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公开(公告)号:US20130214302A1
公开(公告)日:2013-08-22
申请号:US13762395
申请日:2013-02-08
Applicant: Industrial Technology Research Institute
Inventor: Wen-Yung Yeh , Kuo-Tung Tiao , Chia-Hsin Chao , Hsi-Hsuan Yen , Ming-Hsien Wu , Jui-Ying Lin , Ying-Chien Chu
IPC: H01L33/48
CPC classification number: H01L33/48 , F21K9/90 , F21Y2113/20 , F21Y2115/10 , H01L24/95 , H01L25/0753 , H01L33/20 , H01L33/483 , H01L33/60 , H01L2224/95136 , H01L2924/12041 , H01L2924/00
Abstract: A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.
Abstract translation: 发光元件的制造方法。 提供基板。 多个第一凹部和多个第二凹部形成在基板上,其中每个第一凹部的体积与每个第二凹部的体积不同。 提供了多个第一发光二极管芯片和多个第二发光二极管芯片,其中每个第一发光二极管芯片的体积对应于每个第一凹部的体积,并且每个第二发光二极管芯片的体积 对应于每个第二凹部的体积。 将第一发光二极管芯片移动到基板上,使得第一发光二极管芯片进入第一凹部,并且将第二发光二极管芯片移动到基板上,使得第二发光二极管芯片进入第一凹部 。
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公开(公告)号:US11408730B2
公开(公告)日:2022-08-09
申请号:US16688993
申请日:2019-11-19
Applicant: Industrial Technology Research Institute
Inventor: I-Hung Chiang , Hung-Hsien Ko , Cheng-Ta Pan , Wen-Yung Yeh , Cheng-Chung Lee
Abstract: A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.
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公开(公告)号:US11048851B2
公开(公告)日:2021-06-29
申请号:US16686215
申请日:2019-11-18
Applicant: Industrial Technology Research Institute
Inventor: Cheng-Ta Pan , Hung-Hsien Ko , Cheng-Chung Lee , Chang-Ying Chen , Wen-Yung Yeh
IPC: G06F30/394 , H05K1/02 , H05K3/00 , G06F115/12
Abstract: A stretchable electronics generating apparatus and layout method thereof are provided. The layout method includes: establishing a layout database, wherein the layout database recodes a plurality of layout selection information respectively corresponding to a plurality of strain/stress information; detecting a layout target area to obtain a strain/stress distribution status of the layout target area; generating a wire routing information according to the strain/stress distribution status based on the layout database; and transporting the wire routing information to a manufacture device of the conductive wires for disposing a plurality of physical conductive wires on the layout target area by the manufacture device.
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公开(公告)号:US20200159982A1
公开(公告)日:2020-05-21
申请号:US16686215
申请日:2019-11-18
Applicant: Industrial Technology Research Institute
Inventor: Cheng-Ta Pan , Hung-Hsien Ko , Cheng-Chung Lee , Chang-Ying Chen , Wen-Yung Yeh
IPC: G06F30/394 , H05K3/00 , H05K1/02
Abstract: A stretchable electronics generating apparatus and layout method thereof are provided. The layout method includes: establishing a layout database, wherein the layout database recodes a plurality of layout selection information respectively corresponding to a plurality of strain/stress information; detecting a layout target area to obtain a strain/stress distribution status of the layout target area; generating a wire routing information according to the strain/stress distribution status based on the layout database; and transporting the wire routing information to a manufacture device of the conductive wires for disposing a plurality of physical conductive wires on the layout target area by the manufacture device.
