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公开(公告)号：US20110209911A1
公开(公告)日：2011-09-01
申请号：US12956826
申请日：2010-11-30
申请人： Atsushi ISHIDA , Ryojiro Tominaga , Kenji Sakai
发明人： Atsushi ISHIDA , Ryojiro Tominaga , Kenji Sakai
IPC分类号： H05K1/11
CPC分类号： H05K1/0222 , H05K1/0271 , H05K1/115 , H05K3/427 , H05K3/4602 , H05K2201/0347 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09827
摘要： A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.
摘要翻译： 布线基板包括具有第一表面和第二表面的基底，穿过基底的第一穿透孔，形成在第一孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二穿透孔 以及形成在所述第二孔中的第二通孔导体，在所述基板的第一表面上的第一导电电路，所述基板的第二表面上的第二导电电路，所述第二孔的一端上的第一导电部， 以及在所述第二穿透孔的相对端上的第二导电部分。 第一导体连接第一电路和第二电路。 第二导体由填充在第二孔中的导电材料制成，并且连接第一导电部分和第二导电部分。
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公开(公告)号：US20110048775A1
公开(公告)日：2011-03-03
申请号：US12857838
申请日：2010-08-17
申请人： Atsushi ISHIDA , Ryojiro Tominaga , Kenji Sakai
发明人： Atsushi ISHIDA , Ryojiro Tominaga , Kenji Sakai
CPC分类号： H05K1/115 , H05K1/0263 , H05K3/0038 , H05K3/427 , H05K3/4602 , H05K2201/09536 , H05K2201/09563 , H05K2201/0979 , H05K2201/09827 , H05K2203/1572 , Y10T29/49124
摘要： A printed wiring board includes a substrate having a first surface and a second surface on the opposite side of the first surface and multiple first penetrating holes, a first conductive portion formed on the first surface of the substrate and made of a first plated cover layer, a second conductive portion formed on the second surface of the substrate and made of a second plated cover layer, the second conductive portion being positioned opposite the first conductive portion, and multiple first through-hole conductors made of conductors formed in the multiple first penetrating holes, respectively, the multiple first through-hole conductors connecting the first conductive portion and the second conductive portion. The first conductive portion, the second conductive portion and the first through-hole conductors form a first through-hole connection section which sets up either a power-source through-hole conductor or a ground through-hole conductor.
摘要翻译： 印刷电路板包括：具有在第一表面的相对侧上的第一表面和第二表面的基板和多个第一穿透孔;形成在基板的第一表面上并由第一镀覆覆盖层制成的第一导电部分， 第二导电部分，形成在基板的第二表面上，由第二镀覆覆盖层制成，第二导电部分与第一导电部分相对定位，多个第一通孔导体由形成在多个第一穿透孔中的导体 分别连接第一导电部和第二导电部的多个第一通孔导体。 第一导电部分，第二导电部分和第一通孔导体形成设置电源通孔导体或接地通孔导体的第一通孔连接部分。
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公开(公告)号：US08826530B2
公开(公告)日：2014-09-09
申请号：US12732635
申请日：2010-03-26
申请人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
发明人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
CPC分类号： H05K3/0032 , C25D5/02 , C25D7/12 , C25D7/123 , H05K3/387 , H05K3/422 , H05K3/4602 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2203/095 , H05K2203/1572 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.
摘要翻译： 一种用金属膜制造衬底的方法包括制备在第一表面的相对侧具有第一表面和第二表面的绝缘衬底，在绝缘衬底中形成具有从第一表面的第一表面逐渐变细的内壁的穿透孔 所述绝缘基板朝向所述第二表面，在所述穿透孔的内壁上形成含有聚合引发剂和可聚合化合物的组合物层，用能量照射所述组合物层，使得聚合物形成在所述聚合物的内壁上 穿孔，在聚合物上涂布电镀催化剂，在贯通孔的内壁上形成电镀金属膜。
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公开(公告)号：US08624127B2
公开(公告)日：2014-01-07
申请号：US12952864
申请日：2010-11-23
申请人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
发明人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
IPC分类号： H05K1/09
CPC分类号： H05K3/4038 , H05K1/0222 , H05K1/0231 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/09563 , H05K2201/096 , H05K2201/09827 , H05K2201/10636 , Y02P70/611 , Y10T29/49165
摘要： A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.
摘要翻译： 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路， 衬底和第一或第二电路，以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体，并连接第三电路和第二导体。 衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。
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公开(公告)号：US20110209904A1
公开(公告)日：2011-09-01
申请号：US12952864
申请日：2010-11-23
申请人： Atsushi ISHIDA , Ryojiro Tominaga , Kenji Sakai
发明人： Atsushi ISHIDA , Ryojiro Tominaga , Kenji Sakai
CPC分类号： H05K3/4038 , H05K1/0222 , H05K1/0231 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/09563 , H05K2201/096 , H05K2201/09827 , H05K2201/10636 , Y02P70/611 , Y10T29/49165
摘要： A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.
摘要翻译： 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路， 衬底和第一或第二电路，以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体，并连接第三电路和第二导体。 衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。
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公开(公告)号：US20100243305A1
公开(公告)日：2010-09-30
申请号：US12732635
申请日：2010-03-26
申请人： Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
发明人： Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
CPC分类号： H05K3/0032 , C25D5/02 , C25D7/12 , C25D7/123 , H05K3/387 , H05K3/422 , H05K3/4602 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2203/095 , H05K2203/1572 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.
摘要翻译： 一种用金属膜制造衬底的方法包括制备在第一表面的相对侧具有第一表面和第二表面的绝缘衬底，在绝缘衬底中形成具有从第一表面的第一表面逐渐变细的内壁的穿透孔 所述绝缘基板朝向所述第二表面，在所述穿透孔的内壁上形成含有聚合引发剂和可聚合化合物的组合物层，用能量照射所述组合物层，使得聚合物形成在所述聚合物的内壁上 穿孔，在聚合物上涂布电镀催化剂，在贯通孔的内壁上形成电镀金属膜。
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