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    Laminated element manufacturing method
    11.
    发明授权
    Laminated element manufacturing method 有权

    公开(公告)号：US11158601B2

    公开(公告)日：2021-10-26

    申请号：US16633240

    申请日：2018-07-18

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Takeshi Sakamoto ,  Ryuji Sugiura ,  Yuta Kondoh ,  Naoki Uchiyama

    IPC: H01L21/268 ,  H01L23/00 ,  H01L21/78 ,  H01L27/06

    Abstract: A laminating step includes a first bonding step of bonding a circuit layer of a second wafer to a circuit layer of a first wafer, a grinding step of grinding a semiconductor substrate of the second wafer, and a second bonding step of bonding a circuit layer of the third wafer to the semiconductor substrate of the second wafer. In a laser light irradiation step, a modified region is formed and a fracture extends from the modified region along a laminating direction of a laminated body by irradiating the semiconductor substrate of the first wafer with a laser light.

    LASER MACHINING METHOD AND CHIP
    15.
    发明申请
    LASER MACHINING METHOD AND CHIP 审中-公开
    激光加工方法和芯片

    公开(公告)号：US20140291813A1

    公开(公告)日：2014-10-02

    申请号：US14305773

    申请日：2014-06-16

    Applicant: Hamamatsu Photonics K.K.

    Inventor： Aiko Nakagawa ,  Takeshi Sakamoto

    IPC: H01L23/00

    CPC classification number: H01L23/562 ,  B23K26/046 ,  B23K26/38 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/67092 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: While reliably cutting an object to be processed, the strength of the resulting chips is improved. An object to be processed 1 is irradiated with laser light L, so as to form modified regions 17, 27, 37, 47 extending along lines to cut 5 and aligning in the thickness direction in the object 1. Here, modified regions 17 are formed such that modified region formed parts 17a and modified region unformed parts 17b alternate along the lines, and modified regions 47 are formed such that modified region formed parts 47a and modified region unformed parts 47b alternate along the lines. This can inhibit formed modified regions 7 from lowering the strengths on the rear face 21 side and front face 3 side of chips obtained by cutting. On the other hand, modified regions 27, 37 located between the modified regions 17, 47 are formed continuously from one end side of the lines 5 to the other end side thereof, whereby the cuttability of the object 1 can be secured reliably.

    Abstract translation: 在可靠地切割待处理物体的同时，提高了所得到的芯片的强度。 用激光L照射待处理物体1，以形成沿着切割线5延伸并沿物体1的厚度方向对准的改质区域17,27,37,47。这里，形成改质区域17 使得改性区域形成部分17a和改质区域未成形部分17b沿着直线交替，并且改性区域47形成为使得改性区域形成部分47a和改质区域未成形部分47b沿着线交替。 这可以抑制形成的改质区域7降低通过切割获得的切屑的背面21侧和前面3侧的强度。 另一方面，位于改质区域17,47之间的改质区域27,37从管线5的一端侧到另一端侧连续地形成，能够可靠地确保物体1的切断性。

    Laser beam machining method and semiconductor chip
    16.
    发明授权
    Laser beam machining method and semiconductor chip 有权
    激光束加工方法和半导体芯片

    公开(公告)号：US08759948B2

    公开(公告)日：2014-06-24

    申请号：US13757111

    申请日：2013-02-01

    Applicant: Hamamatsu Photonics K.K.

    Inventor： Takeshi Sakamoto ,  Kenichi Muramatsu

    IPC: H01L23/544

    CPC classification number: H01L23/544 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  C03B33/0222 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An object to be processed 1 comprising a substrate 4 and a plurality of functional devices 15 formed on a front face 3 of the substrate 4 is irradiated with laser light L while locating a converging point P within the substrate 4, so as to form at least one row of a divided modified region 72, at least one row of a quality modified region 71 positioned between the divided modified region 72 and the front face 3 of the substrate 4, and at least one row of an HC modified region 73 positioned between the divided modified region 72 and a rear face 21 of the substrate 4 for one line to cut 5. Here, in a direction along the line to cut, a forming density of the divided modified region 72 is made lower than that of the quality modified region 71 and that of the HC modified region 73.

    Abstract translation: 在基板4上形成有会聚点P的基板4和形成在基板4的正面3上的多个功能元件15的被处理体1照射激光L，至少形成 一排分割改质区域72，位于分割改质区域72与基材4前表面3之间的至少一排质量改质区域71，以及至少一行位于 分割改质区域72和基板4的背面21一行切割5.这里，沿着切割线的方向，使分割改质区域72的形成密度低于质量改质区域的形成密度 71和改造后HC区域73。

    Laser processing apparatus and laser processing method
    17.
    发明授权
    Laser processing apparatus and laser processing method 有权

    公开(公告)号：US12275091B2

    公开(公告)日：2025-04-15

    申请号：US17289069

    申请日：2019-10-30

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Katsuhiro Korematsu ,  Takeshi Sakamoto

    IPC: B23K26/53 ,  B23K26/08 ,  B23K103/00 ,  H01L21/268

    Abstract: A laser processing apparatus irradiates a target with a laser light to form a modified region along a virtual plane in the target. The laser processing apparatus includes a support portion, an irradiation portion, a movement mechanism, and a controller. The controller performs a first processing process of irradiating a first portion in the target with the laser light under a first processing condition, and a second processing process of irradiating a second portion more on an inner side than the first portion in the target with the laser light under a second processing condition different from the first processing condition, after the first processing process.

    Laser processing device for forming a modified region in an object and laser processing method
    18.
    发明授权
    Laser processing device for forming a modified region in an object and laser processing method 有权

    公开(公告)号：US12246397B2

    公开(公告)日：2025-03-11

    申请号：US17641519

    申请日：2020-09-09

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Takafumi Ogiwara ,  Takeshi Sakamoto

    IPC: B23K26/53 ,  B23K26/067 ,  H01L21/268 ,  H01L21/67 ,  B23K103/00 ,  G02F1/133

    Abstract: A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part. The controller controls the spatial light modulator so that a converging point of the 0th-order light in the Z direction is located on an opposite side of a converging point of non-modulated light of the laser light with respect to an ideal converging point of the 0th-order light.

    Laser machining device
    19.
    发明授权
    Laser machining device 有权

    公开(公告)号：US11794278B2

    公开(公告)日：2023-10-24

    申请号：US17289011

    申请日：2019-10-30

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Takeshi Sakamoto ,  Junji Okuma

    IPC: B23K26/08 ,  B23K26/351 ,  B23K26/06 ,  B23K101/40

    CPC classification number: B23K26/0823 ,  B23K26/0604 ,  B23K26/0853 ,  B23K26/0884 ,  B23K26/351 ,  B23K2101/40

    Abstract: A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

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