公开(公告)号：US07768762B2

公开(公告)日：2010-08-03

申请号：US12144084

申请日：2008-06-23

申请人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu ,  Anthony K. Stamper

发明人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu ,  Anthony K. Stamper

IPC分类号： H02H7/20 ,  H02H9/00

CPC分类号： G06F17/5068 ,  H01L23/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A design structure for an on-chip high frequency electro-static discharge device is described. In one embodiment, the electro-static discharge device comprises a substrate and multiple metal level layers disposed on the substrate. Each metal level comprises more than one electrode formed therein and more than one via connecting with some of the electrodes in adjacent metal levels. The device further includes a gap formed about one of the metal level layers, wherein the gap is hermetically sealed to provide electro-static discharge protection for the integrated circuit.

摘要翻译： 描述了片上高频静电放电装置的设计结构。 在一个实施例中，静电放电装置包括衬底和设置在衬底上的多个金属层。 每个金属层包括多于一个电极，其中形成有多个电极，并且多个通孔与相邻金属层中的一些电极连接。 所述装置还包括围绕所述金属层之一形成的间隙，其中所述间隙被气密密封，以为所述集成电路提供静电放电保护。

公开(公告)号：US07759243B2

公开(公告)日：2010-07-20

申请号：US12144089

申请日：2008-06-23

申请人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu ,  Anthony K. Stamper

发明人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu ,  Anthony K. Stamper

IPC分类号： H01L21/00

CPC分类号： H01L21/76808 ,  H01L21/7682 ,  H01L27/0248

摘要： A method for forming an on-chip high frequency electro-static discharge device on an integrated circuit is described. In one embodiment of the method, a capped first dielectric layer with more than one electrode formed therein is provided. A second dielectric layer is deposited over the capped first dielectric layer. A first hard mask dielectric layer is deposited over the second dielectric layer. A cavity trench is formed through the first hard mask dielectric layer and the second dielectric layer to the first dielectric layer, wherein the cavity trench is formed in the first dielectric layer between two adjacent electrodes. At least one via is formed through the second dielectric layer about the cavity trench. A metal trench is formed around each of the at least one via. A release opening is formed over the cavity trench. A third dielectric layer is deposited over the second dielectric layer, wherein the third dielectric layer hermetically seals the release opening to provide electro-static discharge protection.

摘要翻译： 描述了在集成电路上形成片上高频静电放电装置的方法。 在该方法的一个实施例中，提供了一种其上形成有多于一个电极的封盖的第一电介质层。 在封盖的第一介电层上沉积第二介电层。 第一硬掩模介电层沉积在第二介电层上。 通过第一硬掩模电介质层和第二电介质层形成腔沟槽到第一介电层，其中在两个相邻电极之间的第一电介质层中形成空腔沟槽。 至少一个通孔围绕腔沟槽形成穿过第二电介质层。 在所述至少一个通孔中的每一个周围形成金属沟槽。 在空腔沟槽上形成释放开口。 在第二电介质层上沉积第三电介质层，其中第三介电层气密地密封释放开口以提供静电放电保护。

公开(公告)号：US07689961B2

公开(公告)日：2010-03-30

申请号：US11161634

申请日：2005-08-10

申请人： Florian Braun ,  Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Howard S. Landis ,  Xuefeng Liu ,  Geoffrey Woodhouse

发明人： Florian Braun ,  Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Howard S. Landis ,  Xuefeng Liu ,  Geoffrey Woodhouse

IPC分类号： G06F17/50

CPC分类号： G06F17/5068

摘要： Increase power line noise immunity in an IC is provided by using decoupling capacitor structure in an area of the IC that is typically not used for routing, but filled with unconnected and non-functional metal squares (fills). In one embodiment, a method includes providing a circuit design layout; determining a density of a structure in an area of the circuit design layout; and in response to the density being less than a pre-determined density for the structure in the area, filling in a portion of the area with at least one capacitor structure until a combined density of the structure and the at least one capacitor structure in the area is about equal to the pre-determined density. Power line noise immunity is increased by increasing decoupling capacitance without enlarging the IC's total size by using a (fill) area that would normally be filled with unconnected and non-functional metal shapes.

