公开(公告)号：US5788304A

公开(公告)日：1998-08-04

申请号：US649224

申请日：1996-05-17

Applicant: David Korn ,  Keith Smith

Inventor： David Korn ,  Keith Smith

IPC: H01L21/673 ,  B65D85/86

CPC classification number: H01L21/67316

Abstract: A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.

公开(公告)号：US5286122A

公开(公告)日：1994-02-15

申请号：US66876

申请日：1993-05-25

Applicant: Gregory M. Jung ,  Keith Smith

Inventor： Gregory M. Jung ,  Keith Smith

IPC: B41J32/00 ,  B41J35/28

CPC classification number: B41J35/28 ,  B41J32/00

Abstract: A ribbon cartridge for a printer is provided with a take-up arm that is thin enough to fit into an extremely tight space of the printer, and has a support stub which supports the lower edge of the ribbon, an upper guide finger which guides the upper edge of the ribbon, and a lower guide finger which guides the lower edge of the ribbon.

Abstract translation: 一种用于打印机的色带盒设置有一个足够薄的拾取臂，该拾取臂足够装配到打印机的非常紧密的空间中，并且具有支撑着色带的下边缘的支撑柱，上引导件 带的上边缘和引导带的下边缘的下引导指。

公开(公告)号：US08874850B1

公开(公告)日：2014-10-28

申请号：US13468798

申请日：2012-05-10

Applicant: Garth Goodson ,  Minglong Shao ,  Keith Smith

Inventor： Garth Goodson ,  Minglong Shao ,  Keith Smith

IPC: G06F12/00

CPC classification number: G06F12/123 ,  G06F11/1076 ,  G06F12/0875 ,  G06F12/0893 ,  G06F12/0895 ,  G06F2212/1016 ,  G06F2212/1044 ,  G06F2212/461 ,  G06F2212/465

Abstract: A hierarchically tagged cache provides abstraction between access requests for data and the cached data. The cache is managed by hierarchical layers of indexes including reference to the data. Access requests indicate a header for the requested data, which is associated with one of the layers. Cache management determines what layer is associated with the header, and can traverse the indexes, beginning at the layer associated with the header, to access the data. If the header does not exist at the index of that layer, it can be created. Indexes can be appropriately updated with indexes at each layer being referenced by one or more indexes of the layer higher up in the hierarchy.

Abstract translation: 分层标记的缓存提供了对数据访问请求和缓存数据之间的抽象。 缓存由包括引用数据的索引的分级层管理。 访问请求指示与所述层之一相关联的所请求数据的头。 缓存管理确定与报头相关联的层，并且可以从与报头相关联的层开始遍历索引以访问数据。 如果标题不存在于该层的索引处，则可以创建它。 可以使用层次结构中较高层的一个或多个索引引用的每个层上的索引适当更新索引。

公开(公告)号：US07621400B2

公开(公告)日：2009-11-24

申请号：US11960082

申请日：2007-12-19

Applicant: Keith Smith ,  James C. Durham ,  Scott D. Greiwe

Inventor： Keith Smith ,  James C. Durham ,  Scott D. Greiwe

IPC: B65D75/26

CPC classification number: B65D73/0092 ,  B65D75/366

Abstract: A display packaging system includes a front panel, a rear panel, and a blister cavity. The blister cavity has a product holding chamber configured to receive at least one product and a sealing flange that extends outwardly from the product holding chamber. The sealing flange includes a series of apertures and is sandwiched between the interior surface of the front panel and the interior surface of the rear panel. Respective portions of an interior surface of the front panel and an interior surface of the rear panel are then adhered only to each other with the respective portions including portions of the interior surface of the front panel and portions of the interior surface of the rear panel that are disposed on opposite sides of the series of apertures.

