公开(公告)号：US20220039286A1

公开(公告)日：2022-02-03

申请号：US17367279

申请日：2021-07-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： RYOU KUWABARA ,  MOTONORI SHIMAMURA ,  NAOMI NISHIKI ,  MASATO MORI

IPC: H05K7/20 ,  F28F21/02

Abstract: A heat sink includes a graphite plate, two base materials each of which is disposed adjacent to the graphite plate, and a fixing member, in which the graphite plate has a strip shape and includes a fin portion and a base portion provided at one end of the fin portion, the base material includes a hole into which the fixing member can be inserted, the fixing member is inserted into the holes of the two base materials so that the two base materials are disposed to be adjacent to both sides of the base portion in a thickness direction, the base portion is in close contact with the base material adjacent to each other on both sides of the base portion in the thickness direction, the adjacent base materials are crimped and fixed by the fixing member in a state of being in close contact with each other, and in a case where a surface roughness of the fin portion is defined as Ra1, a surface roughness of the base material is defined as Ra2, and a surface roughness of the base portion is defined as Ra3, a relationship of Ra1>Ra2≥Ra3 is satisfied.

公开(公告)号：US20170040184A1

公开(公告)日：2017-02-09

申请号：US15212158

申请日：2016-07-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIROHISA HINO ,  YASUHIRO SUZUKI ,  MASATO MORI ,  NAOMICHI OHASHI

IPC: H01L21/48 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L21/4853 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2021/60007 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/15311

Abstract: A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.

Abstract translation: 一种安装结构，包括：具有第一凸起的第一部件; 具有第二凸起的第二部件; 具有主安装面和副安装面的安装部件; 连接主安装表面上的电极和第一凸起的第一焊料; 连接所述辅助安装表面上的电极和所述第二凸起的第二焊料; 以及覆盖所述第一焊料的一部分且不与所述主安装面接触的增强树脂。

公开(公告)号：US20150144388A1

公开(公告)日：2015-05-28

申请号：US14551007

申请日：2014-11-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： AKIO FURUSAWA ,  KIYOHIRO HINE ,  MASATO MORI ,  TAICHI NAKAMURA

IPC: H05K1/09 ,  B23K35/26 ,  H05K3/34 ,  H05K1/11 ,  H05K1/18

CPC classification number: B23K35/262 ,  B23K35/0222 ,  B23K35/26 ,  B23K35/40 ,  C22C13/00 ,  H05K1/11 ,  H05K1/111 ,  H05K1/18 ,  H05K3/244 ,  H05K3/3463 ,  H05K2201/0338 ,  H05K2201/10909

Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0≦[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0

Abstract translation: 用于包含含有含有Ni的Au电极的Au电极的焊接中使用的焊料包括满足0.3＆nlE的Ag; [Ag]＆nlE; 4.0，满足0＆nlE的Bi; [Bi]＆nlE; 1.0，满足0＆nlE的Cu; [Cu] 其中焊料中Ag，Bi，Cu和In的含量（质量％）分别由[Ag]，[Bi]，[Cu]和[In]表示。 当[Cu]在0 <[Cu] <0.5的范围内时，焊料材料包括In的范围为6.0＆nlE; [In]＆nlE; 6.8; In为5.2+（6-（1.55×[Cu 当Cu [Cu]在[Cu]的范围内时，[Cu]和nlE; 1.0，In的范围为5.2＆nlE; [In]＆nlE; 6.8当[Cu] 落在1.0 <[Cu]和nlE的范围内。 余量仅包括不少于87质量％的Sn。