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公开(公告)号:US20180100967A1
公开(公告)日:2018-04-12
申请号:US15689319
申请日:2017-08-29
Applicant: Juniper Networks, Inc.
Inventor: John Parker , Jared Bauters , Jonathan Edgar Roth , Erik Norberg , Gregory Alan Fish
CPC classification number: G02B6/12019 , G01J9/0246 , G02B6/12004 , H01S3/06754 , H01S5/0078 , H01S5/0085 , H01S5/021 , H01S5/0265 , H01S5/0268 , H01S5/0687 , H04B10/25 , H04B10/572
Abstract: Described are various configurations of integrated wavelength lockers including asymmetric Mach-Zehnder interferometers (AMZIs) and associated detectors. Various embodiments provide improved wavelength-locking accuracy by using an active tuning element in the AMZI to achieve an operational position with high locking sensitivity, a coherent receiver to reduce the frequency-dependence of the locking sensitivity, and/or a temperature sensor and/or strain gauge to computationally correct for the effect of temperature or strain changes.
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公开(公告)号:US11653477B2
公开(公告)日:2023-05-16
申请号:US17221373
申请日:2021-04-02
Applicant: Juniper Networks, Inc.
Inventor: Roberto Marcoccia , Brian Robert Koch , Theodore J. Schmidt , Christopher Paul Wyland , Robert S. Guzzon , Gregory Alan Fish
CPC classification number: H05K7/20663 , F28D15/0275 , F28D15/06 , H05K7/20336 , H05K7/20836
Abstract: Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.
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公开(公告)号:US20220107542A1
公开(公告)日:2022-04-07
申请号:US17065118
申请日:2020-10-07
Applicant: Juniper Networks, Inc.
Inventor: John Parker , Jonathan Edgar Roth , Gregory Alan Fish
IPC: G02F1/225
Abstract: Photonic ring modulators with high tuning efficiency and small footprint can be formed in a hybrid material platform from a silicon bus waveguide vertically coupled to an optically active compound semiconductor (e.g., III-V) ring resonator. The performance of the modulator, e.g., in terms of the tuning efficiency and the maximum insertion loss, may be optimized by suitable levels of an applied bias voltage and a heater power of a heater optionally included in the ring modulator. The disclosed hybrid photonic ring modulators may be used, e.g., in photonic transceiver circuits with high lane count.
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公开(公告)号:US11137555B2
公开(公告)日:2021-10-05
申请号:US16727525
申请日:2019-12-26
Applicant: Juniper Networks, Inc.
Inventor: Jonathan Edgar Roth , Jared Bauters , Gregory Alan Fish
Abstract: An optical coupling device can couple incident light from a fiber into waveguides, but can reduce the coupling of return light from the waveguides into the fiber. A Faraday rotator layer can rotate by forty-five degrees, with a first handedness, respective planes of polarization of incident beams, and can rotate by forty-five degrees, with a second handedness opposite the first handedness, respective planes of polarization of return beams. A redirection layer can include at least one grating coupler that can redirect an incident beam of one polarization so that the redirected path extends within the redirection layer toward a first waveguide, and can redirect an incident beam of an opposite polarization so that the redirected path extends within the redirection layer toward a second waveguide. An optional birefringent layer can spatially separate incident beam having different polarizations, so that two single-polarization grating couplers can be used.
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公开(公告)号:US20210225732A1
公开(公告)日:2021-07-22
申请号:US17223167
申请日:2021-04-06
Applicant: Juniper Networks, Inc.
Inventor: Erik Johan Norberg , Naser Dalvand , Gregory Alan Fish
IPC: H01L23/42 , H01L21/768 , H01L23/36 , H01L27/12 , H01L29/66 , H01L29/868
Abstract: The thermal impedance of p-i-n diodes integrated on semiconductor-on-insulator substrates can be reduced with thermally conducting vias that shunt heat across thermal barriers such as, e.g., the thick top oxide cladding often encapsulating the p-i-n diode. In various embodiments, one or more thermally conducting vias extend from a top surface of the intrinsic diode layer to a metal structure connected to the doped top layer of the diode, and/or from that metal structure down to at least the semiconductor device layer of the substrate.
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公开(公告)号:US20200233148A1
公开(公告)日:2020-07-23
申请号:US16844492
申请日:2020-04-09
Applicant: Juniper Networks, Inc.
