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公开(公告)号:US20200270411A1
公开(公告)日:2020-08-27
申请号:US16649920
申请日:2018-09-28
Inventor: Yuki KITAI , Mikio SATO , Yasunori HOSHINO , Masashi KODA , Takayoshi OZEKI , Hiroaki FUJIWARA
Abstract: A prepreg includes a resin composition or a semi-cured product of the resin composition, and a glass cloth, wherein the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, a content of the modified polyphenylene ether compound is 40 to 90 mass % with respect to a total mass of the modified polyphenylene ether compound and the crosslinkable curing agent, a cured product of the resin composition has a relative permittivity of 2.6 to 3.8, the glass cloth has a relative permittivity of 4.7 or less and a dielectric loss tangent of 0.0033 or less, and a cured product of the prepreg has a relative permittivity of 2.7 to 3.8 and a dielectric loss tangent of 0.002 or less.
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12.
公开(公告)号:US20230257578A1
公开(公告)日:2023-08-17
申请号:US18015864
申请日:2021-07-13
Inventor: Mikio SATO , Yuki KITAI , Yasunori HOSHINO
CPC classification number: C08L71/123 , C08K3/38 , C08J5/244 , H05K1/0366 , C08K2003/385 , C08J2371/12 , C08J2453/02
Abstract: A resin composition includes: a polyphenylene ether compound; a curing agent reactable with the polyphenylene ether compound; and an inorganic filler including a boron nitride filler, wherein a particle size distribution of the inorganic filler, which is measured by a laser diffraction-based particle size distribution measuring method, has at least two peaks in a particle diameter range of 0.8 to 30.0 μm, the peaks including at least one peak in a particle diameter range of 0.8 to 5.0 μm and at least one peak in a particle diameter range of 5.0 to 30.0 μm.
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公开(公告)号:US20220389189A1
公开(公告)日:2022-12-08
申请号:US17763105
申请日:2020-09-03
Inventor: Mikio SATO , Yuki KITAI , Yasunori HOSHINO
Abstract: An aspect of the present invention is a resin composition, which contains a polyphenylene ether compound, a curing agent, boron nitride, and an inorganic filler other than the boron nitride, in which the content of boron nitride is 15 to 70 parts by volume with respect to 100 parts by volume of the sum of the polyphenylene ether compound and the curing agent.
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公开(公告)号:US20220275122A1
公开(公告)日:2022-09-01
申请号:US17632038
申请日:2020-07-30
Inventor: Masashi KODA , Yuki KITAI , Atsushi WADA , Yasunori HOSHINO
IPC: C08F212/08 , C08L25/10 , C08K3/36 , C08J5/24 , C08J5/18 , H05K1/03 , B32B5/02 , B32B5/26 , B32B15/20 , B32B15/14
Abstract: A resin composition is provided containing a polymer having a structural unit represented by the following Formula (1) in the molecule, and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less. In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
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15.
公开(公告)号:US20220220272A1
公开(公告)日:2022-07-14
申请号:US17609695
申请日:2020-05-14
Inventor: Yuki KITAI , Masashi KODA , Yasunori HOSHINO , Atsushi WADA , Mikio SATO
Abstract: A copper clad laminate includes: an insulating layer containing a cured product of a resin composition; and a surface treated copper foil on one surface or both surfaces of the insulating layer, the resin composition containing a polymer, and the surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of a copper foil, the finely roughened particle treatment layer being formed of fine copper particles having a particle size of 40 to 200 nm, a heat resistance treatment layer containing nickel provided on the finely roughened particle treatment layer, a rust prevention treatment layer containing at least chromium provided on the heat resistance treatment layer, a silane coupling agent layer provided on the rust prevention treatment layer, and an amount of nickel attached in the heat resistance treatment layer being 30 to 60 mg/m2.
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公开(公告)号:US20210246251A1
公开(公告)日:2021-08-12
申请号:US17050671
申请日:2019-04-22
Inventor: Mikio SATO , Hiroaki FUJIWARA , Yuki KITAI , Masashi KODA , Yasunori HOSHINO , Takayoshi OZEKI
IPC: C08F290/06 , C08J5/24 , B32B15/08 , B32B27/28 , H05K1/03
Abstract: A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.
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公开(公告)号:US20200247972A1
公开(公告)日:2020-08-06
申请号:US16650664
申请日:2018-09-28
Inventor: Mikio SATO , Hiroaki FUJIWARA , Yuki KITAI , Masashi KODA , Yasunori HOSHINO
Abstract: One aspect of the present invention is a prepreg including a resin composition or a semi-cured product of the resin composition and a fibrous base material, in which the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, the fibrous base material is quartz glass cloth, the prepreg contains a silane coupling agent having an unsaturated carbon-carbon double bond in a molecule, in an amount of 0.01% by mass or more and less than 3% by mass with respect to the prepreg, and a cured product of the prepreg has a dielectric loss tangent of 0.002 or less at 10 GHz.
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