Abstract:
An apparatus is described. The apparatus includes an input device. The apparatus also includes a positive supply voltage pad. The apparatus further includes an input signal pad. The apparatus also includes a ground pad. The apparatus further includes charged-device model protection circuitry that protects the input device from electrostatic discharge. The charged-device model protection circuitry includes at least one of de-Q circuitry and a cascode device.
Abstract:
In a particular embodiment, a circuit includes a power supply, a ground, and a clamping transistor circuit coupled to the power supply and to the ground. The circuit further includes a disable clamp circuit. The disable clamp circuit is coupled to the power supply and is responsive to a second power supply input to selectively disable the clamping transistor circuit by modifying a charging current applied to a capacitor of the clamping transistor circuit. In a particular embodiment, modifying the charging current includes enabling a second charging path. Enabling the second charging path enables charging the capacitor at a higher charging rate than a charging rate associated with charging the capacitor via a first charging path.
Abstract:
An intergrated circuit (IC) package includes a die, a package substrate coupled to the die, and a first electrostatic discharge (ESD) protection component coupled to the package substrate, where the first electrostatic discharge (ESD) protection component is configured to provide package level electrostatic discharge (ESD) protection. In some implementations, the first electrostatic discharge (ESD) protection component is embedded in the package substrate. In some implementations, the die includes an internal electrostatic discharge (ESD) protection component configured to provide die level electrostatic discharge (ESD) protection. In some implementations, the internal electrostatic discharge (ESD) protection component and the first electrostatic discharge (ESD) protection component are configured to provide cumulative electrostatic discharge (ESD) protection for the die.
Abstract:
A device includes a snapback clamp circuit configured to clamp a supply voltage in response to the supply voltage exceeding a trigger voltage level. In at least one embodiment, the snapback clamp circuit includes a clamp transistor and a programmable resistance portion that is responsive to a control signal to calibrate the trigger voltage level. Alternatively or in addition, the snapback clamp circuit may include a programmable bias device configured to calibrate the trigger voltage level by biasing a gate terminal of the clamp transistor. In another particular embodiment, a method of calibrating a snapback clamp circuit is disclosed. In another particular embodiment, a method of operating an integrated circuit is disclosed.