Inventor: John Parker , Gregory Alan Fish , Martin A. Spannagel , Antonio Labaro
IPC: G02B6/122 , H01L21/762 , H01L21/02 , H01L21/306 , G02B6/132 , G02B6/136
Abstract: Methods and systems are presented for heterogeneous integration of photonics and electronics with atomic layer deposition (ALD) bonding. One method includes operations for forming a compound semiconductor and for depositing (e.g., via atomic layer deposition) a continuous film of a protection material (e.g., Al2O3) on a first surface of the compound semiconductor. Further, the method includes an operation for forming a silicon on insulator (SOI) wafer, with the SOI wafer comprising one or more waveguides. The method further includes bonding the compound semiconductor at the first surface to the SOI wafer to form a bonded structure and processing the bonded structure. The protection material protects the compound semiconductor from acid etchants during further processing of the bonded structure.
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公开(公告)号:US10651110B1
公开(公告)日:2020-05-12
申请号:US16237300
申请日:2018-12-31
Applicant: Juniper Networks, Inc.
Inventor: Erik Johan Norberg , Naser Dalvand , Gregory Alan Fish
IPC: H01L23/42 , H01L29/868 , H01L27/12 , H01L21/768 , H01L29/66 , H01L23/36
Abstract: The thermal impedance of p-i-n diodes integrated on semiconductor-on-insulator substrates can be reduced with thermally conducting vias that shunt heat across thermal barriers such as, e.g., the thick top oxide cladding often encapsulating the p-i-n diode. In various embodiments, one or more thermally conducting vias extend from a top surface of the intrinsic diode layer to a metal structure connected to the doped top layer of the diode, and/or from that metal structure down to at least the semiconductor device layer of the substrate.
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公开(公告)号:US10551575B2
公开(公告)日:2020-02-04
申请号:US15685114
申请日:2017-08-24
Applicant: Juniper Networks, Inc.
Inventor: Jonathan Edgar Roth , Jared Bauters , Gregory Alan Fish
Abstract: An optical coupling device can couple incident light from a fiber into waveguides, but can reduce the coupling of return light from the waveguides into the fiber. A Faraday rotator layer can rotate by forty-five degrees, with a first handedness, respective planes of polarization of incident beams, and can rotate by forty-five degrees, with a second handedness opposite the first handedness, respective planes of polarization of return beams. A redirection layer can include at least one grating coupler that can redirect an incident beam of one polarization so that the redirected path extends within the redirection layer toward a first waveguide, and can redirect an incident beam of an opposite polarization so that the redirected path extends within the redirection layer toward a second waveguide. An optional birefringent layer can spatially separate incident beam having different polarizations, so that two single-polarization grating couplers can be used.
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公开(公告)号:US10090641B2
公开(公告)日:2018-10-02
申请号:US15805877
申请日:2017-11-07
Applicant: Juniper Networks, Inc.
Inventor: Erik Norberg , Brian R. Koch , Gregory Alan Fish
Abstract: Described herein are methods, systems, and apparatuses to utilize a semiconductor optical amplifier (SOA) comprising a silicon layer including a silicon waveguide, a non-silicon layer disposed on the silicon layer and including a non-silicon waveguide, first and second mode transition region comprising tapers in the silicon waveguide and/or the non-silicon waveguide for exchanging light between the waveguide, and a plurality of regions disposed between the first and second mode transition regions comprising different cross-sectional areas of the silicon waveguide and the non-silicon waveguide such that confinement factors for the non-silicon waveguide in each of the plurality of regions differ.
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公开(公告)号:US20180138658A1
公开(公告)日:2018-05-17
申请号:US15805877
申请日:2017-11-07
Applicant: Juniper Networks, Inc.
Inventor: Erik Norberg , Brian R. Koch , Gregory Alan Fish
CPC classification number: H01S5/1028 , H01S5/021 , H01S5/026 , H01S5/0425 , H01S5/1014 , H01S5/1032 , H01S5/50 , H01S5/5027 , H04B10/25 , H04B10/66 , H04J14/02
Abstract: Described herein are methods, systems, and apparatuses to utilize a semiconductor optical amplifier (SOA) comprising a silicon layer including a silicon waveguide, a non-silicon layer disposed on the silicon layer and including a non-silicon waveguide, first and second mode transition region comprising tapers in the silicon waveguide and/or the non-silicon waveguide for exchanging light between the waveguide, and a plurality of regions disposed between the first and second mode transition regions comprising different cross-sectional areas of the silicon waveguide and the non-silicon waveguide such that confinement factors for the non-silicon waveguide in each of the plurality of regions differ.
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