-
公开(公告)号：US20190000422A1
公开(公告)日：2019-01-03
申请号：US16022841
申请日：2018-06-29
Applicant: Butterfly Network, Inc.
Inventor： Lawrence C. West , Kailiang Chen , Tyler S. Ralston , Sarp Satir , Jaime Scott Zahorian
Abstract: Ultrasound devices configured to perform high-intensity focused ultrasound (HIFU) are described. An ultrasound device may include HIFU units configured to emit high acoustic intensities and elasticity detectors configured to determine characteristics of the target area of a human body based on the elasticity of the target area. The elasticity detectors may determine, e.g., whether the target area is healthy, and if not, the type cell in need of treatment (e.g., the type of cancer cell present in the target area). In one example, the elasticity detectors may be configured to determine the stiffness of the target area, which may provide an indication as to the type of cell present in the area, by estimating the velocity of a shear wave propagating away from the target area. The shear wave may arise in response to the application of an ultrasound wave to the target area.
-
公开(公告)号：US20180257927A1
公开(公告)日：2018-09-13
申请号：US15453846
申请日：2017-03-08
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Jaime Scott Zahorian
CPC classification number: B81C1/00238 , B06B1/0292 , B06B1/0622 , B81B7/008 , B81B2201/038 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81B2207/07 , B81C2201/013 , B81C2203/0118 , B81C2203/0792
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
-
13.发明申请公开(公告)号：US20170157646A1
公开(公告)日：2017-06-08
申请号：US14957098
申请日：2015-12-02
Applicant: Butterfly Network, Inc.
Inventor： Susan A. Alie , Jaime Scott Zahorian , Kailiang Chen
IPC: B06B1/02
CPC classification number: B06B1/02 , B06B1/0292
Abstract: Electrical biasing of ultrasonic transducers of an ultrasound device is described. The ultrasonic transducers may be capacitive micromachined ultrasonic transducers (CMUTs). The ultrasonic transducers may be grouped together, with the different groups receiving different bias voltages. The bias voltages for the various groups of ultrasonic transducers may be selected to account for differences between the groups.
-
公开(公告)号：US20200163654A1
公开(公告)日：2020-05-28
申请号：US16696883
申请日：2019-11-26
Applicant: Butterfly Network, Inc.
Inventor： Sarp Satir , Jaime Scott Zahorian
Abstract: The disclosed embodiments relate to a capacitive micromachined transducers for ultrasound imaging having pressure calibrator to compensate for ultrasound image distortions caused by environmental pressure changes. In one embodiment, the disclosure relates to a method to calibrate a first ultrasound transducer of an array of ultrasound transducers for ambient pressure variation. The method includes the steps of detecting a real-time ambient pressure value; determining a pressure difference value between the detected ambient pressure value and a predetermined pressure value; and calibrating the first ultrasound transducers to compensate for the determined pressure difference.
-
公开(公告)号：US20200066966A1
公开(公告)日：2020-02-27
申请号：US16666238
申请日：2019-10-28
Applicant: Butterfly Network Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Jaime Scott Zahorian , Paul Francis Cristman , Keith G. Fife
IPC: H01L41/27 , H05K3/36 , H01L41/047 , B06B1/06 , B06B1/02
Abstract: An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.
-
Patent Agency Ranking
16.发明授权公开(公告)号：US10272471B2
公开(公告)日：2019-04-30
申请号：US15970987
申请日：2018-05-04
Applicant: Butterfly Network, Inc.
Inventor： Susan A. Alie , Jaime Scott Zahorian , Kailiang Chen
Abstract: Electrical biasing of ultrasonic transducers of an ultrasound device is described. The ultrasonic transducers may be capacitive micromachined ultrasonic transducers (CMUTs). The ultrasonic transducers may be grouped together, with the different groups receiving different bias voltages. The bias voltages for the various groups of ultrasonic transducers may be selected to account for differences between the groups.
-
公开(公告)号：US20190047850A1
公开(公告)日：2019-02-14
申请号：US16158999
申请日：2018-10-12
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Jaime Scott Zahorian
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
-
18.发明申请公开(公告)号：US20180353995A1
公开(公告)日：2018-12-13
申请号：US15970987
申请日：2018-05-04
Applicant: Butterfly Network, Inc.
Inventor： Susan A. Alie , Jaime Scott Zahorian , Kailiang Chen
IPC: B06B1/02
CPC classification number: B06B1/02 , B06B1/0292
Abstract: Electrical biasing of ultrasonic transducers of an ultrasound device is described. The ultrasonic transducers may be capacitive micromachined ultrasonic transducers (CMUTs). The ultrasonic transducers may be grouped together, with the different groups receiving different bias voltages. The bias voltages for the various groups of ultrasonic transducers may be selected to account for differences between the groups.
-
19.发明授权公开(公告)号：US09987661B2
公开(公告)日：2018-06-05
申请号：US14957098
申请日：2015-12-02
Applicant: Butterfly Network, Inc.
Inventor： Susan A. Alie , Jaime Scott Zahorian , Kailiang Chen
CPC classification number: B06B1/02 , B06B1/0292
Abstract: Electrical biasing of ultrasonic transducers of an ultrasound device is described. The ultrasonic transducers may be capacitive micromachined ultrasonic transducers (CMUTs). The ultrasonic transducers may be grouped together, with the different groups receiving different bias voltages. The bias voltages for the various groups of ultrasonic transducers may be selected to account for differences between the groups.
-
公开(公告)号：US20170360414A1
公开(公告)日：2017-12-21
申请号：US15631729
申请日：2017-06-23
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife , David Elgena
CPC classification number: A61B8/4477 , A61B8/0883 , A61B8/0891 , A61B8/12 , A61B8/4236 , A61B8/4427 , A61B8/4444 , A61B8/4472 , A61B8/4494 , A61B8/465 , A61B8/467 , A61B8/483 , A61B8/485 , A61B8/488 , A61B8/5207 , A61B8/54 , A61B8/56 , B06B1/0292 , B06B1/0622
Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.
-
-
-
-
-
-
-
-
-
Search Results
21
records
(took 0.025 seconds)
