公开(公告)号：US20090065928A1

公开(公告)日：2009-03-12

申请号：US12264774

申请日：2008-11-04

Applicant: Markus Lutz ,  Aaron Partidge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

Inventor： Markus Lutz ,  Aaron Partidge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

IPC: H01L23/12

CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81C2201/112 ,  B82Y30/00 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

Abstract translation: 机械结构设置在室中，其至少一部分由封装结构限定。 第一种方法提供了通道盖，其具有至少部分地设置在防静电通道的上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。 第二种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。 该至少一个部分与机电装置分开制造，然后固定在机电装置上。 第三种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。 所述至少一个部分可以包括线球，螺柱，金属箔或焊料预制件。 一种器件包括衬底，封装结构和机械结构。 抗静电层设置在机械结构的至少一部分上。 在基板和封装结构中的至少一个中形成抗静电通道。 帽至少部分地具有设置在抗静电通道上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。

公开(公告)号：US20060246631A1

公开(公告)日：2006-11-02

申请号：US11115828

申请日：2005-04-27

Applicant: Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

Inventor： Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

IPC: H01L21/44

CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81C2201/112 ,  B82Y30/00 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

公开(公告)号：US07625773B2

公开(公告)日：2009-12-01

申请号：US12264774

申请日：2008-11-04

Applicant: Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

Inventor： Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

IPC: H01L21/00 ,  H01L21/461 ,  H01L27/14 ,  H01L29/84 ,  H01L29/82

CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81C2201/112 ,  B82Y30/00 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

公开(公告)号：US20070013464A1

公开(公告)日：2007-01-18

申请号：US11182299

申请日：2005-07-15

Applicant: Zhiyu Pan ,  Rob Candler ,  Markus Lutz ,  Aaron Partridge ,  Volker Materna ,  Gary Yama ,  Wilhelm Frey

Inventor： Zhiyu Pan ,  Rob Candler ,  Markus Lutz ,  Aaron Partridge ,  Volker Materna ,  Gary Yama ,  Wilhelm Frey

IPC: H03H9/24

CPC classification number: H03H9/505 ,  H03H9/0023 ,  H03H9/02338 ,  H03H9/2468 ,  H03H2009/02496

Abstract: There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to a resonator architecture including a plurality of in-plane vibration microelectromechanical resonators (for example, 2 or 4 resonators) that are mechanically coupled to provide, for example, a differential signal output. In one embodiment, the present invention includes four commonly shaped microelectromechanical tuning fork resonators (for example, tuning fork resonators having two or more rectangular-shaped or square-shaped tines). Each resonator is mechanically coupled to another resonator of the architecture. For example, each resonator of the architecture is mechanically coupled to another one of the resonators on one side or a corner of one of the sides. In this way, all of the resonators, when induced, vibrate at the same frequency.

Abstract translation: 这里描述和示出了许多发明，以及这些发明的许多方面和实施例。 在一个方面，本发明涉及一种包括机械耦合以提供例如差分信号输出的多个平面内振动微机电谐振器（例如，2或4个谐振器）的谐振器结构。 在一个实施例中，本发明包括四个通常形状的微机电音叉谐振器（例如，具有两个或更多个矩形或正方形形状的叉的音叉谐振器）。 每个谐振器机械耦合到该架构的另一谐振器。 例如，该架构的每个谐振器在其中一个侧面的一侧或拐角上机械耦合到另一个谐振器。 以这种方式，所有谐振器在被感应时以相同的频率振动。

公开(公告)号：US07449355B2

公开(公告)日：2008-11-11

申请号：US11115828

申请日：2005-04-27

Applicant: Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

Inventor： Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

IPC: H01L21/00 ,  H01L21/461

CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81C2201/112 ,  B82Y30/00 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

Abstract translation: 机械结构设置在室中，其至少一部分由封装结构限定。 第一种方法提供了通道盖，其具有至少部分地设置在防静电通道的上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。 第二种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。 该至少一个部分与机电装置分开制造，然后固定在机电装置上。 第三种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。 所述至少一个部分可以包括线球，螺柱，金属箔或焊料预制件。 一种器件包括衬底，封装结构和机械结构。 抗静电层设置在机械结构的至少一部分上。 在基板和封装结构中的至少一个中形成抗静电通道。 帽至少部分地具有设置在抗静电通道上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。

公开(公告)号：US09771257B2

公开(公告)日：2017-09-26

申请号：US13213709

申请日：2011-08-19

Applicant: Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

Inventor： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

IPC: H01L29/84 ,  B81C1/00

CPC classification number: B81C1/00293 ,  B81C2203/0136

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that operate in controlled or predetermined mechanical damping environments. In this regard, the present invention encapsulates the mechanical structures within a chamber, prior to final packaging and/or completion of the MEMS. The environment within the chamber containing and/or housing the mechanical structures provides the predetermined, desired and/or selected mechanical damping. The parameters of the encapsulated fluid (for example, the gas pressure) in which the mechanical structures are to operate are controlled, selected and/or designed to provide a desired and/or predetermined operating environment.

