10 , G01K7/04 , G05D23/19 , H01L23/498 , H01L23/367
CPC classification number: G06F1/206 , G01K7/04 , G05D23/1906 , H01L23/34 , H01L23/3677 , H01L23/38 , H01L23/49811 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/1094 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.
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公开(公告)号：US20170074729A1
公开(公告)日：2017-03-16
申请号：US14852350
申请日：2015-09-11
Applicant: QUALCOMM Incorporated
Inventor： Ryan Michael Coutts , Rajat Mittal , Mehdi Saeidi , Paul Ivan Penzes
CPC classification number: G01K13/00 , G05B15/02 , G06F1/04 , G06F1/206 , G06F1/3206 , G06F1/324 , G06F1/3296 , G06F11/3058 , G06F11/3093 , G06F2201/81 , Y02D10/126 , Y02D10/16
Abstract: In one embodiment, a temperature management system comprises a plurality of thermal sensors at different locations on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the thermal sensors, to fit a quadratic temperature model to the received temperature readings, and to estimate a hotspot temperature on the chip using the fitted quadratic temperature model.
Abstract translation: 在一个实施例中，温度管理系统包括在芯片上的不同位置处的多个热传感器和温度管理器。 温度管理器被配置为从热传感器接收多个温度读数，以将二次温度模型拟合到接收到的温度读数，并且使用拟合的二次温度模型来估计芯片上的热点温度。
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公开(公告)号：US20160216719A1
公开(公告)日：2016-07-28
申请号：US14603058
申请日：2015-01-22
Applicant: QUALCOMM, Incorporated
Inventor： Mehdi Saeidi , Rajat Mittal , Arpit Mittal , Ryan Michael Coutts
CPC classification number: G05D23/1917 , G01K3/08 , G01K3/10 , G05B15/02 , G06F1/206
Abstract: In one embodiment, a method of temperature control comprises receiving temperature readings from a temperature sensor on a chip, calculating one or more second derivatives of temperature with respect to time based on the temperature readings, and determining whether to perform temperature mitigation on the chip based on the one or more calculated second derivatives of temperature.
Abstract translation: 在一个实施例中，温度控制的方法包括从芯片上的温度传感器接收温度读数，基于温度读数计算温度相对于时间的一个或多个二次导数，以及确定是否在基于芯片的基础上执行温度降低 在一个或多个计算的温度的二阶导数上。
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