Abstract:
Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.
Abstract:
Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.
Abstract:
One embodiment relates to an apparatus which utilizes an electron beam for inspection or metrology of a substrate. The apparatus includes a CRT-type gun and deflectors to generate and scan the electron beam. The CRT-type gun may optionally be in a sealed vacuum. Another embodiment relates to a method of inspecting a substrate or measuring an aspect of the substrate. The method includes focusing an electron beam using electrostatic lenses formed by metal plates supported by and separated by fused glass beads or other insulating material. Other embodiments and features are also disclosed.
Abstract:
A system, method, and associated computer product improve the search of multidimensional databases. The present system determines a near-optimal grid index that is used to locate a geometric shape in a spatial database. More particularly, the present system improves the technique of sampling data for defining the grid cell size in a grid for a given data set, minimizing the number times the data set needs to be sampled, thereby reducing the time to compute the cost of alternative grid index parameters.
Abstract:
Techniques of querying an index of first objects comprised of a plurality of index entries and a pool of second objects are provided. The techniques include evaluating the index of the first objects to produce a group of one or more possible candidates based on whether one or more index entries of the first objects satisfy a query, adding second objects from the pool to said group of possible candidates to produce an interim group of possible candidates, filtering the interim group of possible candidates by comparing approximations of the candidates of the interim group with the query to produce filtered candidate objects, and determining if the filtered candidate objects satisfy the query by comparing the first and second objects corresponding to the filtered candidate objects with the query.
Abstract:
A method and apparatus for inspection and review of defects is disclosed wherein data gathering is improved. In one embodiment, multiple or segmented detectors are used in a particle beam system.
Abstract:
One embodiment relates to an apparatus using electrons for inspection or metrology of a semiconductor substrate. The apparatus includes an electron source, electron lenses, scan deflectors, an objective electron lens, a collection electron lens, a pin-hole filter, de-scan deflectors, and a detector. The collection electron lens is configured to focus the secondary electrons so as to form a secondary electron beam which is focused at a conjugate focal plane, and the pin-hole filter is positioned at the conjugate focal plane. The de-scan deflectors are configured to controllably deflect the secondary electrons so as to counteract an influence of the scan deflectors such that a center portion of the secondary electron beam passes through the filter and a remainder portion of the secondary electron beam is filtered out by the filter. Other embodiments and features are also disclosed.
Abstract:
A method and apparatus for inspection and review of defects is disclosed wherein data gathering is improved. In one embodiment, multiple or segmented detectors are used in a particle beam system.
Abstract:
A method and apparatus for inspection and review of defects is disclosed wherein data gathering is improved. In one embodiment, multiple or segmented detectors are used in a particle beam system.
Abstract:
The present invention relates to polynucleotide and polypeptide molecules for zamp1, a novel member of the β-defensin family. The polypeptides, and polynucleotides encoding them, exhibit anti-microbial activity and may be used in the study or treatment of microbial infections. The present invention also includes antibodies to the zamp1 polypeptides.