公开(公告)号：US20240085361A1

公开(公告)日：2024-03-14

申请号：US18515508

申请日：2023-11-21

Applicant: CORNING INCORPORATED

Inventor： Shrisudersan Jayaraman ,  Navaneetha Krishnan Subbaiyan

IPC: G01N27/28 ,  C03C17/06 ,  C03C17/10 ,  G01N27/36 ,  H01L23/498

CPC classification number: G01N27/283 ,  C03C17/06 ,  C03C17/10 ,  G01N27/36 ,  H01L23/49827 ,  C03C2218/34

Abstract: A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.

公开(公告)号：US11846597B2

公开(公告)日：2023-12-19

申请号：US16959236

申请日：2018-12-28

Applicant: CORNING INCORPORATED

Inventor： Shrisudersan Jayaraman ,  Navaneetha Krishnan Subbaiyan

IPC: G01N27/28 ,  C03C17/10 ,  C03C17/06 ,  H01L23/498 ,  G01N27/36

CPC classification number: G01N27/283 ,  C03C17/06 ,  C03C17/10 ,  G01N27/36 ,  H01L23/49827 ,  C03C2218/34

Abstract: A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.

公开(公告)号：US20210092843A1

公开(公告)日：2021-03-25

申请号：US17111144

申请日：2020-12-03

Applicant: Corning Incorporated

Inventor： Shrisudersan Jayaraman

IPC: H05K1/11 ,  H01L23/15 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/16 ,  H05K3/38 ,  H05K3/42

Abstract: An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.

公开(公告)号：US20170287728A1

公开(公告)日：2017-10-05

申请号：US15471401

申请日：2017-03-28

Applicant: CORNING INCORPORATED

Inventor： Rachel Eileen Dahlberg ,  Shrisudersan Jayaraman

IPC: H01L21/48 ,  C25D7/12 ,  C25D3/38 ,  H01L21/683 ,  H01L23/498

CPC classification number: H01L21/486 ,  C25D1/003 ,  C25D1/04 ,  C25D3/38 ,  C25D5/022 ,  C25D5/54 ,  C25D7/12 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/6835 ,  H01L21/76879 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2221/68359

Abstract: Methods of metalizing vias within a substrate are disclosed. In one embodiment, a method of metalizing vias includes disposing a substrate onto a growth substrate. The substrate includes a first surface, a second surface, and at least one via. The first surface or the second surface of the substrate directly contacts a surface of the growth substrate, and the surface of the growth substrate is electrically conductive. The method further includes applying an electrolyte to the substrate such that the electrolyte is disposed within the at least one via. The electrolyte includes metal ions of a metal to be deposited within the at least one via. The method also includes positioning an electrode within the electrolyte, and applying a current and/or a voltage between the electrode and the substrate, thereby reducing the metal ions into the metal on the surface of the growth substrate within the at least one via.

公开(公告)号：US20160099115A1

公开(公告)日：2016-04-07

申请号：US14508561

申请日：2014-10-07

Applicant: Corning Incorporated

Inventor： Shrisudersan Jayaraman ,  Rahul Suryakant Kadam ,  Steven Isaac Massey ,  Shivani Rao Polasani

IPC: H01G11/62

CPC classification number: H01G11/62 ,  H01G11/60 ,  H01M10/052 ,  H01M10/0568 ,  H01M10/0569 ,  H01M2300/0025 ,  Y02E60/13

Abstract: An electrolyte composition, including: an electrolyte comprising a conductive salt; and a mixture comprising an alkyl nitrile and an alkyl dinitrile, wherein the electrolyte composition has a depressed vapor pressure at 85° C., as defined herein. Also disclosed is an article incorporating the electrolyte composition and methods for making and using the article at elevated temperatures.

Abstract translation: 一种电解质组合物，包括：包含导电盐的电解质; 和包含烷基腈和烷基二腈的混合物，其中如本文所定义的，电解质组合物具有85℃的蒸汽压降低。 还公开了一种结合电解质组合物和在高温下制造和使用制品的方法的制品。