公开(公告)号：US20180190184A1

公开(公告)日：2018-07-05

申请号：US15814253

申请日：2017-11-15

申请人： LUMENS CO., LTD.

发明人： Jinmo KIM ,  Keunoh KIM ,  Junhyung LIM ,  Huikyeong NOH ,  Seongbok YOON ,  Jinwon CHOI ,  Jimin HER ,  Younghwan SHIN ,  Kyujin LEE ,  Sol HAN

IPC分类号： G09G3/32 ,  H01L27/32

CPC分类号： G09G3/32 ,  G09G2300/0452 ,  G09G2300/06 ,  G09G2310/0264 ,  H01L25/0753 ,  H01L27/3241

摘要： An LED display module is disclosed. The LED display module includes a substrate; a plurality of multi-pixel packages arrayed in a matrix with rows and columns, respectively, each of the multi-pixel packages including a package substrate and two or more pixels located on the package substrate and each of the pixels including a red LED chip, a green LED chip, and a blue LED chip; and a driver IC adapted to independently control the pixels of the multi-pixel packages. Anode terminals of the LED chips in the pixels adjacent in the row direction are connected in common to one another such that the pixels are scanned in rows in response to scan signals.

公开(公告)号：US20180182743A1

公开(公告)日：2018-06-28

申请号：US15905556

申请日：2018-02-26

申请人： LUMENS CO., LTD.

发明人： Taekyung YOO ,  Daewon KIM ,  Jinmo KIM ,  Jinwon CHOI ,  Jimin HER ,  Younghwan SHIN ,  Sol HAN ,  Kyujin LEE

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L23/00 ,  H01L33/00 ,  H01L21/683

CPC分类号： H01L25/0753 ,  H01L21/67144 ,  H01L21/677 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/08 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/60 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2221/68395 ,  H01L2224/1403 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/95001 ,  H01L2224/9511 ,  H01L2224/95115 ,  H01L2224/95136 ,  H01L2924/12041 ,  H01L2933/0066

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

公开(公告)号：US20180145056A1

公开(公告)日：2018-05-24

申请号：US15558192

申请日：2017-08-01

申请人： LUMENS CO., LTD.

发明人： Taekyoung YOO ,  Daewon KIM ,  Jinmo KIM ,  Jinwon CHOI ,  Jimin HER ,  Younghwan SHIN ,  Sol HAN ,  Kyujin LEE

IPC分类号： H01L25/075 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L33/62 ,  H01L33/00

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.