Abstract translation: 显示包装系统包括前面板，后面板和泡罩腔。 泡罩腔具有被配置为容纳至少一个产品的产品保持室和从产品保持室向外延伸的密封凸缘。 密封凸缘包括一系列孔，并且夹在前面板的内表面和后面板的内表面之间。 前面板的内表面和后面板的内表面的相应部分然后彼此粘合，各部分包括前面板的内表面的部分和后面板的内表面的部分， 设置在一系列孔的相对侧上。

公开(公告)号：US20090159479A1

公开(公告)日：2009-06-25

申请号：US11960082

申请日：2007-12-19

Applicant: Keith Smith ,  James C. Durham ,  Scott D. Greiwe

Inventor： Keith Smith ,  James C. Durham ,  Scott D. Greiwe

IPC: B65D75/36 ,  B65B51/10 ,  B31B1/00

CPC classification number: B65D73/0092 ,  B65D75/366

Abstract: A display packaging system includes a front panel, a rear panel, and a blister cavity. The blister cavity has a product holding chamber configured to receive at least one product and a sealing flange that extends outwardly from the product holding chamber. The sealing flange includes a series of apertures and is sandwiched between the interior surface of the front panel and the interior surface of the rear panel. Respective portions of an interior surface of the front panel and an interior surface of the rear panel are then adhered only to each other with the respective portions including portions of the interior surface of the front panel and portions of the interior surface of the rear panel that are disposed on opposite sides of the series of apertures.

Abstract translation: 显示包装系统包括前面板，后面板和泡罩腔。 泡罩腔具有被配置为容纳至少一个产品的产品保持室和从产品保持室向外延伸的密封凸缘。 密封凸缘包括一系列孔，并且夹在前面板的内表面和后面板的内表面之间。 前面板的内表面和后面板的内表面的相应部分然后彼此粘合，各部分包括前面板的内表面的部分和后面板的内表面的部分， 设置在一系列孔的相对侧上。

公开(公告)号：US20080150064A1

公开(公告)日：2008-06-26

申请号：US12001792

申请日：2007-12-12

Applicant: Michael A. Zimmerman ,  Keith Smith ,  Jacob Shverdin

Inventor： Michael A. Zimmerman ,  Keith Smith ,  Jacob Shverdin

IPC: H01L31/0203 ,  H01L23/495 ,  H01L21/60

CPC classification number: H01L27/14618 ,  H01L23/10 ,  H01L23/3142 ,  H01L23/49861 ,  H01L24/48 ,  H01L27/14683 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4899 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/12569 ,  Y10T428/12618 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.

公开(公告)号：US6092851A

公开(公告)日：2000-07-25

申请号：US440839

申请日：1999-11-15

Applicant: David Korn ,  Keith Smith

Inventor： David Korn ,  Keith Smith

IPC: H01L21/673 ,  B65D85/86

CPC classification number: H01L21/67316

Abstract: A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.

Abstract translation: 用于半导体晶片的运输和存储的晶片载体。 更具体地，本发明是具有刚性结构和耐腐蚀涂层的晶片载体。 晶片载体包括具有通过连接构件连接的多个晶片支架的整体框架。 该框架涂覆有耐受通常用于半导体制造工艺中的腐蚀性材料的材料，例如氟聚合物。

公开(公告)号：US20110064881A1

公开(公告)日：2011-03-17

申请号：US12950528

申请日：2010-11-19

Applicant: Michael A. Zimmerman ,  Keith Smith ,  Jacob Shverdin

Inventor： Michael A. Zimmerman ,  Keith Smith ,  Jacob Shverdin

IPC: B05D3/10

CPC classification number: H01L27/14618 ,  H01L23/10 ,  H01L23/3142 ,  H01L23/49861 ,  H01L24/48 ,  H01L27/14683 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4899 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/12569 ,  Y10T428/12618 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.

Abstract translation: 一种用于图像传感器或其它电子部件的塑料封装件，其包括塑料体，优选地由LCP材料构成，围绕引线框模制并限定其中要设置图像传感器的空腔。 提供一种盖组件，其具有保持在塑料盖框架中的透明玻璃盖，其可焊接或以其他方式粘合到包装的塑料体以封闭安装在腔中的图像传感器。 引线框通常由铜或铜合金或具有铜涂层的铁合金组成。 至少在与塑料体接触的那些部分中，在引线框架的表面上形成界面层，其用于提供引线框架和塑料材料之间的显着改善的粘合性，以实现金属和塑料材料之间的密封。 界面层由形成在引线框架的表面上的氧化亚铜基底层和形成在氧化亚铜层上的氧化铜层构成。 氧化铜外层具有针状结构，其在形成包装时提供用于与模制在其上的塑料材料粘合的互锁机构。

