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    External laser enabled co-packaged optics architectures
    11.
    发明授权
    External laser enabled co-packaged optics architectures 有权

    公开(公告)号：US11159238B1

    公开(公告)日：2021-10-26

    申请号：US16990348

    申请日：2020-08-11

    Applicant: Juniper Networks, Inc.

    Inventor： Domenico Di Mola ,  Steven B. Alleston ,  Zhen Qu ,  Ryan Holmes ,  Jeffery J. Maki ,  Chul Soo Park ,  Yang Yue ,  Jon J. Anderson

    IPC: H04B10/2581 ,  H01S5/40 ,  G02B6/42 ,  H04B10/60 ,  H04B10/50 ,  H04B10/516 ,  H04B10/40 ,  H04J14/04

    Abstract: A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

    Power efficient and scalable co-packaged optical devices
    15.
    发明授权
    Power efficient and scalable co-packaged optical devices 有权

    公开(公告)号：US11689289B2

    公开(公告)日：2023-06-27

    申请号：US17478095

    申请日：2021-09-17

    Applicant: Juniper Networks, Inc.

    Inventor： Domenico Di Mola ,  Steven B. Alleston ,  Zhen Qu ,  Ryan Holmes

    IPC: H04B10/40 ,  H04L1/00 ,  H04L27/34

    CPC classification number: H04B10/40 ,  H04L1/0041 ,  H04L1/0045 ,  H04L27/34

    Abstract: A co-packaged optical-electrical chip can include an application-specific integrated circuit (ASIC) and a plurality of optical modules, such as optical transceivers. The ASIC and each of the optical modules can exchange electrical signaling via integrated electrical paths. The ASIC can include Ethernet switch, error correction, bit-to-symbol mapping/demapping, and digital signal processing circuits to pre-compensate and post-compensate channel impairments (e.g., inter-channel/intra-channel impairments) in electrical and optical domains. The co-packaged inter-chip interface can be scaled to handle different data rates using spectral efficient signaling formats (e.g., QAM-64, PAM-8) without adding additional data lines to a given design and without significantly increasing the power consumption of the design.

    External laser enabled co-packaged optics architectures
    16.
    发明授权
    External laser enabled co-packaged optics architectures 有权

    公开(公告)号：US11632175B2

    公开(公告)日：2023-04-18

    申请号：US17470650

    申请日：2021-09-09

    Applicant: Juniper Networks, Inc.

    Inventor： Domenico Di Mola ,  Steven B. Alleston ,  Zhen Qu ,  Ryan Holmes ,  Jeffery J. Maki ,  Chul Soo Park ,  Yang Yue ,  Jon J. Anderson

    IPC: H04B10/2581 ,  G02B6/42 ,  H01S5/40 ,  H04B10/40 ,  H04B10/50 ,  H04B10/516 ,  H04B10/60 ,  H04J14/04

    Abstract: A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

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