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公开(公告)号：US20150041841A1
公开(公告)日：2015-02-12
申请号：US14385594
申请日：2013-03-20
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Grigoriy Basin , Stein Kuiper , Paul Scott Martin
CPC classification number: H01L33/0095 , C09K11/02 , C09K11/08 , H01L33/005 , H01L33/501 , H01L33/502 , H01L33/505 , H01L33/58 , H01L2224/16225 , H01L2924/181 , H01L2933/0041 , H05B33/10 , Y10T156/1062 , H01L2924/00012
Abstract: A method for fabricating an LED/phosphor structure is described where an array of blue light emitting diode (LED) dies are mounted on a submount wafer. A phosphor powder is mixed with an organic polymer binder, such as an acrylate or nitrocellulose. The liquid or paste mixture is then deposited over the LED dies or other substrate as a substantially uniform layer. The organic binder is then removed by being burned away in air, or being subject to an O2 plasma process, or dissolved, leaving a porous layer of phosphor grains sintered together. The porous phosphor layer is impregnated with a sol-gel (e.g., a sol-gel of TEOS or MTMS) or liquid glass (e.g., sodium silicate or potassium silicate), also known as water glass, which saturates the porous structure. The structure is then heated to cure the inorganic glass binder, leaving a robust glass binder that resists yellowing, among other desirable properties.
Abstract translation: 描述了一种用于制造LED /磷光体结构的方法，其中蓝色发光二极管（LED）裸片的阵列安装在底座晶片上。 荧光粉与有机聚合物粘合剂如丙烯酸酯或硝化纤维素混合。 然后将液体或糊状混合物沉积在LED管芯或其它基底上，作为基本均匀的层。 然后通过在空气中燃烧或进行O 2等离子体处理或溶解而除去有机粘合剂，留下烧结在一起的多孔磷光体颗粒层。 多孔磷光体层用溶胶 - 凝胶（例如TEOS或MTMS的溶胶 - 凝胶）或饱和多孔结构饱和的液体玻璃（例如硅酸钠或硅酸钾）（也称为水玻璃）浸渍。 然后将该结构加热以固化无机玻璃粘合剂，留下坚固的玻璃粘合剂，其耐受黄变等性能。
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公开(公告)号：US09608016B2
公开(公告)日：2017-03-28
申请号：US14399323
申请日：2013-05-08
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Jipu Lei , Alexander H. Nickel , Stefano Schiaffino , Grigoriy Basin
IPC: H01L33/38 , H01L21/441 , H01L21/782 , H01L21/3205 , H01L27/12 , H01L21/02 , H01L21/027 , H01L21/78 , H01L21/445 , H01L33/00
CPC classification number: H01L27/1266 , H01L21/02697 , H01L21/0273 , H01L21/441 , H01L21/445 , H01L21/7806 , H01L27/1262 , H01L27/1288 , H01L33/0062 , H01L33/0079 , H01L33/0083 , H01L33/0095 , H01L33/38 , H01L33/385 , H01L2933/0016
Abstract: A method according to embodiments of the invention includes providing a wafer comprising a semiconductor structure grown on a growth substrate. The semiconductor structure includes a light emitting layer disposed between an n-type region and a p-type region. The wafer includes trenches defining individual semiconductor devices. The trenches extend through an entire thickness of the semiconductor structure to reveal the growth substrate. The method further includes forming a thick conductive layer on the semiconductor structure. The thick conductive layer is configured to support the semiconductor structure when the growth substrate is removed. The method further includes removing the growth substrate.
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公开(公告)号：US09379293B2
公开(公告)日：2016-06-28
申请号：US14414719
申请日：2013-07-12
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： April Dawn Schricker , Kim Kevin Mai , Grigoriy Basin , Uwe Mackens , Joost Peter Andre Vogels , Aldegonda Lucia Weijers , Karl Adriaan Zijtveld
CPC classification number: H01L33/504 , H01L33/0041 , H01L33/508 , H01L33/60 , H01L33/642 , H01L2933/0041 , H01L2933/0058
Abstract: A ceramic green wavelength conversion element (120) is coated with a red wavelength conversion material (330) and placed above a blue light emitting element (110) such that the ceramic element (120) is attached to the light emitting element (110), thereby providing an efficient thermal coupling from the red and green converters (330, 120) to the light emitting element (110) and its associated heat sink. To protect the red converter coating (330) from the effects of subsequent processes, a sacrificial clear coating (340) is created above the red converter element (330). This clear coating (340) may be provided as a discrete layer of clear material, or it may be produced by allowing the red converters to settle to the bottom of its suspension material, thereby forming a converter-free upper layer that can be subjected to the subsequent fabrication processes.