摘要翻译： 通过在IC的区域中使用去耦电容器结构来提供IC中的电力线噪声抗扰度，该结构通常不用于布线，而是填充有未连接和非功能金属正方形（填充）。 在一个实施例中，一种方法包括提供电路设计布局; 确定电路设计布局区域中结构的密度; 并且响应于所述密度小于所述区域中的结构的预定密度，用至少一个电容器结构填充所述区域的一部分，直到所述结构和所述至少一个电容器结构的组合密度在 面积约等于预定密度。 通过使用通常用非连接和非功能金属形状填充的（填充）区域，通过增加去耦电容而不扩大IC的总尺寸来增加电力线噪声抗扰度。

公开(公告)号：US20100033395A1

公开(公告)日：2010-02-11

申请号：US12187442

申请日：2008-08-07

申请人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Zhenrong Jin ,  Xuefeng Liu

发明人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Zhenrong Jin ,  Xuefeng Liu

IPC分类号： H01Q19/10

CPC分类号： H01Q1/2283 ,  H01Q1/40 ,  H01Q9/26 ,  H01Q9/285 ,  H01Q19/108 ,  H01Q19/30

摘要： A semiconductor chip integrating a transceiver, an antenna, and a receiver is provided. The transceiver is located on a front side of a semiconductor substrate. A through substrate via provides electrical connection between the transceiver and the receiver located on a backside of the semiconductor substrate. The antenna connected to the transceiver is located in a dielectric layer located on the front side of the substrate. The separation between the reflector plate and the antenna is about the quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna. An array of through substrate dielectric vias may be employed to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency. A design structure for designing, manufacturing, or testing a design for such a semiconductor chip is also provided.

摘要翻译： 提供集成收发器，天线和接收器的半导体芯片。 收发器位于半导体衬底的前侧。 通过基底通孔提供收发器和位于半导体衬底背面的接收器之间的电连接。 连接到收发器的天线位于位于基板正面的电介质层中。 反射板与天线之间的间隔大约是毫米波的四分之一波长，这提高了天线的辐射效率。 可以采用贯穿衬底电介质通孔的阵列来降低天线和反射板之间材料的有效介电常数，由此减小毫米波的波长并提高辐射效率。 还提供了用于设计，制造或测试这种半导体芯片的设计的设计结构。

公开(公告)号：US08860191B2

公开(公告)日：2014-10-14

申请号：US13168512

申请日：2011-06-24

申请人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu

发明人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu

IPC分类号： H01L23/66 ,  H01P1/18 ,  H01L23/522

CPC分类号： H01L23/5222 ,  H01L23/5225 ,  H01L23/66 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01P1/184 ,  Y10T29/49117 ,  H01L2924/00

摘要： A transmission wiring structure, associated design structure and associated method for forming the same. A structure is disclosed having: a plurality of wiring levels formed on a semiconductor substrate; a pair of adjacent first and second signal lines located in the wiring levels, wherein the first signal line comprises a first portion formed on a first wiring level and a second portion formed on a second wiring level; a primary dielectric structure having a first dielectric constant located between the first portion and a ground shield; and a secondary dielectric structure having a second dielectric constant different than the first dielectric constant, the secondary dielectric structure located between the second portion and the ground shield, and the second dielectric layer extending co-planar with the second portion and having a length that is substantially the same as the second portion.