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公开(公告)号:US09865671B2
公开(公告)日:2018-01-09
申请号:US15255156
申请日:2016-09-02
Applicant: Industrial Technology Research Institute
Inventor: Hsi-Hsuan Yen , Wen-Yung Yeh , Je-Ping Hu , Yuan-Shan Chung , Chih-Ming Lai , Hsuan-Yu Lin , Wen-Hong Liu , Hsin-Chu Chen , Chun-Ting Liu
IPC: H01L27/32 , H01L23/525
CPC classification number: H01L27/3276 , H01L23/5256 , H01L27/3202 , H01L27/3288 , H01L51/5203 , H01L2251/5361 , H01L2251/568
Abstract: An organic light-emitting device includes a first substrate, a light-emitting structure layer, a first electrode layer, a second electrode layer, a second substrate, first conduction members, a second conduction member and protection structures. The light-emitting structure layer is disposed on the first substrate. The first electrode layer is disposed on the light-emitting structure layer and includes pad-like patterns. The second electrode layer is disposed between the light-emitting structure layer and the first substrate. The second substrate is adhered on the first electrode layer and includes a first circuit and a second circuit. The first circuit includes a continuous pattern and contact portions. The first conduction members are connected between the first circuit and the first electrode layer. The second conduction member is connected between the second circuit and the second electrode layer. The protection structures respectively form open circuits or close circuits between the contact portions and the continuous pattern.
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公开(公告)号:US09825013B2
公开(公告)日:2017-11-21
申请号:US14970548
申请日:2015-12-16
Applicant: Industrial Technology Research Institute
Inventor: Wen-Yung Yeh , Chia-Hsin Chao , Ming-Hsien Wu , Kuang-Yu Tai
IPC: H01L29/20 , H01L33/00 , H01L25/075 , H01L27/15 , H01L33/58 , H01L33/06 , H01L33/32 , H01L33/38 , H01L33/54 , H01L33/62 , H01L33/44
CPC classification number: H01L25/0753 , H01L27/156 , H01L33/06 , H01L33/32 , H01L33/38 , H01L33/44 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting device array including a circuit substrate and a plurality of device layers is provided. The circuit substrate includes a plurality of bonding pads and a plurality of conductive bumps located over the bonding pads. The device layers are capable of emitting different colored lights electrically connected with the circuit substrate through the conductive bumps and the bonding pads. The device layers capable of emitting different colored lights have different thicknesses and the conductive bumps bonded with the device layers capable of emitting different colored lights have different heights such that top surfaces of the device layers capable of emitting different colored lights are located on a same level of height.
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公开(公告)号:US09570712B2
公开(公告)日:2017-02-14
申请号:US14447626
申请日:2014-07-31
Applicant: Industrial Technology Research Institute
Inventor: Wen-Yung Yeh , Hsi-Hsuan Yen , Chen-Kun Chen
CPC classification number: H01L51/5275 , H01L51/0096
Abstract: An organic light-emitting module including a light-transmissive substrate, a light extracting structure, a first electrode, an organic light-emitting stack, a second electrode, and a transparent carrying board is provided. The light-transmissive substrate has an index of refraction greater than 1.5 and has a first surface and a second surface opposite to the first surface. The light extracting structure is disposed at the first surface. The first electrode is disposed on the second surface of the light-transmissive substrate. The organic light-emitting stack is disposed on the first electrode. The second electrode is disposed on the organic light-emitting stack. The transparent carrying board is connected with the light extracting structure. A minimum distance between the light extracting structure and the transparent carrying board is less than or equal to 125 μm.
Abstract translation: 提供一种包括透光性基板,光提取结构,第一电极,有机发光层,第二电极和透明承载板的有机发光模块。 透光性基板的折射率大于1.5,具有与第一面相反的第一面和第二面。 光提取结构设置在第一表面。 第一电极设置在透光基板的第二表面上。 有机发光堆叠设置在第一电极上。 第二电极设置在有机发光叠层上。 透明承载板与光提取结构连接。 光提取结构和透明承载板之间的最小距离小于或等于125μm。
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公开(公告)号:US20160148560A1
公开(公告)日:2016-05-26
申请号:US14864910
申请日:2015-09-25
Applicant: Industrial Technology Research Institute
Inventor: Cheng-Yen Tsai , Chih-Ming Lai , Wen-Yung Yeh , Hsuan-Yu Lin
CPC classification number: H01L51/504 , F21K9/00 , H01L27/3269 , H01L51/5278
Abstract: An organic light-emitting diode (OLED) apparatus includes at least one OLED illumination module, a driving unit, an optical sensing module, a control unit, and a storage unit. The driving unit is configured to adjust voltage applied to the OLED illumination module, so as to change a CCT of the OLED illumination module. The optical sensing module is configured to sense the light emitted by the OLED illumination module. The control unit is configured to receive a feedback signal from the optical sensing module so as to adjust a light intensity and the CCT of the OLED illumination module. The storage unit is configured to store photoelectric parameter data of the OLED illumination module. The control unit is configured to adjust the CCT and the light intensity of the OLED illumination module to target values according to the photoelectric parameter data.
