公开(公告)号：US11677060B2

公开(公告)日：2023-06-13

申请号：US17228310

申请日：2021-04-12

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Jiho Joo ,  Yong Sung Eom ,  Gwang-Mun Choi ,  Kwang-Seong Choi ,  Chanmi Lee ,  Ki Seok Jang

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/56 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/27 ,  H01L24/81 ,  H01L24/83 ,  H01L33/56 ,  H01L25/0753 ,  H01L2224/2712 ,  H01L2224/2919 ,  H01L2224/8112 ,  H01L2224/8122 ,  H01L2224/83909 ,  H01L2924/0715 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.

公开(公告)号：US11488841B2

公开(公告)日：2022-11-01

申请号：US16795009

申请日：2020-02-19

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yong Sung Eom ,  Kwang-Seong Choi ,  Ki Seok Jang ,  Seok-Hwan Moon ,  Jiho Joo

IPC: H01L21/50 ,  H01L23/00 ,  H01L21/48 ,  H01L21/60

Abstract: Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.

公开(公告)号：US20140159547A1

公开(公告)日：2014-06-12

申请号：US13864341

申请日：2013-04-17

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Chi Hoon JUN ,  Sang Choon Ko ,  Seok-Hwan Moon ,  Kwang-Seong Choi

IPC: H02N2/18

CPC classification number: H01L41/1136 ,  H02N2/186

Abstract: The present inventive concept discloses an impact-type piezoelectric micro power generator. The impact-type piezoelectric micro power generator may comprise a base having a cavity and at least one stop area adjacent to the cavity; a frame fastened to the base; a vibrating body comprising a plurality of first vibrating beams extended from the frame toward a top of the cavity, an impact beam connected to between first tips of the plurality of first vibrating beams and extended onto the stop area, and a second vibrating beam extended from the impact beam to between the plurality of first vibrating beams, the second vibrating beam having a second tip; and a piezoelectric device disposed on one of a top and a bottom of the second vibrating beam and the impact beam, the piezoelectric device generating electric power according to impacts of the vibrating body to the stop area and bending of the impact beam and the second vibrating beam.

Abstract translation: 本发明构思公开了一种冲击式压电微型发电机。 冲击型压电微型发电机可以包括具有空腔的基座和与空腔相邻的至少一个止动区域; 固定在基座上的框架; 振动体，包括从所述框架朝向所述空腔的顶部延伸的多个第一振动梁，连接到所述多个第一振动梁的第一末端之间并延伸到所述停止区域上的冲击梁，以及从所述第二振动梁延伸的第二振动梁 所述冲击梁到达所述多个第一振动梁之间，所述第二振动梁具有第二尖端; 以及设置在所述第二振动梁和所述冲击梁的顶部和底部中的一个上的压电装置，所述压电装置根据所述振动体对所述停止区域的冲击产生电力，并且所述冲击梁和所述第二振动 光束。

公开(公告)号：US20130334291A1

公开(公告)日：2013-12-19

申请号：US13760350

申请日：2013-02-06

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yong Sung EOM ,  Kwang-Seong Choi ,  Jung Hyun Noh

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/11442 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/13601 ,  H01L2224/13655 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/81024 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/83192 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01029

Abstract: Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.

Abstract translation: 公开了一种在精细间距PCB上焊盘上形成焊料的方法以及使用该焊料的半导体器件的倒装芯片接合方法。 在精细间距PCB上的焊盘上形成焊料的方法包括：将具有预定厚度的焊料凸块制造商（SBM）浆料施加到包括金属焊盘和焊接掩模的PCB的整个表面; 在高于SBM糊料中所含焊料熔点的温度下加热SBM糊料，然后冷却SBM糊料以在焊盘上形成焊料; 并使用溶剂洗涤残留的聚合物树脂和SBM糊的残留焊料颗粒。