公开(公告)号：US10403677B2

公开(公告)日：2019-09-03

申请号：US15032130

申请日：2014-10-31

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Shin-ichiro Takagi ,  Yasuhito Yoneta ,  Hisanori Suzuki ,  Masaharu Muramatsu

IPC: H04N5/369 ,  H04N5/372 ,  H01L27/148

Abstract: An optical detection unit AR is divided so as to have a plurality of pixel regions PX aligned in a column direction. Signals from the plurality of pixel regions PX are integrated for each optical detection unit AR, and output the signal as an electrical signal corresponding to a one-dimensional optical image in time series. Each of the pixel regions PX includes a resistive gate electrode R which promotes transfer of charges in the photoelectric conversion region and a charge accumulation region S2. A drain region ARD is adjacent to the charge accumulation region S2 through a channel region.

公开(公告)号：US09502456B2

公开(公告)日：2016-11-22

申请号：US14760258

申请日：2013-09-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Shin-ichiro Takagi ,  Shingo Ishihara ,  Masaharu Muramatsu

IPC: H01L31/00 ,  H01L27/146 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L27/14636 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85207 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/48455

Abstract: An electronic component device includes a first electronic component on which a first electrode pad is disposed, a second electronic component on which a second electrode pad having a first pad portion and a second pad portion is disposed, a first bonding wire having one end connected to the first electrode pad and the other end connected to the first pad portion, and a second bonding wire having one end connected to a connection portion between the first pad portion and the first bonding wire and the other end connected to the second pad portion. The second electrode pad is disposed on the second electronic component so that the first pad portion and the second pad portion are laid along a direction intersecting with an extending direction of the first bonding wire. The extending direction of the first bonding wire intersects with an extending direction of the second bonding wire.

Abstract translation: 电子部件装置包括：第一电子部件，配置有第一电极焊盘;第二电子部件，具有第一焊盘部和第二焊盘部的第二电极焊盘，第一焊接线的一端连接到 第一电极焊盘和另一端连接到第一焊盘部分，以及第二接合线，其一端连接到第一焊盘部分和第一焊接线之间的连接部分，而另一端连接到第二焊盘部分。 第二电极焊盘设置在第二电子部件上，使得第一焊盘部分和第二焊盘部分沿着与第一焊接线的延伸方向交叉的方向放置。 第一接合线的延伸方向与第二接合线的延伸方向相交。