公开(公告)号：US20190354146A1

公开(公告)日：2019-11-21

申请号：US16416753

申请日：2019-05-20

Applicant: Intel Corporation

Inventor： Simon C. Steely, JR. ,  Richard Dischler ,  David Bach ,  Olivier Franza ,  William J. Butera ,  Christian Karl ,  Benjamin Keen ,  Brian Leung

IPC: G06F1/18 ,  H01L23/538 ,  H01L25/065 ,  G06F9/50 ,  G06F15/76

Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.

公开(公告)号：US20190149243A1

公开(公告)日：2019-05-16

申请号：US16224008

申请日：2018-12-18

Applicant: Intel Corporation

Inventor： Hyung-Jin Lee ,  Cho-ying Lu ,  Henning Braunisch ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Richard Dischler

IPC: H04B10/516 ,  H04B10/61 ,  H04B10/2575

Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, where the transceiver is configured to receive a data stream, convert the data stream to a quadrature amplitude modulation (QAM) mapping/shaping signal, where the QAM mapping/shaping signal is a frequency component of the data stream, convert the QAM mapping/shaping signal to a Hilbert transform signal, where the Hilbert transform signal includes a reverse order of an in-phase component of the QAM mapping/shaping signal and a reverse order of a quadrature component of the QAM mapping/shaping signal, convert the Hilbert transform signal to a QAM mapping/shaping signal, where the QAM mapping/shaping signal is a single sideband (SSB) time domain mm wave signal, where the SSB time domain mm wave signal is the Hilbert transform signal converted to a time domain signal, and communicate the SSB time domain mm wave signal over a waveguide using a waveguide interconnect.

公开(公告)号：US20190115951A1

公开(公告)日：2019-04-18

申请号：US16206919

申请日：2018-11-30

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Georgios Dogiamis ,  Jeff C. Morriss ,  Hyung-Jin Lee ,  Richard Dischler ,  Ajay Balankutty ,  Telesphor Kamgaing ,  Said Rami

IPC: H04B3/52 ,  H04L27/36

Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, wherein the transceiver is configured to generate a single side band (SSB) signal for communication over a waveguide and a waveguide interconnect to communicate the SSB signal over the waveguide. In an example, an SSB operator is configured to generate the SSB signal and the SSB signal can be generated by use of a finite-impulse response filter. Other embodiments may be described and/or claimed.

公开(公告)号：US12150271B2

公开(公告)日：2024-11-19

申请号：US18331474

申请日：2023-06-08

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Johanna M. Swan ,  Georgios Dogiamis ,  Henning Braunisch ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Richard Dischler

IPC: H05K7/14 ,  H01P3/16 ,  H01P5/08 ,  H01P5/12 ,  H05K1/02 ,  H01L23/00 ,  H01L23/538 ,  H01L23/66 ,  H01L25/18 ,  H05K1/18

Abstract: Embodiments may relate an electronic device that includes a first server blade and a second server blade coupled with a chassis. The first and second server blades may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first and second server blades such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

公开(公告)号：US11581272B2

公开(公告)日：2023-02-14

申请号：US16394537

申请日：2019-04-25

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Adel A. Elsherbini ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Richard Dischler ,  Johanna M. Swan ,  Victor J. Prokoff

IPC: H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00

Abstract: Embodiments may relate to a multi-chip microelectronic package that includes a first die and a second die coupled to a package substrate. The first and second dies may have respective radiative elements that are communicatively coupled with one another such that they may communicate via an electromagnetic signal with a frequency at or above approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：US11108433B2

公开(公告)日：2021-08-31

申请号：US16206919

申请日：2018-11-30

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Georgios Dogiamis ,  Jeff C. Morriss ,  Hyung-Jin Lee ,  Richard Dischler ,  Ajay Balankutty ,  Telesphor Kamgaing ,  Said Rami

IPC: H04B3/52 ,  H04L27/36

Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, wherein the transceiver is configured to generate a single side band (SSB) signal for communication over a waveguide and a waveguide interconnect to communicate the SSB signal over the waveguide. In an example, an SSB operator is configured to generate the SSB signal and the SSB signal can be generated by use of a finite-impulse response filter. Other embodiments may be described and/or claimed.

公开(公告)号：US20200303328A1

公开(公告)日：2020-09-24

申请号：US16394537

申请日：2019-04-25

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Adel A. Elsherbini ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Richard Dischler ,  Johanna M. Swan ,  Victor J. Prokoff

IPC: H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00

Abstract: Embodiments may relate to a multi-chip microelectronic package that includes a first die and a second die coupled to a package substrate. The first and second dies may have respective radiative elements that are communicatively coupled with one another such that they may communicate via an electromagnetic signal with a frequency at or above approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：US20200273824A1

公开(公告)日：2020-08-27

申请号：US16369836

申请日：2019-03-29

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Hyung-Jin Lee ,  Henning Braunisch ,  Richard Dischler

IPC: H01L23/66 ,  H01L23/00 ,  H01L21/48

Abstract: Embodiments may relate to a microelectronic package that includes a package substrate and a signal interconnect coupled with the face of the package substrate. The microelectronic package may further include a ground interconnect coupled with the face of the package substrate. The ground interconnect may at least partially surround the signal interconnect. Other embodiments may be described or claimed.