公开(公告)号：US20070282893A1

公开(公告)日：2007-12-06

申请号：US11743103

申请日：2007-05-01

Applicant: Keith Smith ,  Daniel Todd ,  York Baur ,  Todd Sawicki ,  William McGraw ,  Ken Smith

Inventor： Keith Smith ,  Daniel Todd ,  York Baur ,  Todd Sawicki ,  William McGraw ,  Ken Smith

IPC: G06F17/30

CPC classification number: G06Q30/0274 ,  G06F16/44

Abstract: A system for providing digital content and digital advertisements to users provides digital content via the Internet, in combination with time-shifted advertisements that may be presented by an application that resides on the user's computer. The system may operate in a wholly or partially automated manner, providing automated, self-service interfaces for one or more of the following groups: advertisers, content providers, publishers, and users. The system receives digital advertisement data from advertisers, which can include or consist of a link to an advertiser's website. Advertisers provide compensation based on the presentation of their advertisements to users. The system receives digital content from content providers. Content providers receive compensation when users access digital content provided by content providers. Publishers may access digital content from the system and provide the content to users through one or more user interfaces.

Abstract translation: 用于向用户提供数字内容和数字广告的系统通过互联网提供数字内容，结合可能由驻留在用户计算机上的应用呈现的时移广告。 系统可以全部或部分自动化的方式运行，为一个或多个以下组提供自动的自助服务接口：广告商，内容提供商，发布者和用户。 该系统从广告商接收数字广告数据，其可以包括或包括到广告主的网站的链接。 广告商根据其向用户的广告呈现提供赔偿。 系统从内容提供商接收数字内容。 当用户访问内容提供商提供的数字内容时，内容提供商将获得补偿 出版商可以从系统访问数字内容，并通过一个或多个用户界面向用户提供内容。

公开(公告)号：US20050276662A1

公开(公告)日：2005-12-15

申请号：US11028492

申请日：2005-01-03

Applicant: Keith Smith

Inventor： Keith Smith

IPC: B09C1/00 ,  B09C1/06 ,  B09C1/10 ,  C02F1/02 ,  C02F1/20 ,  C02F1/72 ,  C02F3/04 ,  C12S5/00 ,  C12S9/00

CPC classification number: C02F3/046 ,  B09C1/002 ,  B09C1/005 ,  B09C1/06 ,  B09C1/10 ,  B09C2101/00 ,  C02F1/02 ,  C02F1/20 ,  C02F1/727 ,  C02F2103/06 ,  Y02W10/15

Abstract: A system and method for the accelerated decontamination of contaminated soil, vadose zone and/or groundwater is described. Contaminates are removed from soil and from the groundwater via heat injection through trenching or directionally drilled or horizontally drilled and installed delivery plumbing, pure oxygen injection through separate plumbing installed in the same manner as the plumbing used to deliver the heat, bioventing, sparging, and bioremediation, all through the oxygen delivery plumbing, and soil vapor extraction through vertical wells, all contained in one mobile treatment system. Contaminants are separated from the soil gas via filtration or oxidation. Residual contaminants in the vadose zone and/or the in the groundwater are subjected to volatilization by increased temperature via heat injection and/or oxidation via contaminant degrading microorganisms.

Abstract translation: 描述了对污染土壤，渗流区和/或地下水加速净化的系统和方法。 污染物通过开沟或定向钻孔或水平钻孔和安装的输送管道从土壤和地下水中除去，通过单独的管道安装纯氧注入，其方式与用于传递热量，生物净化，喷射和 生物修复，全部通过氧气输送管道和通过垂直井的土壤蒸气提取，均包含在一个移动式处理系统中。 污染物通过过滤或氧化与土壤气体分离。 渗流区和/或地下水中的残留污染物通过经由污染降解微生物的热注射和/或氧化而通过升高的温度进行挥发。