公开(公告)号：US09166534B2

公开(公告)日：2015-10-20

申请号：US14109239

申请日：2013-12-17

Applicant: QUALCOMM Incorporated

Inventor： Aristotele Hadjichristos ,  Calogero Davide Presti ,  Babak Nejati

IPC: H03F3/191 ,  H03F1/56 ,  H03F3/19 ,  H03F3/195 ,  H03F3/24

CPC classification number: H03F1/565 ,  H03F3/19 ,  H03F3/191 ,  H03F3/195 ,  H03F3/245 ,  H03F2200/111 ,  H03F2200/378 ,  H03F2200/387 ,  H03F2200/391 ,  H03F2200/417 ,  H03F2200/423

Abstract: A tunable loadline is disclosed. In an exemplary embodiment, an apparatus includes an amplifier configured to output an amplified signal having a selected power level and a first impedance network coupled to receive the amplified signal at an input terminal and generate a first output signal having a first power level at a first output terminal. The first impedance network being configured to load the amplified signal to convert the selected power level to the first power level. The apparatus also includes a second impedance network configured to selectively receive the first output signal and generate a second output signal having a second power level at a second output terminal. The second impedance network being configured to combine with the first impedance network to load the amplified signal to convert the selected power level to the second power level.

Abstract translation: 公开了一种可调节负载线。 在示例性实施例中，一种装置包括：放大器，被配置为输出具有选定功率电平的放大信号和耦合以在输入端接收放大信号的第一阻抗网络，并产生第一功率电平的第一输出信号 输出端子。 第一阻抗网络被配置为加载放大的信号以将所选择的功率电平转换为第一功率电平。 该装置还包括配置成选择性地接收第一输出信号并且在第二输出端产生具有第二功率电平的第二输出信号的第二阻抗网络。 第二阻抗网络被配置为与第一阻抗网络组合以加载放大的信号以将所选择的功率电平转换为第二功率电平。

公开(公告)号：US20140246753A1

公开(公告)日：2014-09-04

申请号：US13787219

申请日：2013-03-06

Applicant: QUALCOMM INCORPORATED

Inventor： Young K. Song ,  Yunseo Park ,  Xiaonan Zhang ,  Ryan D. Lane ,  Babak Nejati ,  Aristotele Hadjichristos ,  Xiaoming Chen

IPC: H01L23/522 ,  H01L23/00

CPC classification number: H01L23/5227 ,  H01L23/645 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/117 ,  H01L2224/02375 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15331 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00012

Abstract: Some novel features pertain to a first example provides a semiconductor device that includes a printed circuit board (PCB), asset of solder balls and a die. The PCB includes a first metal layer. The set of solder balls is coupled to the PCB. The die is coupled to the PCB through the set of solder balls. The die includes a second metal layer and a third metal layer. The first metal layer of the PCB, the set of solder balls, the second and third metal layers of the die are configured to operate as an inductor in the semiconductor device. In some implementations, the die further includes a passivation layer. The passivation layer is positioned between the second metal layer and the third metal layer. In some implementations, the second metal layer is positioned between the passivation layer and the set of solder balls.

Abstract translation: 一些新颖特征涉及第一示例，提供了包括印刷电路板（PCB），焊球和裸片的资产的半导体器件。 PCB包括第一金属层。 该组焊球与PCB相连。 模具通过一组焊球耦合到PCB。 模具包括第二金属层和第三金属层。 PCB的第一金属层，焊球集合，管芯的第二和第三金属层被配置为在半导体器件中作为电感器工作。 在一些实施方式中，芯片还包括钝化层。 钝化层位于第二金属层和第三金属层之间。 在一些实施方案中，第二金属层位于钝化层和一组焊球之间。