Abstract translation: 陶瓷绿色波长转换元件（120）用红色波长转换材料（330）涂覆并放置在蓝色发光元件（110）的上方，使得陶瓷元件（120）附着到发光元件（110）上， 从而提供从红色和绿色转换器（330,120）到发光元件（110）及其相关联的散热器的有效的热耦合。 为了保护红色转换器涂层（330）免受后续过程的影响，在红色转换器元件（330）上方产生牺牲透明涂层（340）。 这种透明涂层（340）可以作为透明材料的离散层提供，或者可以通过使红色转换器沉降到其悬浮材料的底部而形成，从而形成可以经受 随后的制造工艺。
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公开(公告)号：US09324926B2
公开(公告)日：2016-04-26
申请号：US14439368
申请日：2013-10-25
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： April Dawn Schricker , Kim Kevin Mai , Grigoriy Basin
IPC: H01L21/00 , H01L33/56 , H01L25/075 , H01L33/50 , H01L27/15 , H01L33/54 , H01L33/60 , H01L33/44 , H01L33/46
CPC classification number: H01L33/56 , H01L25/0753 , H01L27/156 , H01L33/44 , H01L33/46 , H01L33/50 , H01L33/54 , H01L33/60 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
Abstract: A structure according to embodiments of the invention includes a plurality of LEDs attached to a mount. A wavelength converting layer is disposed over the LEDs. A transparent layer is disposed over the wavelength converting layer. Reflective material is disposed between neighboring LEDs.
Abstract translation: 根据本发明的实施例的结构包括附接到安装件的多个LED。 波长转换层设置在LED上。 透明层设置在波长转换层上。 反射材料设置在相邻的LED之间。
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公开(公告)号：US20150280083A1
公开(公告)日：2015-10-01
申请号：US14439368
申请日：2013-10-25
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： April Dawn Schricker , Kim Kevin Mai , Grigoriy Basin
CPC classification number: H01L33/56 , H01L25/0753 , H01L27/156 , H01L33/44 , H01L33/46 , H01L33/50 , H01L33/54 , H01L33/60 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
Abstract: A structure according to embodiments of the invention includes a plurality of LEDs attached to a mount. A wavelength converting layer is disposed over the LEDs. A transparent layer is disposed over the wavelength converting layer. Reflective material is disposed between neighboring LEDs.
Abstract translation: 根据本发明的实施例的结构包括附接到安装件的多个LED。 波长转换层设置在LED上。 透明层设置在波长转换层上。 反射材料设置在相邻的LED之间。
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Patent Agency Ranking
公开(公告)号：US20150188001A1
公开(公告)日：2015-07-02
申请号：US14414719
申请日：2013-07-12
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： April Dawn Schricker , Kim Kevin Mai , Grigoriy Basin , Uwe Mackens , Joost Peter Andre Vogels , Aldegonda Lucia Weijers , Karl Adriaan Zijtveld
IPC: H01L33/50
CPC classification number: H01L33/504 , H01L33/0041 , H01L33/508 , H01L33/60 , H01L33/642 , H01L2933/0041 , H01L2933/0058
Abstract: A ceramic green wavelength conversion element (120) is coated with a red wavelength conversion material (330) and placed above a blue light emitting element (110) such that the ceramic element (120) is attached to the light emitting element (110), thereby providing an efficient thermal coupling from the red and green converters (330, 120) to the light emitting element (110) and its associated heat sink. To protect the red converter coating (330) from the effects of subsequent processes, a sacrificial clear coating (340) is created above the red converter element (330). This clear coating (340) may be provided as a discrete layer of clear material, or it may be produced by allowing the red converters to settle to the bottom of its suspension material, thereby forming a converter-free upper layer that can be subjected to the subsequent fabrication processes.
