公开(公告)号：US20220319868A1

公开(公告)日：2022-10-06

申请号：US17641540

申请日：2020-09-09

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Robert George Manley ,  Rajesh Vaddi

IPC: H01L21/48 ,  H01L23/15 ,  H01L23/538 ,  H01L21/768 ,  H01L21/306

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

公开(公告)号：US11282994B2

公开(公告)日：2022-03-22

申请号：US16756692

申请日：2018-10-16

Applicant: CORNING INCORPORATED

Inventor： Jiangwei Feng ,  Sean Matthew Garner ,  Jen-Chieh Lin ,  Robert George Manley ,  Timothy James Orsley ,  Richard Curwood Peterson ,  Michael Lesley Sorensen ,  Pei-Lien Tseng ,  Rajesh Vaddi ,  Lu Zhang

IPC: H01L33/62 ,  H01L27/15

Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.

公开(公告)号：US11257728B2

公开(公告)日：2022-02-22

申请号：US16618602

申请日：2018-05-31

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Rajesh Vaddi

IPC: H01L23/13 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L33/48 ,  C03C15/00 ,  C03C17/02 ,  H01L25/075

Abstract: Embodiments are related to substrates having one or more well structures each exhibiting substantially vertical sidewalls and substantially planar bottoms.

公开(公告)号：US10957628B2

公开(公告)日：2021-03-23

申请号：US16592065

申请日：2019-10-03

Applicant: Corning Incorporated

Inventor： Robert Alan Bellman ,  Rajesh Vaddi

IPC: H01L23/48 ,  H01L23/485

Abstract: A method for producing a conductive through-via, including applying a seed layer on a surface of a first substrate, and forming a surface modification layer on at least one of the seed layer and a second substrate. Next, the second substrate is bonded to the first substrate with the surface modification layer to form an assembly. A conductive release layer is formed in the at least one through-via by placing a conductive release material into the at least one through-via. The conductive release layer is present on the seed layer and in the at least one through-via. A conductive metal material is applied to the at least one through-via, and the second substrate is removed from the assembly after applying the conductive metal material to the at least one through via.

公开(公告)号：US20200165160A1

公开(公告)日：2020-05-28

申请号：US16776663

申请日：2020-01-30

Applicant: CORNING INCORPORATED

Inventor： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: C03C17/06 ,  C23C18/38 ,  H05K1/03 ,  H01L23/498 ,  H01L23/15 ,  C23C14/18 ,  H01L21/768 ,  H05K1/11 ,  C23C28/02 ,  H05K1/02 ,  C25D7/12

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US20200148593A1

公开(公告)日：2020-05-14

申请号：US16666876

申请日：2019-10-29

Applicant: Corning Incorporated

Inventor： Hoon Kim ,  Prantik Mazumder ,  Aram Rezikyan ,  Rajesh Vaddi

IPC: C03C27/04 ,  C03C17/36 ,  C03C17/245

Abstract: In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnOx) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

公开(公告)号：US20210407896A1

公开(公告)日：2021-12-30

申请号：US17470519

申请日：2021-09-09

Applicant: CORNING INCORPORATED

Inventor： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: H01L23/498 ,  H05K1/02 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H05K1/03 ,  H05K1/11 ,  H01L21/768 ,  H01L23/15 ,  C03C17/06 ,  H01L23/48 ,  C03C3/06 ,  C03C15/00 ,  C03C23/00 ,  H05K3/38

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US20210359185A1

公开(公告)日：2021-11-18

申请号：US17286271

申请日：2019-10-09

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Patrick Scott Leslie ,  Barada Kanta Nayak ,  Michael Lesley Sorensen ,  Rajesh Vaddi

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/44 ,  H01L25/16 ,  B23K26/55 ,  B23K26/16

Abstract: A device includes a glass substrate, a plurality of electronic components, a metallization layer, and a plurality of vias. The plurality of electronic components are on a first surface of the glass substrate. The metallization layer is on a second surface of the glass substrate opposite to the first surface. The plurality of vias extend through the glass substrate. At least one via is in electrical communication with an electronic component and the metallization layer.

公开(公告)号：US20210320041A1

公开(公告)日：2021-10-14

申请号：US17217027

申请日：2021-03-30

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Philip Simon Brown ,  Mandakini Kanungo ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: H01L23/15 ,  H01L23/498 ,  H01L21/48 ,  C23C26/00

Abstract: A method of manufacturing a glass article comprises: (A) forming a first layer of catalyst metal on a glass substrate; (B) heating the glass substrate; (C) forming a second layer of an alloy of a first metal and a second metal on the first layer; (D) heating the glass substrate, thereby forming a glass article comprising: (i) the glass substrate; (ii) an oxide of the first metal covalently bonded thereto; and (iii) a metallic region bonded to the oxide, the metallic region comprising the catalyst, first, and second metals. In embodiments, the method further comprises (E) forming a third layer of a primary metal on the metallic region; and (F) heating the glass article thereby forming the glass article comprising: (i) the oxide of the first metal covalently bonded the glass substrate; and (ii) a new metallic region bonded to the oxide comprising the catalyst, first, second, and primary metals.

公开(公告)号：US20210018780A1

公开(公告)日：2021-01-21

申请号：US17040073

申请日：2019-03-26

Applicant: CORNING INCORPORATED

Inventor： Ming-Huang Huang ,  Robert Bumju Lee ,  Rajesh Vaddi ,  Bin Zhu

IPC: G02F1/1368 ,  H01L29/786

Abstract: A thin film transistor (TFT) liquid crystal display (LCD) comprises a plurality of image pixels demarcated between an overlying liquid crystal display layer and an underlying glass substrate. Each image pixel comprises a dedicated top-gate TFT disposed over the glass substrate. Each top-gate thin film transistor comprises a process sensitive semiconductor layer disposed over the glass substrate, and a source electrode and a drain electrode disposed over the process sensitive semiconductor layer. The process sensitive semiconductor layer forms a process sensitive semiconductor active layer between the source electrode and the drain electrode and an active layer protection film is disposed over the process sensitive semiconductor active layer. A gate dielectric layer is disposed over the active layer protection film between the source electrode and the drain electrode and a gate electrode is disposed over the gate dielectric layer.