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公开(公告)号：US12206056B2
公开(公告)日：2025-01-21
申请号：US17399754
申请日：2021-08-11
Inventor： Kwang-Seong Choi , Yong Sung Eom , Jiho Joo , Gwang-Mun Choi , Seok-Hwan Moon , Chanmi Lee , Ki Seok Jang
Abstract: Provided is a method of fabricating a semiconductor package. The method of fabricating the semiconductor package include preparing a lower element including a lower substrate, a lower electrode, an UBM layer, and a reducing agent layer, providing an upper element including an upper substrate, an upper electrode, and a solder bump layer, providing a pressing member on the upper substrate to press the upper substrate to the lower substrate, and providing a laser beam passing through the pressing member to bond the upper element to the lower element.
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公开(公告)号：US11677060B2
公开(公告)日：2023-06-13
申请号：US17228310
申请日：2021-04-12
Inventor： Jiho Joo , Yong Sung Eom , Gwang-Mun Choi , Kwang-Seong Choi , Chanmi Lee , Ki Seok Jang
IPC: H01L33/62 , H01L23/00 , H01L33/56 , H01L25/075
CPC classification number: H01L33/62 , H01L24/27 , H01L24/81 , H01L24/83 , H01L33/56 , H01L25/0753 , H01L2224/2712 , H01L2224/2919 , H01L2224/8112 , H01L2224/8122 , H01L2224/83909 , H01L2924/0715 , H01L2924/12041 , H01L2933/005 , H01L2933/0066
Abstract: Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.
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公开(公告)号：US11488841B2
公开(公告)日：2022-11-01
申请号：US16795009
申请日：2020-02-19
Inventor： Yong Sung Eom , Kwang-Seong Choi , Ki Seok Jang , Seok-Hwan Moon , Jiho Joo
Abstract: Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
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公开(公告)号：US09490198B1
公开(公告)日：2016-11-08
申请号：US14958927
申请日：2015-12-03
Inventor： Yong Sung Eom
IPC: H01L23/52 , H01L23/498 , H01L23/367 , H01L25/16
CPC classification number: H01L23/49827 , H01L23/13 , H01L23/367 , H01L23/49811 , H01L23/49866 , H01L23/5384 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/065 , H01L2223/6677 , H01L2224/131 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/83192 , H01L2224/92225 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2225/06589 , H01L2924/00014 , H01L2924/157 , H01L2924/15788 , H01L2924/16235 , H01L2924/16251 , H01L2924/3511 , H01L2924/37001 , H01L2924/014 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: Provided is a transmitter and receiver package including an interposer substrate including a top surface, a bottom surface facing the top surface, and a through-via, semiconductor devices mounted on the top surface of the interposer substrate, an exothermic element mounted on the bottom surface of the interposer substrate, and a heat dissipation member disposed on the bottom surface of the interposer substrate, the heat dissipation member being configured to cover the exothermic element.
Abstract translation: 提供了一种发送器和接收器封装，其包括包括顶表面，面向顶表面的底表面的插入器基板和安装在插入器基板的顶表面上的通孔半导体器件，安装在底表面上的放热元件 所述散热构件设置在所述插入器基板的底面上，所述散热构件被构造成覆盖所述放热元件。
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