Abstract:
Provided are a semiconductor device and a method for manufacturing the same. The semiconductor device comprises an insulating layer and a metal oxide semiconductor layer which are adjacent to each other, and the insulating layer is formed by steps of: forming a first silicon oxide film; and stabilizing the first silicon oxide film by filling a silicon dangling bond therein with a filling atom capable of being bonded to the silicon dangling bond.
Abstract:
Embodiments of the present disclosure provide a display substrate having a display region and a frame region. The display substrate includes a plurality of display pixels and a plurality of dummy pixels arranged in an array; the display pixels are distributed in the display region; the dummy pixels are distributed in the frame region. Each display pixel includes a first pixel electrode and a first common electrode; and a first voltage difference exists between the first pixel electrode and the first common electrode. Each dummy pixel includes a second pixel electrode and a second common electrode; and a second voltage difference exists between the second pixel electrode and the second common electrode. A difference between the first voltage difference and the second voltage difference is less than a set value. Embodiments of the present disclosure further provides a display panel and a display apparatus.
Abstract:
An evaporation source includes a crucible, a heater, a heat adjusting assembly for convecting heat radiation between the heat adjusting assembly and the crucible body and including a first reflection plate and a second reflection plate, and a hollowed-out pattern provided in the second reflection plate. The crucible includes a crucible body having a top surface, a bottom surface and side surfaces connecting the top and the bottom surfaces; and a nozzle disposed on the top surface of the crucible body. The heater is disposed outside the crucible body for generating heat radiation. Wherein the first reflection is disposed on at least one side of the side surfaces of the crucible body, a gap exists between the first reflection plate and the crucible body; the second reflection plate is disposed under the bottom surface of the crucible body, a gap exists between the second reflection plate and the crucible body.
Abstract:
A back plate, a backlight module, a display device, and an assembly method of the backlight module are provided. The backlight module includes: a back plate, including a main body portion, the main body portion having a first main surface and a second main surface opposite to each other; and the main body portion being provided with a hollow structure; a light source, passing through the hollow structure from a second main surface side of the main body portion; a light guide plate, provided on the first main surface side of the main body portion of the back plate, wherein, the light-emitting portion of the light source includes a light emergent surface, and the light emergent surface faces a light incident surface of the light guide plate.
Abstract:
An array substrate provided according to the present disclosure may include: a base substrate; a gate electrode and a gate insulating layer sequentially formed on the base substrate; a semiconductor layer formed on the base substrate on which the gate insulating layer has been formed; and a source electrode and a drain electrode formed on the base substrate on which the semiconductor layer has been formed. The semiconductor layer may be connected to the source electrode and the drain electrode respectively. A first connection region in which a first connection point is located may be arranged between the semiconductor layer and the source electrode. And a second connection region in which a second connection point is located may be arranged between the semiconductor layer and the drain electrode. A length of a shortest distance on the semiconductor layer from the first connection point to the second connection point may be no less than a reference distance which refers to a longest distance of a straight line between any two points among all points on a perimeter of the gate electrode.
Abstract:
A barrier layer, a method for fabricating the same, a thin film transistor (TFT) and an array substrate are disclosed and related to display technology field. When the barrier layer (40) is applied to a TFT, it can block Cu atoms from diffusing to other layers, thereby reducing the harm to the performance of the TFT. The barrier layer (40) comprises at least two layers (401, 402) of conductive films; grain boundaries (70) in any layer (401, 402) of the conductive films are arranged in a staggered manner relative to grain boundaries (70) in another layer (401, 402) of the conductive films contacting therewith.
Abstract:
The example of present invention provides an array substrate, the method for manufacturing the same, and a liquid crystal display device, wherein the array substrate comprises: a gate electrode, a gate insulating layer, a barrier layer pattern and an active semiconductor layer pattern formed by metal oxide semiconductor which are located on the gate insulating layer, a semiconductor protecting layer which covers the barrier layer pattern and the active semiconductor layer pattern, and has via holes at positions corresponding to the barrier layer pattern and the active semiconductor layer pattern; a data wire, a source electrode and a drain electrode formed by metal Cu, which are located at via holes. Metal Cu is used to form the data wire, the source electrode and the drain electrode, and the metal oxide semiconductor is used as the barrier layer for the metal Cu, and as a result, the diffusion of metal Cu into the layers such as the gate insulating layer etc., is prevented in the manufacturing process of TFT.
Abstract:
The present disclosure provides a display substrate, a manufacturing method of the display substrate and a display apparatus. The display substrate includes a base substrate; an alignment layer, on the base substrate; a first electrode, located between the base substrate and the alignment layer and being in contact with the alignment layer; and a pattern layer, located between the base substrate and the alignment layer and being in contact with the alignment layer. An orthographic projection of the pattern layer on the base substrate does not overlap an orthographic projection of the first electrode on the base substrate, and a ratio of a contact angle of the pattern layer to a contact angle of the first electrode is greater than or equal to 7/12 and less than 3/2.
Abstract:
The disclosure discloses a thin film transistor and a fabrication method thereof, an array substrate and a display device. The thin film transistor comprises an active layer and an insulating layer adjacent to the active layer. The insulating layer comprises a first insulating layer, the first insulating layer comprises a first silicon oxide film and a second silicon oxide film, and the second silicon oxide film is in direct contact with the active layer. A density of the second silicon oxide film is larger than that of the first silicon oxide film.
Abstract:
The present invention provides a thin film transistor, an array substrate and a display device, relating to the field of display technology, for solving the problem that a source/drain electrode metals and a gate metal may be short-circuited in the manufacturing process of an existing bottom-gate thin film transistor. The thin film transistor of the present invention comprises: a gate formed on a substrate, the gate being connected with a gate line; and a semiconductor layer formed on the gate and the gate line, at least a part of the semiconductor layer extends in the direction parallel to the substrate to exceed the edge of the gate. The array substrate of the present invention comprises the thin film transistor, and the display device comprises the array substrate. The present invention may improve the yield of the bottom-gate thin film transistor.