公开(公告)号：US12125771B2

公开(公告)日：2024-10-22

申请号：US17643193

申请日：2021-12-08

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Chanon Suwankasab ,  Amornthep Saiyajitara ,  Verapath Vareesantichai

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49503 ,  H01L23/3107 ,  H01L23/49593 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/73265 ,  H01L2224/83385

Abstract: A semiconductor package comprises a leadframe, a component module, and a semiconductor die. The leadframe has a plurality of insertion terminals, a split die pad, and one or more leads. The component module has one or more passive components mounted on a substrate. The semiconductor die has an integrated circuit. The component module is mounted on a split die pad at a first surface of the leadframe and forms an electrical connection with the insertion terminals. Further, the semiconductor die is mounted on the split die pad at a second surface of the leadframe which is opposite to the first surface.

公开(公告)号：US11637024B2

公开(公告)日：2023-04-25

申请号：US17072569

申请日：2020-10-16

Applicant: NXP B.V.

Inventor： Wiwat Tanwongwan ,  Amornthep Saiyajitara ,  Nathapop Lappanitpullpol

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  G06K19/077 ,  H01L23/498 ,  H01L21/48

Abstract: A lead frame used to assemble a semiconductor device, such as a smart card, has a first major surface including exposed leads and a second major surface including a die receiving area and one or more connection pads surrounding the die receiving area. The connection pads enable electrical connection of an Integrated Circuit (IC) die to the exposed leads. A molding tape sized and shaped like the lead frame is adhered to and covers the second major surface of the lead frame. The molding tape has a die receiving area cut-out that exposes the die receiving area and the connection pads on the second major surface of the lead frame and forms a cavity for receiving an encapsulant. The cut-out has an elevated sidewall for retaining the encapsulant within the cavity.

公开(公告)号：US11049817B2

公开(公告)日：2021-06-29

申请号：US16283853

申请日：2019-02-25

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Amornthep Saiyajitara ,  Chanon Suwankasab ,  Russell Joseph Lynch

IPC: H01L23/552 ,  H01L23/06 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/49 ,  H01L23/528

Abstract: A shielded semiconductor device has a first die attached to a die pad of a lead frame and a second die attached to a surface of the first die. The first die is electrically connected to inner lead ends of leads that surround the die pad, and the second die is electrically connected to the first die and to an inner end of a shielding lead. A mold compound forms a body around the first and second dies and the electrical connections. Outer lead ends of the leads project from the sides of the body. The outer end of the shielding lead projects from a central location of one side of the body and is bent up the side surface from which it projects and over the top of the body and provides EMI shielding.

公开(公告)号：US10790220B2

公开(公告)日：2020-09-29

申请号：US16164776

申请日：2018-10-18

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Stephen Ryan Hooper ,  Chanon Suwankasab ,  Amornthep Saiyajitara ,  Bernd Offermann ,  James Lee Grothe ,  Russell Joseph Lynch

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01R12/58

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.

公开(公告)号：US10763203B1

公开(公告)日：2020-09-01

申请号：US16270607

申请日：2019-02-08

Applicant: NXP B.V.

Inventor： Amornthep Saiyajitara ,  Wiwat Tanwongwan ,  Nathapop Lappanitpullpol

IPC: H01L23/498 ,  H01L23/00

Abstract: A lead frame for assembling a smart card is formed with a substrate having first and second opposing major surfaces. A die receiving area is formed in the first major surface of the substrate and surrounded by conductive vias. A conductive coating is formed on the second major surface of the substrate and patterned to form electrical contact pads over the conductive vias. A conductive trace is formed on the first major surface of the substrate. The conductive trace extends between at least two adjacent vias and partially surrounds the at least two adjacent conductive vias, thereby forming a gap in the portion of the trace that surrounds the vias. An electrical connection between an integrated circuit chip and the conductive via extends over the gap. The gap prevents the electrical connection from inadvertently contacting the conductive trace.

公开(公告)号：US10340211B1

公开(公告)日：2019-07-02

申请号：US15922873

申请日：2018-03-15

Applicant: NXP B.V.

Inventor： Chanon Suwankasab ,  Amornthep Saiyajitara ,  Chayathorn Saklang ,  Stephen Ryan Hooper

IPC: H01L23/495 ,  H01L21/56 ,  G01P1/02 ,  H01L25/16 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L23/02 ,  H01L21/52 ,  G01P15/00

Abstract: A sensor module, such as an acceleration sensor module, includes a leaded socket assembly covered by a housing. The leaded socket assembly includes a dual gauge lead frame, a sensor die, and various passive devices. The sensor die and the passive devices are mounted on the lead frame, and then the lead frame, sensor die, and passive devices are over-molded to form the leaded socket assembly. Neither the sensor module nor the socket assembly includes a printed circuit board, so many conventional sensor module assembly steps are bypassed.