摘要翻译： 一种传输线路结构，相关设计结构及其相关方法。 公开了一种结构，其具有：形成在半导体衬底上的多个布线层; 位于布线层中的一对相邻的第一和第二信号线，其中第一信号线包括形成在第一布线层上的第一部分和形成在第二布线层上的第二部分; 第一介电结构，其具有位于第一部分和接地屏蔽之间的第一介电常数; 以及具有不同于所述第一介电常数的第二介电常数的次级介电结构，所述第二介电结构位于所述第二部分和所述接地屏蔽之间，并且所述第二电介质层与所述第二部分共面延伸并且具有长度为 基本上与第二部分相同。

公开(公告)号：US08566759B2

公开(公告)日：2013-10-22

申请号：US12046750

申请日：2008-03-12

申请人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu

发明人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu

IPC分类号： G06F17/50

CPC分类号： G01R1/18 ,  G01R31/2851 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/665 ,  H01L2924/0002 ,  H01L2924/1903 ,  H01L2924/19051 ,  H01L2924/3011 ,  H01L2924/00

摘要： A design structure is embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit. The design structure comprises: a conductive structure surrounding and accommodating a circuit or a circuit device arranged on a substrate and at least one feed through capacitor and one transmission line associated with the conductive structure and providing the power supply and signals to the circuit or circuit device respectively. The design structure also comprises a shielding structure surrounding a circuit or a circuit device arranged on a substrate and at least one feed through capacitor or a transmission line arranged on a side of the shielding structure.

摘要翻译： 设计结构体现在用于设计，制造或测试集成电路的机器可读介质中。 该设计结构包括：围绕和容纳布置在基板上的电路或电路装置的导电结构以及与导电结构相关联的至少一个馈电电容器和一个传输线，并将电源和信号提供给电路或电路装置 分别。 该设计结构还包括围绕设置在基板上的电路或电路装置的屏蔽结构以及布置在屏蔽结构侧的电容器或传输线的至少一个馈电。

公开(公告)号：US08232920B2

公开(公告)日：2012-07-31

申请号：US12187442

申请日：2008-08-07

申请人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Zhenrong Jin ,  Xuefeng Liu

发明人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Zhenrong Jin ,  Xuefeng Liu

IPC分类号： H01Q1/38 ,  H01Q1/40

CPC分类号： H01Q1/2283 ,  H01Q1/40 ,  H01Q9/26 ,  H01Q9/285 ,  H01Q19/108 ,  H01Q19/30

摘要： A semiconductor chip integrating a transceiver, an antenna, and a receiver is provided. The transceiver is located on a front side of a semiconductor substrate. A through substrate via provides electrical connection between the transceiver and the receiver located on a backside of the semiconductor substrate. The antenna connected to the transceiver is located in a dielectric layer located on the front side of the substrate. The separation between the reflector plate and the antenna is about the quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna. An array of through substrate dielectric vias may be employed to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency. A design structure for designing, manufacturing, or testing a design for such a semiconductor chip is also provided.

摘要翻译： 提供集成收发器，天线和接收器的半导体芯片。 收发器位于半导体衬底的前侧。 通过基底通孔提供收发器和位于半导体衬底背面的接收器之间的电连接。 连接到收发器的天线位于位于基板正面的电介质层中。 反射板与天线之间的间隔大约是毫米波的四分之一波长，这提高了天线的辐射效率。 可以采用贯穿衬底电介质通孔的阵列来降低天线和反射板之间材料的有效介电常数，由此减小毫米波的波长并提高辐射效率。 还提供了用于设计，制造或测试这种半导体芯片的设计的设计结构。

公开(公告)号：US08120110B2

公开(公告)日：2012-02-21

申请号：US12188381

申请日：2008-08-08

申请人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Zhenrong Jin ,  Xuefeng Liu ,  Yun Shi

发明人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Zhenrong Jin ,  Xuefeng Liu ,  Yun Shi

IPC分类号： H01L27/12

CPC分类号： H01L27/088 ,  H01L21/823462 ,  H01L21/823481 ,  H01L27/1207

摘要： A first field effect transistor includes a gate dielectric and a gate electrode located over a first portion of a top semiconductor layer in a semiconductor-on-insulator (SOI) substrate. A second field effect transistor includes a portion of a buried insulator layer and a source region and a drain region located underneath the buried insulator layer. In one embodiment, the gate electrode of the second field effect transistor is a remaining portion of the top semiconductor layer. In another embodiment, the gate electrode of the second field effect transistor is formed concurrently with the gate electrode of the first field effect transistor by deposition and patterning of a gate electrode layer. The first field effect transistor may be a high performance device and the second field effect transistor may be a high voltage device. A design structure for the semiconductor structure is also provided.

