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    Memories of fluidic dies
    11.
    发明授权
    Memories of fluidic dies 有权

    公开(公告)号：US11511539B2

    公开(公告)日：2022-11-29

    申请号：US16771080

    申请日：2019-02-06

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Boon Bing Ng ,  Erik D. Ness ,  James Michael Gardner

    IPC: B41J2/045

    Abstract: In some examples, a fluid dispensing device component includes a plurality of fluidic dies each comprising a memory, a plurality of control inputs to provide respective control information to respective fluidic dies of the plurality of fluidic dies, and a data bus connected to the plurality of fluidic dies, the data bus to provide data of the memories of the plurality of fluidic dies to an output of the fluid dispensing device component.

    Print component with memory circuit
    13.
    发明授权
    Print component with memory circuit 有权

    公开(公告)号：US11453212B2

    公开(公告)日：2022-09-27

    申请号：US16768125

    申请日：2019-07-31

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Boon Bing Ng ,  James Michael Gardner

    IPC: B41J2/045 ,  G06F3/12 ,  G06F13/16 ,  G11C7/10 ,  G11C16/10 ,  G11C16/26

    Abstract: A memory circuit for a print component including a plurality of I/O pads, including an analog pad, to connect to a plurality of signals paths which communicate operating signals to the print component, and a memory component to store memory values associated with the print component. A control circuit to, in response to identifying a sequence of operating signals representing a memory read, provide a first analog signal on the analog pad in parallel with a second analog signal from the print component to provide an analog electrical value on the analog pad representing stored memory values selected by the memory read.

    Print component having fluidic actuating structures with different fluidic architectures
    15.
    发明授权
    Print component having fluidic actuating structures with different fluidic architectures 有权

    公开(公告)号：US11413862B2

    公开(公告)日：2022-08-16

    申请号：US16957524

    申请日：2019-02-06

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Scott A. Linn ,  James Michael Gardner ,  John Rossi

    IPC: B41J2/04 ,  B41J2/045 ,  B41J2/14

    Abstract: A print component includes an array of fluidic actuation structures including a first column of fluidic actuating structures addressable by a set of actuation addresses, each fluidic actuating structure having a different one of the actuation addresses and having a fluidic architecture type, and a second column of fluidic actuating structures addressable by the set of actuation addresses. Each fluidic actuating structure of the second column has a different one of the actuation addresses and has a same fluidic architecture type as the fluidic actuating structure of the first column having the same address. An address bus communicates the set of addresses to the array of fluidic actuating structures, and a fire signal line communicates a plurality of fire pulse signal types to the array of fluidic actuating structures, the fire pulse signal type depending on the actuation address on the address bus.

    Logic circuitry package
    16.
    发明授权
    Logic circuitry package 有权

    公开(公告)号：US11407228B2

    公开(公告)日：2022-08-09

    申请号：US16768321

    申请日：2019-10-25

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Scott A. Linn ,  Michael W. Cumbie ,  James Michael Gardner

    IPC: B41J2/175 ,  B41J2/045 ,  G06F13/42 ,  G06F21/44 ,  G06F1/12 ,  G06F1/08 ,  H03K19/0175 ,  B33Y30/00 ,  B29C64/259 ,  G06F3/12 ,  G01F23/24 ,  G01F23/80

    Abstract: A logic circuitry package for a replaceable print apparatus component includes an I2C interface to communicate with a print apparatus logic circuit and at least one logic circuit. The at least one logic circuit is configured to respond to communications over the I2C interface that are directed to an initial or reconfigured I2C address. The at least one logic circuit is configured to receive, via the I2C interface, a write command to a first memory address of the logic circuit to initiate a first function of the logic circuit. The at least one logic circuit is configured to generate first data in response to the first function. The at least one logic circuit is configured to receive, via the I2C interface, a first read command to a second memory address of the logic circuit. The at least one logic circuit is configured to transmit, via the I2C interface, the first data in response to the first read command to the second memory address.

    Logic circuitry
    17.
    发明授权
    Logic circuitry 有权

    公开(公告)号：US11364716B2

    公开(公告)日：2022-06-21

    申请号：US16771092

    申请日：2018-12-03

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Stephen D. Panshin ,  Jefferson P. Ward ,  Scott A. Linn ,  James Michael Gardner

    IPC: B41J2/045 ,  B41J2/175 ,  G06F13/42

    Abstract: In an example, a logic circuitry package is configured to be addressable via a first address and at least one second address and comprises a first logic circuit. The first address may be an address for the first logic circuit, and the package may be configured such that, in response to a first command indicative of a first command time period sent to the first address, the package is accessible via at least one second address for a duration of the first command time period; and in response to a second command indicative of a second command time period sent to the first address, the first logic circuit is to, for a duration of the second command time period, disregard traffic sent to the first address.

    Thermal zone selection with a circular shift register
    19.
    发明授权
    Thermal zone selection with a circular shift register 有权

    公开(公告)号：US11331909B2

    公开(公告)日：2022-05-17

    申请号：US17045517

    申请日：2018-06-11

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Daryl E. Anderson ,  Eric T. Martin ,  James Michael Gardner

    IPC: B41J2/045

    Abstract: Examples of a fluidic die for thermal zone selection with a circular shift register are described herein. In some examples, the fluidic die includes multiple thermal zones. Each thermal zone includes a temperature sensor and a fluidic actuator. The fluidic die also includes shared thermal control circuitry to process an output of the temperature sensor of a selected thermal zone. The fluidic die further includes a circular shift register that includes multiple memory elements. Each memory element is associated with one thermal zone. A token circulates within the circular shift register to select one thermal zone at a time for processing by the shared thermal control circuitry.

    Print material level sensing
    20.
    发明授权
    Print material level sensing 有权

    公开(公告)号：US11292264B2

    公开(公告)日：2022-04-05

    申请号：US16769042

    申请日：2019-04-05

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Daryl E Anderson ,  James Michael Gardner

    IPC: B41J2/175

    Abstract: A print material level sensor includes a series of print material level sensing devices disposed at intervals to detect the presence of print material at successive depth zones in a container. Each print material level sensing device includes a heater to emit heat at its depth zone and a sensor to sense heat at the depth zone and to output a signal based on the heat sensed. The print material level sensor includes control circuitry to enable supply of electrical power to the heater of any one of the print material level sensing devices in its depth zone and to receive the signal from the respective sensor. The control circuitry includes a comparator to compare a value of the signal to a target value. The control circuitry disables supply of the electrical power to the heater when the value of the signal is at least equal to the target value.

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