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    THERMAL SIMULATIONS USING CONVOLUTION AND ITERATIVE METHODS
    11.
    发明申请
    THERMAL SIMULATIONS USING CONVOLUTION AND ITERATIVE METHODS 审中-公开
    使用变换和迭代方法的热模拟

    公开(公告)号：US20160092616A1

    公开(公告)日：2016-03-31

    申请号：US14502752

    申请日：2014-09-30

    Applicant: QUALCOMM Incorporated

    Inventor： Ryan Michael Coutts ,  Arpit Mittal ,  Rajat Mittal ,  Mohamed Waleed Allam ,  Mehdi Saeidi

    IPC: G06F17/50 ,  G06F17/15

    CPC classification number: G06F17/5009 ,  G06F17/15 ,  G06F17/5068 ,  G06F2217/78 ,  G06F2217/80

    Abstract: Systems and methods for performing thermal simulations of a system are disclosed herein in. In one embodiment, a computer-implemented method for thermal simulation comprises determining a leakage power profile for a circuit in the system, adding the leakage power profile to a dynamic power profile of the circuit to obtain a combined power profile, and convolving the combined power profile with an impulse response to obtain a thermal response at a location on the system.

    Abstract translation: 用于执行系统的热仿真的系统和方法在本文中公开。在一个实施例中，用于热仿真的计算机实现的方法包括确定系统中的电路的泄漏功率分布，将泄漏功率分布添加到动态功率分布 以获得组合的功率曲线，以及将组合的功率曲线与脉冲响应进行卷积以在系统上的位置处获得热响应。

    THERMAL METAL GROUND FOR INTEGRATED CIRCUIT RESISTORS
    12.
    发明申请
    THERMAL METAL GROUND FOR INTEGRATED CIRCUIT RESISTORS 有权
    用于集成电路电阻的热金属接地

    公开(公告)号：US20150237709A1

    公开(公告)日：2015-08-20

    申请号：US14181187

    申请日：2014-02-14

    Applicant: QUALCOMM Incorporated

    Inventor： Arpit Mittal ,  Alvin Leng Sun Loke ,  Mehdi Saeidi ,  Patrick Drennan

    IPC: H05K1/02 ,  H01C1/01 ,  H01C1/08

    CPC classification number: H05K1/0204 ,  H01C1/01 ,  H01C1/08 ,  H01C1/084 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/5228 ,  H01L28/20 ,  H01L28/24 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit.

    Abstract translation: 金属热源用于散热集成电路电阻。 可以使用线路层的前端，例如氮化钛层来形成电阻器。 金属区域（例如，在第一金属层中）位于电阻器上方以形成散热器。 连接到金属区域的热柱的区域也位于电阻器上方。 金属区域可以连接到集成电路的基板，以提供出集成电路外的低阻抗热路径。

    HUMAN-BODY-GESTURE-BASED REGION AND VOLUME SELECTION FOR HMD
    13.
    发明申请
    HUMAN-BODY-GESTURE-BASED REGION AND VOLUME SELECTION FOR HMD 审中-公开

    公开(公告)号：US20190025909A1

    公开(公告)日：2019-01-24

    申请号：US16141915

    申请日：2018-09-25

    Applicant: QUALCOMM Incorporated

    Inventor： Arpit Mittal ,  Giuliano Maciocci ,  Michael Tunmer ,  Paul Mabbutt

    IPC: G06F3/01 ,  G02B27/01 ,  G06F3/03 ,  G06F3/0484 ,  G02B27/00 ,  G06T19/00

    Abstract: Methods, systems, computer-readable media, and apparatuses for selecting an Augmented Reality (AR) object on a head mounted device (HMD) are presented. In some embodiments, an HMD may define a Region-of-Interest (ROI) based on a gesture formed by at least one hand of a user. Subsequently the HMD may display to the user a shape on the HMD. In at least one arrangement, the shape outlines the ROI. Additionally, the HMD may display to the user a plurality of AR objects, each of the plurality of AR objects being associated with a target inside the ROI. Furthermore, the HMD may reduce the size of the ROI based on a first movement of the at least one hand of the user to form a reduced-sized ROI. In at least one arrangement, the reduced-sized ROI is used to select a specific AR object from the plurality of AR objects.

