公开(公告)号：US10706522B2

公开(公告)日：2020-07-07

申请号：US15394545

申请日：2016-12-29

Applicant: KLA-Tencor Corporation

Inventor： Prasanti Uppaluri ,  Rajesh Manepalli ,  Ashok V. Kulkarni ,  Saibal Banerjee ,  John Kirkland

IPC: G06T7/00 ,  H01L21/66

Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.

公开(公告)号：US20180130195A1

公开(公告)日：2018-05-10

申请号：US15394545

申请日：2016-12-29

Applicant: KLA-Tencor Corporation

Inventor： Prasanti Uppaluri ,  Rajesh Manepalli ,  Ashok V. Kulkarni ,  Saibal Banerjee ,  John Kirkland

IPC: G06T7/00

Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.