Method of making multilayer base heterojunction device having one of
base layer as a diffusion barrier between base-emitter junction
    12.
    发明授权
    Method of making multilayer base heterojunction device having one of base layer as a diffusion barrier between base-emitter junction 失效
    制造具有基极层之一作为基极 - 发射极之间的扩散阻挡层的多层基底异质结装置的方法

    公开(公告)号:US5468658A

    公开(公告)日:1995-11-21

    申请号:US164641

    申请日:1993-12-07

    摘要: This is a p-n junction device and the device comprises: a substrate 10 composed of a semiconductor material; a heavily doped n type sub-collector layer 14 over the substrate; a n type collector layer 16 over the sub-collector layer; a heavily doped p type first base layer 18, over the collector layer; a p type second base layer 20, substantially thinner than the first base layer, over the first base layer, with the second base layer being less heavily doped than the first base layer; and a n type emitter layer 24 over the second base layer, whereby, the second base layer serves as a diffusion barrier between the base and the emitter. Other devices and methods are also disclosed.

    摘要翻译: 这是p-n结器件,该器件包括:由半导体材料构成的衬底10; 在衬底上方的重掺杂n型子集电极层14; 在副集电极层上方的n型集电极层16; 在集电极层上方的重掺杂p型第一基极层18; 在第一基底层上的基本上比第一基底层薄的p型第二基底层20,第二基底层比第一基底层重掺杂; 以及在第二基极层上的n型发射极层24,由此,第二基极层用作基极和发射极之间的扩散阻挡层。 还公开了其它装置和方法。

    Multilayer base heterojunction bipolar transistor
    14.
    发明授权
    Multilayer base heterojunction bipolar transistor 失效
    多层基底异相双极晶体管

    公开(公告)号:US5132764A

    公开(公告)日:1992-07-21

    申请号:US672809

    申请日:1991-03-21

    摘要: This is a p-n junction device and the device comprises: a substrate 10 composed of a semiconductor material; a heavily doped n type sub-collector layer 14 over the substrate; a n type collector layer 16 over the sub-collector layer; a heavily doped p type first base layer 18, over the collector layer; a p type second base layer 20, substantially thinner than the first base layer, over the first base layer, with the second base layer being less heavily doped than the first base layer; and a n type emitter layer 24 over the second base layer, whereby, the second base layer serves as a diffusion barrier between the base and the emitter. Other devices and methods are also disclosed.

    Periodic negative resistance microwave structures and amplifier and
oscillator embodiments thereof
    15.
    发明授权
    Periodic negative resistance microwave structures and amplifier and oscillator embodiments thereof 失效
    周期性负阻微波结构及其放大器和振荡器实施例

    公开(公告)号:US4706041A

    公开(公告)日:1987-11-10

    申请号:US868212

    申请日:1986-05-28

    CPC分类号: H03B9/143 Y10S257/926

    摘要: Structures (30) with IMPATT type diodes (34) located periodically along a transmission line (38-32) to simulate a distributed diode are disclosed. Preferred embodiments include incorporation of the periodic diode structures as the gain element of microwave amplifiers and oscillators. Preferred embodiments also place capacitors between the diodes to fix nodes in the electric field and increase the effective structure size.

    摘要翻译: 公开了具有沿着传输线(38-32)周期定位以模拟分布式二极管的IMPATT型二极管(34)的结构(30)。 优选实施例包括结合周期性二极管结构作为微波放大器和振荡器的增益元件。 优选实施例还将二极管之间的电容器放置在电场中以固定节点并增加有效结构尺寸。

    Fabrication Method for ZnO Thin Film Transistors Using Etch-stop Layer
    17.
    发明申请
    Fabrication Method for ZnO Thin Film Transistors Using Etch-stop Layer 有权
    使用蚀刻停止层的ZnO薄膜晶体管的制造方法

    公开(公告)号:US20130095606A1

    公开(公告)日:2013-04-18

    申请号:US13271310

    申请日:2011-10-12

    IPC分类号: H01L21/336 H01L21/302

    CPC分类号: H01L29/7869

    摘要: A method is provided for fabricating a thin film transistor. A plurality of layers is deposited on a substrate. The plurality of layers includes a conductive gate contact layer, a gate insulator layer, an undoped channel layer, an etch-stop layer, and a conductive contact layer. The etch-stop layer is positioned between the conductive contact layer and the undoped channel layer. A portion of the conductive contact layer is selectively removed while removal of a portion of the undoped channel layer is prevented by the etch-stop layer during the selective removal. A portion of the etch-stop layer is selectively removed and an exposed portion of the etch-stop layer is converted from a conductor to an insulator by oxidizing the exposed portion of the etch-stop layer in air. A portion of remaining layers of the plurality of layers is selectively removed to form the thin film transistor.

    摘要翻译: 提供了制造薄膜晶体管的方法。 多个层被沉积在基底上。 多个层包括导电栅极接触层,栅极绝缘体层,未掺杂沟道层,蚀刻停止层和导电接触层。 蚀刻停止层位于导电接触层和未掺杂沟道层之间。 导电接触层的一部分被选择性地去除,同时在选择性去除期间通过蚀刻停止层防止去除一部分未掺杂沟道层。 蚀刻停止层的一部分被选择性地去除,并且通过在空气中氧化蚀刻停止层的暴露部分,蚀刻停止层的暴露部分由导体转变成绝缘体。 选择性地去除多个层中的剩余层的一部分以形成薄膜晶体管。

    Integrated circuit and method
    18.
    发明授权
    Integrated circuit and method 失效
    集成电路及方法

    公开(公告)号:US5496755A

    公开(公告)日:1996-03-05

    申请号:US287378

    申请日:1994-08-08

    IPC分类号: H01L27/06 H01L21/70

    CPC分类号: H01L27/0605

    摘要: Integrated circuits and fabrication methods incorporating both two-terminal devices such as IMPATT diodes (446) and Schottky diodes (454) and three-terminal devices such as n-channel MESFETs (480) in a monolithic integrated circuit.

    摘要翻译: 集成电路和制造方法将双端器件如IMPATT二极管(446)和肖特基二极管(454)以及诸如n沟道MESFET(480)的三端器件并入单片集成电路中。

    Integrated circuit and method
    20.
    发明授权
    Integrated circuit and method 失效
    集成电路及方法

    公开(公告)号:US5347149A

    公开(公告)日:1994-09-13

    申请号:US443538

    申请日:1989-11-29

    CPC分类号: H01L27/0605

    摘要: Integrated circuits and fabrication methods incorporating both two-terminal devices such as IMPATT diodes (446) and Schottky diodes (454) and three-terminal devices such as n-channel MESFETs (480) in a monolithic integrated circuit.

    摘要翻译: 集成电路和制造方法将双端器件如IMPATT二极管(446)和肖特基二极管(454)以及诸如n沟道MESFET(480)的三端器件并入单片集成电路中。