公开(公告)号：US10957608B2

公开(公告)日：2021-03-23

申请号：US15814884

申请日：2017-11-16

Applicant: KLA-Tencor Corporation

Inventor： Arpit Yati ,  Shivam Agarwal ,  Jagdish Saraswatula ,  Andrew Cross

IPC: H01L21/66 ,  H01J37/28 ,  H01L21/67

Abstract: A wafer topography measurement system can be paired with a scanning electron microscope. A topography threshold can be applied to wafer topography data about the wafer, which was obtained with the wafer topography measurement system. A metrology sampling plan can be generated for the wafer. This metrology sampling plan can include locations in the wafer topography data above the topography threshold. The scanning electron microscope can scan the wafer using the metrology sampling plan and identify defects.

公开(公告)号：US20180315670A1

公开(公告)日：2018-11-01

申请号：US15814884

申请日：2017-11-16

Applicant: KLA-Tencor Corporation

Inventor： Arpit Yati ,  Shivam Agarwal ,  Jagdish Saraswatula ,  Andrew Cross

IPC: H01L21/66 ,  H01L21/67 ,  H01J37/28

Abstract: A wafer topography measurement system can be paired with a scanning electron microscope. A topography threshold can be applied to wafer topography data about the wafer, which was obtained with the wafer topography measurement system. A metrology sampling plan can be generated for the wafer. This metrology sampling plan can include locations in the wafer topography data above the topography threshold. The scanning electron microscope can scan the wafer using the metrology sampling plan and identify defects.

公开(公告)号：US09965848B2

公开(公告)日：2018-05-08

申请号：US15355606

申请日：2016-11-18

Applicant: KLA-Tencor Corporation

Inventor： Saibal Banerjee ,  Ashok Kulkarni ,  Jagdish Saraswatula ,  Santosh Bhattacharyya

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/0006 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Shape primitives are used for inspection of a semiconductor wafer or other workpiece. The shape primitives can define local topological and geometric properties of a design. One or more rules are applied to the shape primitives. The rules can indicate presence of a defect or the likelihood of a defect being present. A rule execution engine can search for an occurrence of the shape primitives covered by the at least one rule.

公开(公告)号：US20170186151A1

公开(公告)日：2017-06-29

申请号：US15355606

申请日：2016-11-18

Applicant: KLA-Tencor Corporation

Inventor： Saibal Banerjee ,  Ashok Kulkarni ,  Jagdish Saraswatula ,  Santosh Bhattacharyya

IPC: G06T7/00

CPC classification number: G06T7/0006 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Shape primitives are used for inspection of a semiconductor wafer or other workpiece. The shape primitives can define local topological and geometric properties of a design. One or more rules are applied to the shape primitives. The rules can indicate presence of a defect or the likelihood of a defect being present. A rule execution engine can search for an occurrence of the shape primitives covered by the at least one rule.