摘要翻译： 第一场效应晶体管包括栅极电介质和位于绝缘体上半导体（SOI））衬底中顶部半导体层的第一部分上方的栅电极。 第二场效应晶体管包括掩埋绝缘体层的一部分和位于掩埋绝缘体层下方的源区和漏区。 在一个实施例中，第二场效应晶体管的栅电极是顶部半导体层的剩余部分。 在另一个实施例中，第二场效应晶体管的栅极通过栅极电极层的沉积和图案化与第一场效应晶体管的栅电极同时形成。 第一场效应晶体管可以是高性能器件，第二场效应晶体管可以是高电压器件。 还提供了用于半导体结构的设计结构。

公开(公告)号：US07915158B2

公开(公告)日：2011-03-29

申请号：US12144071

申请日：2008-06-23

申请人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu ,  Anthony K. Stamper

发明人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu ,  Anthony K. Stamper

IPC分类号： H01L21/4763

CPC分类号： H01L21/7682 ,  H01L21/3148 ,  H01L21/318 ,  H01L21/3185 ,  H01L27/0248

摘要： A method for forming an on-chip high frequency electro-static discharge device is described. In one embodiment, a wafer with a multi-metal level wiring is provided. The wafer includes a first dielectric layer with more than one electrode formed therein, a second dielectric layer disposed over the first dielectric layer with more than one electrode formed therein and more than one via connecting the more than one electrode in the first dielectric layer to a respective more than one electrode in the second dielectric layer. The more than one via is misaligned a predetermined amount with the more than one electrodes in the first dielectric layer and the second dielectric layer. The at least one of the misaligned vias forms a narrow gap with another misaligned via. A cavity trench is formed through the second dielectric layer between the narrow gap that separates the misaligned vias.

摘要翻译： 描述形成片上高频静电放电装置的方法。 在一个实施例中，提供具有多金属层布线的晶片。 该晶片包括：第一电介质层，其中形成有多于一个电极;第二电介质层，设置在第一电介质层上，其中形成有多于一个电极，多个通孔将第一介电层中的多于一个的电极连接到 在第二介电层中分别有一个以上的电极。 多于一个通孔与第一介电层和第二介电层中的多于一个的电极不对准预定量。 至少一个不对齐的通孔与另一个不对齐的通孔形成了狭窄的间隙。 在分隔未对准的通孔的窄间隙之间通过第二介电层形成腔沟槽。

公开(公告)号：US20090316313A1

公开(公告)日：2009-12-24

申请号：US12144084

申请日：2008-06-23

申请人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu ,  Anthony K. Stamper

发明人： Hanyi Ding ,  Kai D. Feng ,  Zhong-Xiang He ,  Xuefeng Liu ,  Anthony K. Stamper

IPC分类号： H02H9/00 ,  G06F17/50

CPC分类号： G06F17/5068 ,  H01L23/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A design structure for an on-chip high frequency electro-static discharge device is described. In one embodiment, the electro-static discharge device comprises a substrate and multiple metal level layers disposed on the substrate. Each metal level comprises more than one electrode formed therein and more than one via connecting with some of the electrodes in adjacent metal levels. The device further includes a gap formed about one of the metal level layers, wherein the gap is hermetically sealed to provide electro-static discharge protection for the integrated circuit.

摘要翻译： 描述了片上高频静电放电装置的设计结构。 在一个实施例中，静电放电装置包括衬底和设置在衬底上的多个金属层。 每个金属层包括多于一个电极，其中形成有多个电极，并且多个通孔与相邻金属层中的一些电极连接。 所述装置还包括围绕所述金属层之一形成的间隙，其中所述间隙被气密密封以为所述集成电路提供静电放电保护。