公开(公告)号：US20180061911A1

公开(公告)日：2018-03-01

申请号：US15528422

申请日：2016-05-25

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jie Sun ,  Yanzhao Li ,  Chung-Chun Lee ,  Xiaoguang Xu ,  Zhuo Chen

IPC: H01L27/32 ,  H01L33/06 ,  H01L51/50 ,  H01L51/52 ,  H05B33/14 ,  C09K11/06

CPC classification number: H01L27/3225 ,  C09K11/06 ,  H01L27/3202 ,  H01L27/3209 ,  H01L33/06 ,  H01L51/502 ,  H01L51/5044 ,  H01L51/5056 ,  H01L51/5088 ,  H01L51/5278 ,  H05B33/14

Abstract: The present invention provides a light-emitting apparatus, a method for forming a light-emitting apparatus, and a display apparatus. The light-emitting apparatus comprises at least one OLED light-emitting unit and at least one quantum dot light-emitting unit, wherein the at least one quantum dot light-emitting unit and the at least one OLED light-emitting unit are arranged in series.

公开(公告)号：US10396237B2

公开(公告)日：2019-08-27

申请号：US15542234

申请日：2017-01-06

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Long Wang ,  Yanzhao Li ,  Chieh Hsing Chung ,  Jie Sun

IPC: H01L33/00 ,  H01L27/15 ,  H01L25/075

Abstract: A light-emitting diode substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method of a light-emitting diode (LED) substrate, including: disposing a supporting substrate supporting a plurality of LED units to be opposed to a receiving substrate so that a side of the supporting substrate facing the receiving substrate supports the plurality of LED units; and irradiating a side of the supporting substrate away from the receiving substrate with laser, stripping the LED units from the supporting substrate, and transferring the LED units onto the receiving substrate. The manufacturing method of the LED substrate can better transfer LED units from the supporting substrate onto the receiving substrate.

公开(公告)号：US20180108842A1

公开(公告)日：2018-04-19

申请号：US15540711

申请日：2016-10-21

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yanzhao Li ,  Zhuo Chen ,  Yuedi He ,  Jie Sun

IPC: H01L51/00 ,  H01L27/32 ,  G03F7/20 ,  G03F7/26 ,  G03F7/16 ,  G03F7/09

CPC classification number: H01L51/0018 ,  G03F7/0007 ,  G03F7/0047 ,  G03F7/094 ,  G03F7/105 ,  G03F7/162 ,  G03F7/2002 ,  G03F7/2022 ,  G03F7/26 ,  H01L21/77 ,  H01L27/12 ,  H01L27/32 ,  H01L27/3211 ,  H01L51/0032 ,  H01L51/0035 ,  H01L51/0037 ,  H01L51/0039 ,  H01L51/0077 ,  H01L51/0079 ,  H01L51/0092 ,  H01L51/50 ,  H01L51/502 ,  H01L51/52 ,  H01L51/56

Abstract: A crosslinkable quantum dot (QD) and a preparing method thereof, an array substrate made by using the crosslinkable quantum dot (QD) and a preparing method thereof are provided. The surface of the crosslinkable quantum dot has a pair of groups R1 and R2 capable of reacting to form a cross-linked network, or a group R3 capable of being cross-linked by a crosslinking agent to form a cross-linked network.