公开(公告)号：US20200313722A1

公开(公告)日：2020-10-01

申请号：US16903354

申请日：2020-06-16

Applicant: Intel Corporation

Inventor： James Alexander McCall ,  Yunhui Chu ,  Christopher Philip Mozak ,  Derek M. Conrow ,  Christian Karl

IPC: H04B3/32 ,  H04B3/487

Abstract: An apparatus comprises a first data line coupled to a first driver; a second data line coupled to a second driver; and a crosstalk cancelation circuit comprising a third driver coupled between the first data line and the second data line, the crosstalk cancelation circuit to compensate for far end crosstalk introduced from the first data line to the second data line.

公开(公告)号：US20200371566A1

公开(公告)日：2020-11-26

申请号：US16862263

申请日：2020-04-29

Applicant: Intel Corporation

Inventor： Simon C. Steely, JR. ,  Richard Dischler ,  David Bach ,  Olivier Franza ,  William J. Butera ,  Christian Karl ,  Benjamin Keen ,  Brian Leung

IPC: G06F1/18 ,  H01L23/538 ,  G06F9/50 ,  H01L25/065 ,  G06F15/76

Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.

公开(公告)号：US20170364220A1

公开(公告)日：2017-12-21

申请号：US15186597

申请日：2016-06-20

Applicant: Intel Corporation

Inventor： Christian Karl ,  Charles Magnuson ,  Sergei Babokhov ,  Timothy D. Wig

IPC: G06F3/0483 ,  H04N5/232 ,  G06F3/01 ,  G09G3/32 ,  G06F1/16 ,  G06F3/14 ,  H04W76/02 ,  G09G3/20

Abstract: Systems, apparatuses and methods may provide for an electronic spine and one or more digital pages removably attached to the electronic spine, wherein the one or more digital pages include a first side with a first flexible display and a second side with a second flexible display. In one example, the system may further include a magnetic interface, wherein the digital page is removably attached to the electronic spine via the magnetic interface.

公开(公告)号：US11656662B2

公开(公告)日：2023-05-23

申请号：US17174106

申请日：2021-02-11

Applicant: Intel Corporation

Inventor： Simon C. Steely, Jr. ,  Richard Dischler ,  David Bach ,  Olivier Franza ,  William J. Butera ,  Christian Karl ,  Benjamin Keen ,  Brian Leung

IPC: G06F1/18 ,  H01L23/538 ,  G06F15/76 ,  H01L25/065 ,  G06F9/50

CPC classification number: G06F1/183 ,  G06F9/5027 ,  G06F15/76 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L25/0657

Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.

公开(公告)号：US10963022B2

公开(公告)日：2021-03-30

申请号：US16862263

申请日：2020-04-29

Applicant: Intel Corporation

Inventor： Simon C. Steely, Jr. ,  Richard Dischler ,  David Bach ,  Olivier Franza ,  William J. Butera ,  Christian Karl ,  Benjamin Keen ,  Brian Leung

IPC: H05K1/18 ,  G06F1/18 ,  H01L23/538 ,  G06F9/50 ,  G06F15/76 ,  H01L25/065

Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.

公开(公告)号：US20210255674A1

公开(公告)日：2021-08-19

申请号：US17174106

申请日：2021-02-11

Applicant: Intel Corporation

Inventor： Simon C. Steely, JR. ,  Richard Dischler ,  David Bach ,  Olivier Franza ,  William J. Butera ,  Christian Karl ,  Benjamin Keen ,  Brian Leung

IPC: G06F1/18 ,  H01L23/538 ,  G06F15/76 ,  H01L25/065 ,  G06F9/50

Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.

公开(公告)号：US10996825B2

公开(公告)日：2021-05-04

申请号：US15186597

申请日：2016-06-20

Applicant: Intel Corporation

Inventor： Christian Karl ,  Charles Magnuson ,  Sergei Babokhov ,  Timothy D. Wig

IPC: G06F3/0483 ,  G06F1/16 ,  G06F3/01 ,  H04N5/247 ,  G06F3/147 ,  G06F3/14 ,  G09G3/20 ,  G09G3/32 ,  H04N5/232

Abstract: Systems, apparatuses and methods may provide for an electronic spine and one or more digital pages removably attached to the electronic spine, wherein the one or more digital pages include a first side with a first flexible display and a second side with a second flexible display. In one example, the system may further include a magnetic interface, wherein the digital page is removably attached to the electronic spine via the magnetic interface.

公开(公告)号：US10691182B2

公开(公告)日：2020-06-23

申请号：US16416753

申请日：2019-05-20

Applicant: Intel Corporation

Inventor： Simon C. Steely, Jr. ,  Richard Dischler ,  David Bach ,  Olivier Franza ,  William J. Butera ,  Christian Karl ,  Benjamin Keen ,  Brian Leung

IPC: H05K1/18 ,  G06F1/18 ,  H01L23/538 ,  G06F15/76 ,  H01L25/065 ,  G06F9/50

Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.

公开(公告)号：US20190354146A1

公开(公告)日：2019-11-21

申请号：US16416753

申请日：2019-05-20

Applicant: Intel Corporation

Inventor： Simon C. Steely, JR. ,  Richard Dischler ,  David Bach ,  Olivier Franza ,  William J. Butera ,  Christian Karl ,  Benjamin Keen ,  Brian Leung

IPC: G06F1/18 ,  H01L23/538 ,  H01L25/065 ,  G06F9/50 ,  G06F15/76

Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.