METHODS OF FORMING REPLACEMENT GATE STRUCTURES ON TRANSISTOR DEVICES

    公开(公告)号:US20190131429A1

    公开(公告)日:2019-05-02

    申请号:US15797837

    申请日:2017-10-30

    Abstract: One illustrative method disclosed herein includes, among other things, forming a sacrificial gate structure above a semiconductor substrate, the sacrificial gate structure comprising a sacrificial gate insulation layer and a sacrificial gate electrode material, performing a first gate-cut etching process to thereby form an opening in the sacrificial gate electrode material and forming an internal sidewall spacer in the opening. In this example, the method also includes, after forming the internal sidewall spacer, performing a second gate-cut etching process through the opening, the second gate-cut etching process being adapted to remove the sacrificial gate electrode material, performing an oxidizing anneal process and forming an insulating material in at least the opening.

    Methods of forming replacement gate structures on transistor devices

    公开(公告)号:US10453936B2

    公开(公告)日:2019-10-22

    申请号:US15797837

    申请日:2017-10-30

    Abstract: One illustrative method disclosed herein includes, among other things, forming a sacrificial gate structure above a semiconductor substrate, the sacrificial gate structure comprising a sacrificial gate insulation layer and a sacrificial gate electrode material, performing a first gate-cut etching process to thereby form an opening in the sacrificial gate electrode material and forming an internal sidewall spacer in the opening. In this example, the method also includes, after forming the internal sidewall spacer, performing a second gate-cut etching process through the opening, the second gate-cut etching process being adapted to remove the sacrificial gate electrode material, performing an oxidizing anneal process and forming an insulating material in at least the opening.

    Multi-layer spacer used in finFET
    16.
    发明授权
    Multi-layer spacer used in finFET 有权
    用于finFET的多层间隔物

    公开(公告)号:US09419101B1

    公开(公告)日:2016-08-16

    申请号:US14932394

    申请日:2015-11-04

    Abstract: A method of forming spacers and the resulting fin-shaped field effect transistors are provided. Embodiments include forming a silicon (Si) fin over a substrate; forming a polysilicon gate over the Si fin; and forming a spacer on top and side surfaces of the polysilicon gate, and on exposed upper and side surfaces of the Si fin, the spacer including: a first layer and second layer having a first dielectric constant, and a third layer formed between the first and second layers and having a second dielectric constant, wherein the second dielectric constant is lower than the first dielectric constant.

    Abstract translation: 提供了形成间隔物的方法和所得的鳍状场效应晶体管。 实施例包括在衬底上形成硅(Si)鳍; 在Si鳍上形成多晶硅栅极; 以及在所述多晶硅栅极的顶表面和侧表面上形成间隔物,并且在所述Si鳍的暴露的上表面和外表面上,所述间隔物包括:具有第一介电常数的第一层和第二层,以及形成在所述第一 和第二层并具有第二介电常数,其中第二介电常数低于第一介电常数。

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