    ACCURATE HOTSPOT DETECTION THROUGH TEMPERATURE SENSORS
    16.
    发明申请
    ACCURATE HOTSPOT DETECTION THROUGH TEMPERATURE SENSORS 有权

    公开(公告)号：US20170168514A1

    公开(公告)日：2017-06-15

    申请号：US14963790

    申请日：2015-12-09

    Applicant: QUALCOMM Incorporated

    Inventor： Rajat Mittal ,  Mehdi Saeidi ,  Arpit Mittal ,  Emil Rahim

    IPC: G05F1/46 ,  G01K13/00

    CPC classification number: G05F1/463 ,  G01K13/00 ,  G06F1/206 ,  G06F1/3206

    Abstract: In one embodiment, a temperature management system comprises a plurality of temperature sensors on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the temperature sensors, to determine a plurality of power values based on the temperature readings, to determine a plurality of temperature values based on the determined power values, the determined temperature values corresponding to a plurality of different locations on the chip, and to estimate a temperature of a hotspot on the chip based on the determined temperature values.

    THERMAL MANAGEMENT OF ELECTRONIC HEADSETS
    19.
    发明申请
    THERMAL MANAGEMENT OF ELECTRONIC HEADSETS 审中-公开
    电子耳机的热管理

    公开(公告)号：US20170060177A1

    公开(公告)日：2017-03-02

    申请号：US14843973

    申请日：2015-09-02

    Applicant: QUALCOMM Incorporated

    Inventor： Emil RAHIM ,  Mehdi Saeidi ,  Arpit Mittal ,  Rajat Mittal

    IPC: G06F1/16 ,  G06F1/20 ,  H05K7/20 ,  G02B27/01

    CPC classification number: G06F1/163 ,  G02B27/0176 ,  G06F1/203 ,  G06F3/011 ,  H05K7/20127 ,  H05K7/20509

    Abstract: Systems and methods relate to thermal management of electronic headsets, such as virtual reality headsets. An electronic headset includes a body which can hold a processing system. A heat spreader is attached to the body, wherein the heat spreader includes a chimney. The chimney is designed to dissipate heat generated by the processing system. The heat spreader can be controlled to extend the chimney based on the heat perceived on external surfaces of the electronic headset which can come in contact with a user's skin. The chimney includes an air gap and provides a passive cooling system.

    Abstract translation: 系统和方法涉及电子耳机的热管理，例如虚拟现实耳机。 电子耳机包括可容纳处理系统的主体。 散热器附接到身体，其中散热器包括烟囱。 烟囱旨在消散处理系统产生的热量。 可以根据能够与用户皮肤接触的电子耳机的外表面感觉到的热量来控制散热器来扩展烟囱。 烟囱包括气隙，并提供被动冷却系统。

    TRANSLATION AND SCALE INVARIANT FEATURES FOR GESTURE RECOGNITION
    20.
    发明申请
    TRANSLATION AND SCALE INVARIANT FEATURES FOR GESTURE RECOGNITION 有权
    翻译和规模不确定性的功能识别

    公开(公告)号：US20150077322A1

    公开(公告)日：2015-03-19

    申请号：US14026973

    申请日：2013-09-13

    Applicant: QUALCOMM Incorporated

    Inventor： Arpit Mittal

    IPC: G06F3/01

    CPC classification number: G06F3/017 ,  G06F3/005 ,  G06K9/00355

    Abstract: Methods and apparatuses of the present disclosure are presented for recognizing a gesture of a gesture object in a plurality of recorded data objects, with the recorded data objects being recorded over time. In some embodiments, a method includes computing at least one set of gesture angles using the plurality of recorded data objects, wherein each of the gesture angles in the at least one set comprises an angle measurement between two positions of the gesture object, the two positions recorded in successive data objects in the plurality of recorded data objects, and recognizing the gesture based on the at least one set of gesture angles. In some embodiments, the method includes recognizing the gesture is based further on comparing the at least one set of gesture angles to a gesture model.

    Abstract translation: 呈现本公开的方法和装置用于在多个记录数据对象中识别手势对象的手势，随着时间的推移记录所记录的数据对象。 在一些实施例中，一种方法包括使用所述多个记录的数据对象来计算至少一组手势角度，其中所述至少一个组中的每个所述手势角度包括所述手势对象的两个位置之间的角度测量， 记录在所述多个记录数据对象中的连续数据对象中，以及基于所述至少一组姿势角识别所述手势。 在一些实施例中，该方法包括识别手势进一步基于将至少一组手势角度与手势模型进行比较。

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