Abstract translation: 陶瓷绿色波长转换元件（120）用红色波长转换材料（330）涂覆并放置在蓝色发光元件（110）的上方，使得陶瓷元件（120）附着到发光元件（110）上， 从而提供从红色和绿色转换器（330,120）到发光元件（110）及其相关联的散热器的有效的热耦合。 为了保护红色转换器涂层（330）免受后续过程的影响，在红色转换器元件（330）上方产生牺牲透明涂层（340）。 这种透明涂层（340）可以作为透明材料的离散层提供，或者可以通过使红色转换器沉降到其悬浮材料的底部而形成，从而形成可以经受 随后的制造工艺。
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公开(公告)号：US20170301832A1
公开(公告)日：2017-10-19
申请号：US15102986
申请日：2014-12-30
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Grigoriy Basin , Paul Martin , Han Ho Choi
CPC classification number: H01L33/505 , H01L33/0095 , H01L33/58 , H01L33/60 , H01L2933/0041 , H01L2933/0058
Abstract: A multi-stage lamination process is used to laminate a wavelength conversion film (220) to a transparent substrate (230), and subsequently to a light emitting element (110). The wavelength conversion film (220) may be an uncured phosphor-embedded silicone polymer, and the lamination process includes heating the polymer so that it adheres to the transparent substrate (230), but is not fully cured. The phosphor-laminated transparent substrate (230) is sliced/diced and the wavelength conversion film (220) of each diced substrate is placed upon each light emitting element (110). The semi-cured wavelength conversion film (220) is then laminated to the light emitting element (110) via heating, consequently curing the phosphor film. Throughout the process, no glue is used, and the optical losses associated with glue material are not introduced.
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公开(公告)号：US20170133559A1
公开(公告)日：2017-05-11
申请号：US15318143
申请日：2015-06-05
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Grigoriy Basin , Brendan Jude Moran , Hideo Kageyama
CPC classification number: H01L33/505 , H01L33/60 , H01L2224/16225 , H01L2224/97 , H01L2933/0041
Abstract: A lighting structure according to embodiments of the invention includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device. The flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength. The flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.
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公开(公告)号：US20160240735A1
公开(公告)日：2016-08-18
申请号：US14783780
申请日：2014-03-31
Applicant: Koninklijke Philips N.V.
Inventor： Brendan Jude Moran , Marc Andre de Samber , Grigoriy Basin , Norbertus Antonius Maria Sweegers , Mark Melvin Butterworth , Kenneth Vampola , Clarisse Mazuir
IPC: H01L33/20 , H01L33/32 , H01L33/46 , H01L33/00 , H01L33/56 , H01L33/62 , H01L25/075 , H01L33/06 , H01L33/50
CPC classification number: H01L33/20 , H01L25/0753 , H01L33/007 , H01L33/0079 , H01L33/0095 , H01L33/06 , H01L33/32 , H01L33/44 , H01L33/46 , H01L33/465 , H01L33/502 , H01L33/56 , H01L33/62 , H01L2933/0025 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2933/0091
Abstract: Embodiments of the invention include a semiconductor structure including a light emitting layer sandwiched between an n-type region and a p-type region. A growth substrate is attached to the semiconductor structure. The growth substrate has at least one angled sidewall. A reflective layer is disposed on the angled sidewall. A majority of light extracted from the semiconductor structure and the growth substrate is extracted through a first surface of the growth substrate.
Abstract translation: 本发明的实施例包括包含夹在n型区域和p型区域之间的发光层的半导体结构。 生长衬底附着于半导体结构。 生长衬底具有至少一个成角度的侧壁。 反射层设置在成角度的侧壁上。 从半导体结构和生长衬底提取的大部分光通过生长衬底的第一表面提取。
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20.发明授权Chip scale light emitting device with metal pillars in a molding compound formed at wafer level 有权在晶片级形成的模塑料中具有金属柱的芯片级发光器件公开(公告)号：US09406857B2
公开(公告)日：2016-08-02
申请号：US14405532
申请日：2013-06-04
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Jipu Lei , Stefano Schiaffino , Alexander H. Nickel , Mooi Guan Ng , Grigoriy Basin , Salman Akram
CPC classification number: H01L33/62 , H01L24/94 , H01L27/156 , H01L33/54 , H01L2924/181 , H01L2924/351 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: Thick metal pillars are formed upon light emitting dies while the dies are still on their supporting wafer. A molding compound is applied to fill the space between the pillars on each die, and contact pads are formed atop the pillars. The metal pillars provide electrical contact between the contact pads and the electrical contacts of each light emitting die. The metal pillars maybe formed upon an upper metal layer of each die, and this upper metal layer maybe patterned to provide connections to individual elements within the die.
Abstract translation: 在发光模具上形成厚的金属柱，同时模具仍然在其支撑晶片上。 施加模塑料以填充每个模具上的柱之间的空间，并且在柱之上形成接触垫。 金属柱提供接触焊盘和每个发光管芯的电触点之间的电接触。 金属柱可以形成在每个模具的上金属层上，并且该上金属层可以被图案化以提供到管芯内的各个元件的连接。
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