公开(公告)号：US11101069B2

公开(公告)日：2021-08-24

申请号：US16594167

申请日：2019-10-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Togo Matsui

IPC: H01G4/008 ,  H01G4/30 ,  H01G4/232

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.

公开(公告)号：US10861647B2

公开(公告)日：2020-12-08

申请号：US15902188

申请日：2018-02-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuya Takagi ,  Akira Fujita ,  Hideaki Tanaka ,  Togo Matsui

IPC: H01G4/012 ,  H01G4/30 ,  H01G4/224 ,  H01G4/12 ,  H01G4/248 ,  H01G4/232

Abstract: A method for manufacturing a monolithic ceramic electronic component includes preparing a mother block including ceramic green sheets stacked on each other, and an internal electrode pattern arranged along interfaces between the ceramic green sheets, cutting the mother block along first and second cutting lines that are perpendicular or substantially perpendicular to each other to obtain green chips each having a laminated structure including ceramic layers and internal electrodes in a raw state, the internal electrodes being exposed on a cut side surface produced by cutting along the first cutting line, forming a raw ceramic protective layer on the cut side surface to obtain a raw component body, and firing the raw component body, wherein the cut side surface is treated with a degreasing agent.

公开(公告)号：US09240333B2

公开(公告)日：2016-01-19

申请号：US14454869

申请日：2014-08-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Togo Matsui ,  Minoru Dooka ,  Hiroyoshi Takashima ,  Kenichi Okajima

IPC: C03B29/00 ,  B44C1/165 ,  B44C1/17 ,  H01L21/64 ,  C04B37/00 ,  H01G4/06 ,  B32B38/04 ,  B32B37/02 ,  B32B37/12 ,  B32B37/16 ,  B26D1/04 ,  H01G4/12 ,  H01G13/00 ,  H05K3/00 ,  B32B37/10 ,  B32B37/00 ,  C04B35/00 ,  C04B35/468 ,  H01G4/30 ,  B32B38/00

CPC classification number: H01L21/64 ,  B26D1/04 ,  B32B37/00 ,  B32B37/02 ,  B32B37/10 ,  B32B37/12 ,  B32B37/16 ,  B32B38/0004 ,  B32B38/04 ,  B32B2038/042 ,  C04B35/00 ,  C04B35/468 ,  C04B37/00 ,  C04B37/006 ,  C04B2237/12 ,  C04B2237/32 ,  H01G4/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/308 ,  H01G13/00 ,  H05K3/0058 ,  Y10T156/1052 ,  Y10T156/1348

Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.