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    Structures and processes to create a desired probetip contact geometry on a wafer test probe
    12.
    发明授权
    Structures and processes to create a desired probetip contact geometry on a wafer test probe 失效
    在晶圆测试探针上创建所需的先天触点几何形状的结构和过程

    公开(公告)号：US06206273B1

    公开(公告)日：2001-03-27

    申请号：US09251864

    申请日：1999-02-17

    Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

    Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

    IPC: B23K3100

    CPC classification number: G01R1/0675 ,  G01R1/07314 ,  G01R3/00 ,  Y10T29/4914

    Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are formed by cutting with one or more blades. The shape of the blades determines the shape of the probetips. The probetips can be coated with other conductive materials to enhance the hardness and profile of protuberances formed at the probetip ends by the blade-cutting process. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

    Abstract translation: 本发明涉及一种高密度测试探针，其提供用于测试晶片形式的高密度和高性能集成电路或作为离散芯片的装置。 测试探针由细长电导体的密集阵列形成，其通过用一个或多个刀片切割形成。 叶片的形状决定了先兆的形状。 可以使用其他导电材料涂覆先知，以通过叶片切割工艺增强在突齿端部处形成的突起的硬度和轮廓。 电线与接触位置阵列一样密集。 围绕着向外突出的线的阵列设置模具。 液体弹性体设置在模具中以填充电线之间的空间。 弹性体被固化并且模具被去除，留下布置在弹性体中并与空间变压器电接触的线阵列。 空间变压器可以具有一个引脚阵列，它们在空间变压器的与细长导体所接合的相反的表面上。 这些销插入第二空间变压器（例如印刷电路板）上的插座中以形成探针组件。 或者，插入器电连接器可以设置在第一和第二空间变压器之间。

    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
    20.
    发明申请
    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF 审中-公开

    公开(公告)号：US20080116916A1

    公开(公告)日：2008-05-22

    申请号：US11929924

    申请日：2007-10-30

    Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

    Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

    IPC: G01R1/02

    CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

    Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

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