Abstract translation: 有机发光二极管(OLED)装置包括至少一个OLED照明模块,驱动单元,光学感测模块,控制单元和存储单元。 驱动单元被配置为调节施加到OLED照明模块的电压,以便改变OLED照明模块的CCT。 光学感测模块被配置为感测由OLED照明模块发射的光。 控制单元被配置为从光学感测模块接收反馈信号,以便调节OLED照明模块的光强度和CCT。 存储单元被配置为存储OLED照明模块的光电参数数据。 控制单元被配置为根据光电参数数据将OLED照明模块的CCT和光强度调整到目标值。
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公开(公告)号:US20160113082A1
公开(公告)日:2016-04-21
申请号:US14983597
申请日:2015-12-30
Applicant: Industrial Technology Research Institute
Inventor: Chia-Hsin Chao , Wen-Yung Yeh , Hung-Pin Yang
IPC: H05B33/08 , H04B10/116
CPC classification number: H05B33/0827 , H04B10/116 , H05B33/0854 , H05B37/0272
Abstract: A visible light communication (VLC) transceiver includes a substrate, a lens module and a plurality of channel units. The channel units are disposed on the substrate in an array to provide different bidirectional communication channels. Wherein, each of the channel units respectively includes at least one light-emitting diode (LED). The LED serves as a visible light emitter in an illumination time slot, and the LED serves as a visible light receiver in a dark time slot. The channel units can enhance communication bandwidth by using modulation technology such as spatial multiplexing or time multiplexing. The lens module is disposed on an optical path of the channel units. The lens module actively tracks the receiving situation of the visible light receiver to improve the signal quality of high-speed multiplexing communication.
Abstract translation: 可见光通信(VLC)收发器包括基板,透镜模块和多个通道单元。 通道单元以阵列方式设置在基板上,以提供不同的双向通信通道。 其中,每个通道单元分别包括至少一个发光二极管(LED)。 LED在照明时隙中用作可见光发射器,并且LED在暗时隙中用作可见光接收器。 信道单元可以通过使用诸如空间复用或时间复用的调制技术来增强通信带宽。 透镜模块设置在通道单元的光路上。 透镜模块主动跟踪可见光接收器的接收情况,提高高速复用通信的信号质量。
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公开(公告)号:US09923135B2
公开(公告)日:2018-03-20
申请号:US15293298
申请日:2016-10-14
Applicant: Industrial Technology Research Institute
Inventor: Hsin-Chu Chen , Wen-Yung Yeh , Hsuan-Yu Lin , Chun-Ting Liu , Wen-Hong Liu
CPC classification number: H01L33/62 , H01L33/52 , H01L51/5203 , H01L51/524 , H01L2251/5369
Abstract: A light-emitting assembly includes a first substrate, a first electrode layer, a light-emitting layer, a second electrode layer, a second substrate, a first conductive member and a second conductive member. The first electrode layer, the light-emitting layer and the second electrode layer are sequentially disposed on the first substrate. An area of the second electrode layer is entirely located within an area of the light emitting layer. The second electrode layer is located between the second substrate and the light-emitting layer. The first and second conductive members are disposed between the first and second substrates. The first electrode layer is electrically connected to a first circuit on the second substrate through the first conductive member. The second electrode layer is electrically connected to a second circuit on the second substrate through the second conductive member. The second conductive member is located within the area of the second electrode layer.
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