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    System and method for generation of wafer inspection critical areas
    11.
    发明授权
    System and method for generation of wafer inspection critical areas 有权

    公开(公告)号：US10706522B2

    公开(公告)日：2020-07-07

    申请号：US15394545

    申请日：2016-12-29

    Applicant: KLA-Tencor Corporation

    Inventor： Prasanti Uppaluri ,  Rajesh Manepalli ,  Ashok V. Kulkarni ,  Saibal Banerjee ,  John Kirkland

    IPC: G06T7/00 ,  H01L21/66

    Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.

    SHAPE METRIC BASED SCORING OF WAFER LOCATIONS
    12.
    发明申请
    SHAPE METRIC BASED SCORING OF WAFER LOCATIONS 审中-公开

    公开(公告)号：US20190318949A1

    公开(公告)日：2019-10-17

    申请号：US16375851

    申请日：2019-04-04

    Applicant: KLA-Tencor Corporation

    Inventor： Saibal Banerjee ,  Jagdish Chandra Saraswatula

    IPC: H01L21/67 ,  G01N21/95 ,  G01N21/956 ,  G06F17/50 ,  H01J37/22

    Abstract: Methods and systems for shape metric based scoring of wafer locations are provided. One method includes selecting shape based grouping (SBG) rules for at least two locations on a wafer. For one of the wafer locations, the selecting step includes modifying distances between geometric primitives in a design for the wafer with metrology data for the one location and determining metrical complexity (MC) scores for SBG rules associated with the geometric primitives in a field of view centered on the one location based on the distances. The selecting step also includes selecting one of the SBG rules for the one location based on the MC scores. The method also includes sorting the at least two locations on the wafer based on the SBG rule selected for the at least two locations.

    Image based specimen process control
    13.
    发明授权
    Image based specimen process control 有权

    公开(公告)号：US10181185B2

    公开(公告)日：2019-01-15

    申请号：US15402197

    申请日：2017-01-09

    Applicant: KLA-Tencor Corporation

    Inventor： Allen Park ,  Lisheng Gao ,  Ashok Kulkarni ,  Saibal Banerjee ,  Ping Gu ,  Songnian Rong ,  Kris Bhaskar

    IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95

    Abstract: Methods and systems for detecting anomalies in images of a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated of a specimen by an imaging subsystem. The computer subsystem(s) are also configured for determining one or more characteristics of the acquired images. In addition, the computer subsystem(s) are configured for identifying anomalies in the images based on the one or more determined characteristics without applying a defect detection algorithm to the images or the one or more characteristics of the images.

    System and Method for Generation of Wafer Inspection Critical Areas
    15.
    发明申请
    System and Method for Generation of Wafer Inspection Critical Areas 审中-公开

    公开(公告)号：US20180130195A1

    公开(公告)日：2018-05-10

    申请号：US15394545

    申请日：2016-12-29

    Applicant: KLA-Tencor Corporation

    Inventor： Prasanti Uppaluri ,  Rajesh Manepalli ,  Ashok V. Kulkarni ,  Saibal Banerjee ,  John Kirkland

    IPC: G06T7/00

    Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.

    Outlier Detection on Pattern of Interest Image Populations
    19.
    发明申请
    Outlier Detection on Pattern of Interest Image Populations 有权
    兴趣图像人口模式的异常检测

    公开(公告)号：US20160314578A1

    公开(公告)日：2016-10-27

    申请号：US15135465

    申请日：2016-04-21

    Applicant: KLA-Tencor Corporation

    Inventor： Saibal Banerjee ,  Ashok V. Kulkarni

    IPC: G06T7/00

    CPC classification number: G06T7/001 ,  G06T2207/20021 ,  G06T2207/30148

    Abstract: Methods and systems for identifying outliers in multiple instances of a pattern of interest (POI) are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a POI within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for determining a feature of each of the images generated at the multiple instances of the POI. In addition, the computer subsystem(s) are configured for identifying one or more outliers in the multiple instances of the POI based on the determined features.

    Abstract translation: 提供了用于识别感兴趣模式（POI）的多个实例中的异常值的方法和系统。 一个系统包括一个或多个计算机子系统，其配置用于在形成在样本上的模具内的POI的多个实例处获取由成像子系统生成的图像。 多个实例包括位于管芯内非周期位置的两个或多个实例。 计算机子系统还被配置用于确定在POI的多个实例处生成的每个图像的特征。 另外，计算机子系统被配置为基于所确定的特征来识别POI的多个实例中的一个或多个异常值。

    Virtual Inspection Systems with Multiple Modes
    20.
    发明申请
    Virtual Inspection Systems with Multiple Modes 有权
    具有多种模式的虚拟检测系统

    公开(公告)号：US20160025648A1

    公开(公告)日：2016-01-28

    申请号：US14803872

    申请日：2015-07-20

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Saibal Banerjee

    IPC: G01N21/88 ,  H01J37/26 ,  H01J37/22 ,  G01N21/95

    CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N2021/8887 ,  H01J37/222 ,  H01J37/26 ,  H01J37/28 ,  H01J2237/22 ,  H01J2237/221 ,  H01J2237/26 ,  H01J2237/2817

    Abstract: Methods and systems for determining one or more characteristics for defects detected on a specimen are provided. One system includes one or more computer subsystems configured for identifying a first defect that was detected on a specimen by an inspection system with a first mode but was not detected with one or more other modes. The computer subsystem(s) are also configured for acquiring, from the storage medium, one or more images generated with the one or more other modes at a location on the specimen corresponding to the first defect. In addition, the computer subsystem(s) are configured for determining one or more characteristics of the acquired one or more images and determining one or more characteristics of the first defect based on the one or more characteristics of the acquired one or more images.

    Abstract translation: 提供了用于确定在样本上检测到的缺陷的一个或多个特性的方法和系统。 一个系统包括一个或多个计算机子系统，其配置用于通过具有第一模式的检查系统识别在样本上检测到的第一缺陷，但是未用一个或多个其他模式检测到。 计算机子系统还被配置为从存储介质获取在与第一缺陷相对应的样本上的位置处用一个或多个其他模式生成的一个或多个图像。 另外，计算机子系统被配置用于确定所获取的一个或多个图像的一个或多个特性，并且基于所获取的一个或多个图像的一个或多个特性来确定第一缺陷的一个或多个特性。

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