公开(公告)号：US20130285162A1

公开(公告)日：2013-10-31

申请号：US13762584

申请日：2013-02-08

Applicant: Markus Lutz ,  Aaron Partridge

Inventor： Markus Lutz ,  Aaron Partridge

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81C1/00269 ,  B81C1/00285 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film encapsulated MEMS, and technique of fabricating or manufacturing a thin film encapsulated MEMS including an integrated getter area and/or an increased chamber volume, which causes little to no increase in overall dimension(s) from the perspective of the mechanical structure and chamber. The integrated getter area is disposed within the chamber and is capable of (i) “capturing” impurities, atoms and/or molecules that are out-gassed from surrounding materials and/or (ii) reducing and/or minimizing the adverse impact of such impurities, atoms and/or molecules (for example, reducing the probability of adding mass to a resonator which would thereby change the resonator's frequency). In this way, the thin film wafer level packaged MEMS of the present invention includes a relatively stable, controlled pressure environment within the chamber to provide, for example, a more stable predetermined, desired and/or selected mechanical damping of the mechanical structure.

Abstract translation: 这里描述和说明了许多发明。 一方面，本发明涉及一种薄膜封装的MEMS，以及制造或制造包括集成吸气剂区域和/或增加的室容积的薄膜封装的MEMS的技术，其几乎不会增加整体尺寸（s ）从机械结构和室的角度。 集成的吸气剂区域设置在室内，并且能够（i）“捕获”从周围材料中排出的杂质，原子和/或分子和/或（ii）减少和/或最小化其中的不利影响 杂质，原子和/或分子（例如，降低增加质量到共振器的概率，从而改变谐振器的频率）。 以这种方式，本发明的薄膜晶片级封装MEMS包括室内相对稳定的受控压力环境，以提供例如机械结构的更稳定的预定，期望和/或选择的机械阻尼。

公开(公告)号：US20110221013A1

公开(公告)日：2011-09-15

申请号：US12952895

申请日：2010-11-23

Applicant: Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

Inventor： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

IPC: H01L29/66 ,  H01L21/02

CPC classification number: B81C1/00261 ,  B81B2207/015 ,  B81C1/00333 ,  B81C2201/0176 ,  B81C2203/0136 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.

Abstract translation: 这里描述和说明了许多发明。 在一个方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。 当沉积时，封装机械结构的材料包括以下属性中的一个或多个：低拉伸应力，良好的阶梯覆盖，在经受后续加工时保持其完整性，不会显着和/或不利地影响 室中的机械结构（如果在沉积期间涂覆材料）和/或促进与高性能集成电路的集成。 在一个实施例中，封装机械结构的材料是例如硅（多晶，无定形或多孔，无论掺杂或未掺杂），碳化硅，硅 - 锗，锗或砷化镓。

公开(公告)号：US20110165718A1

公开(公告)日：2011-07-07

申请号：US13050099

申请日：2011-03-17

Applicant: Markus Lutz ,  Aaron Partridge

Inventor： Markus Lutz ,  Aaron Partridge

IPC: H01L21/56

CPC classification number: B81B7/0038 ,  B81C1/00269 ,  B81C1/00285 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film encapsulated MEMS, and technique of fabricating or manufacturing a thin film encapsulated MEMS including an integrated getter area and/or an increased chamber volume, which causes little to no increase in overall dimension(s) from the perspective of the mechanical structure and chamber. The integrated getter area is disposed within the chamber and is capable of (i) “capturing” impurities, atoms and/or molecules that are out-gassed from surrounding materials and/or (ii) reducing and/or minimizing the adverse impact of such impurities, atoms and/or molecules (for example, reducing the probability of adding mass to a resonator which would thereby change the resonator's frequency). In this way, the thin film wafer level packaged MEMS of the present invention includes a relatively stable, controlled pressure environment within the chamber to provide, for example, a more stable predetermined, desired and/or selected mechanical damping of the mechanical structure.

公开(公告)号：US07777596B2

公开(公告)日：2010-08-17

申请号：US12002936

申请日：2007-12-18

Applicant: Markus Lutz ,  Zhiyu Pan ,  Aaron Partridge

Inventor： Markus Lutz ,  Zhiyu Pan ,  Aaron Partridge

IPC: H03H9/02 ,  H03H9/24

CPC classification number: H03H9/02244 ,  B81B3/007 ,  B81B3/0072 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/0163 ,  H03H3/0076 ,  H03H9/02338 ,  H03H2009/0233 ,  H03H2009/02496 ,  H03H2009/02503

Abstract: A microelectromechanical resonator may include one or more resonator masses that oscillates in a bulk mode and that includes a first plurality of regions each having a density, and a second plurality of regions each having a density, the density of each of the second plurality of regions differing from the density of each of the first plurality of regions. The second plurality of regions may be disposed in a non-uniform arrangement. The oscillation may include a first state in which the resonator mass is contracted, at least in part, in a first and/or a second direction, and expanded, at least in part, in a third and/or a fourth direction, the second direction being opposite the first direction, the fourth direction being opposite the third direction.

Abstract translation: 微机电谐振器可以包括以体模式振荡的一个或多个谐振器质量块，并且其包括每个具有密度的第一多个区域和每个具有密度的第二多个区域，第二多个区域中的每个第二多个区域的密度 不同于第一多个区域中的每一个的密度。 第二多个区域可以以非均匀的布置设置。 振荡可以包括其中谐振器质量至少部分地以第一和/或第二方向收缩并且至少部分地在第三和/或第四方向上膨胀的第一状态，第二状态 方向与第一方向相反，第四方向与第三方向相反。