公开(公告)号：US11287245B2

公开(公告)日：2022-03-29

申请号：US16868423

申请日：2020-05-06

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Amendra Koul ,  Yaochao Yang ,  Mike Sapozhnikov ,  Joel Richard Goergen ,  Kartheek Nalla

IPC: G01B11/24 ,  G01N21/956 ,  G01B11/26 ,  H05K3/00

Abstract: In one embodiment, a method includes inspecting a layer of a printed circuit board through an inspection window comprising an opening formed in one or more other layers of the printed circuit board and identifying a location of a trace aligned with the inspection window, relative to a marker in a fiber bundle of a fiber weave to assess fiber weave skew.

公开(公告)号：US20200263976A1

公开(公告)日：2020-08-20

申请号：US16868383

申请日：2020-05-06

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Amendra Koul ,  Yaochao Yang ,  Mike Sapozhnikov ,  Joel Richard Goergen ,  Kartheek Nalla

IPC: G01B11/24 ,  H05K3/00 ,  G01B11/26 ,  G01N21/956

Abstract: In one embodiment, a method includes inspecting a fiber weave for use in a printed circuit board with an automated optical inspection tool and identifying a distance between fiber bundles in the fiber weave. The fiber weave comprises a plurality of the fiber bundles woven to form the fiber weave and a portion of the fiber bundles comprise markers and identifying a distance between the fiber bundles in the fiber weave comprises measuring a distance between the markers.

公开(公告)号：US10684123B2

公开(公告)日：2020-06-16

申请号：US15872163

申请日：2018-01-16

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Amendra Koul ,  Yaochao Yang ,  Mike Sapozhnikov ,  Joel Richard Goergen ,  Kartheek Nalla

IPC: G01B11/04 ,  G01B11/24 ,  G01N21/956 ,  G01B11/26 ,  H05K3/00

Abstract: In one embodiment, a method generally comprises importing a layout identifying routing information for a plurality of differential pair traces on a printed circuit board at a skew assessment module, receiving values for a plurality of skew parameters associated with fiber weave skew, receiving variation parameters from a database comprising data collected on fiber weave variation for one or more of the skew parameters, calculating a skew estimate for the printed circuit board based on the skew parameters and the variation parameters at the skew assessment module, and determining if the skew estimate is within a specified skew allowance for the printed circuit board.