公开(公告)号：US20190156734A1

公开(公告)日：2019-05-23

申请号：US16239512

申请日：2019-01-03

申请人： LUMENS CO., LTD.

发明人： Jinmo KIM ,  Keunoh KIM ,  Junhyung LIM ,  Huikyeong NOH ,  Seongbok YOON ,  Jinwon CHOI ,  Jimin HER ,  Younghwan SHIN ,  Kyujin LEE ,  Sol HAN

IPC分类号： G09G3/32 ,  H01L27/32 ,  H01L25/075

摘要： An LED display module is disclosed. The LED display module includes a substrate; a plurality of multi-pixel packages arrayed in a matrix with rows and columns, respectively, each of the multi-pixel packages including a package substrate and two or more pixels located on the package substrate and each of the pixels including a red LED chip, a green LED chip, and a blue LED chip; and a driver IC adapted to independently control the pixels of the multi-pixel packages. Anode terminals of the LED chips in the pixels adjacent in the row direction are connected in common to one another such that the pixels are scanned in rows in response to scan signals.

公开(公告)号：US20210265328A1

公开(公告)日：2021-08-26

申请号：US17254250

申请日：2019-06-17

申请人： LUMENS CO., LTD.

发明人： Jeongwoo LEE ,  Junhyung LIM ,  Hyunpyo HONG ,  Jihye CHANG ,  Bogyun KIM ,  Youngkyo RO ,  Gunha KIM ,  Jugyeong MUN

IPC分类号： H01L25/13 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L23/538

摘要： A flexible surface lighting device is disclosed. The flexible surface lighting device includes: a flexible substrate including an upper insulating film, a lower insulating film, and a thin metal layer interposed between the upper and lower insulating films; a plurality of micro-LED chips two-dimensionally arrayed on the top surface of the flexible substrate; and a flexible light-transmitting resin part disposed on the top surface of the flexible substrate to cover the top and side surfaces of the micro-LED chips. The flexible substrate includes a white reflective layer in contact with the light-transmitting resin part on the upper insulating film.

公开(公告)号：US20180190184A1

公开(公告)日：2018-07-05

申请号：US15814253

申请日：2017-11-15

申请人： LUMENS CO., LTD.

发明人： Jinmo KIM ,  Keunoh KIM ,  Junhyung LIM ,  Huikyeong NOH ,  Seongbok YOON ,  Jinwon CHOI ,  Jimin HER ,  Younghwan SHIN ,  Kyujin LEE ,  Sol HAN

IPC分类号： G09G3/32 ,  H01L27/32

CPC分类号： G09G3/32 ,  G09G2300/0452 ,  G09G2300/06 ,  G09G2310/0264 ,  H01L25/0753 ,  H01L27/3241

摘要： An LED display module is disclosed. The LED display module includes a substrate; a plurality of multi-pixel packages arrayed in a matrix with rows and columns, respectively, each of the multi-pixel packages including a package substrate and two or more pixels located on the package substrate and each of the pixels including a red LED chip, a green LED chip, and a blue LED chip; and a driver IC adapted to independently control the pixels of the multi-pixel packages. Anode terminals of the LED chips in the pixels adjacent in the row direction are connected in common to one another such that the pixels are scanned in rows in response to scan signals.