公开(公告)号：US10971381B2

公开(公告)日：2021-04-06

申请号：US15029502

申请日：2014-11-03

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US11328943B2

公开(公告)日：2022-05-10

申请号：US16839360

申请日：2020-04-03

Applicant: APPLIED MATERIALS, INC.

Inventor： Kumaresan Kuppannan ,  Ofer Amir ,  Michael Kuchar

IPC: H01L21/67 ,  F16K51/02 ,  H01L21/673 ,  F16K3/18

Abstract: Disclosed is a wafer processing system, a dual gate system, and methods for operating these systems. The dual gate system may have a first gate, a second gate, a gate connector coupled to the first gate and to the second gate, and actuator coupled to the gate connector. The actuator is configured to seal the first gate against a first slot or open the first slot via vertical motion. The actuator is also configured to seal the second gate against a second slot or open the second slot via a combination of vertical motion and horizontal motion.

公开(公告)号：US20210339354A1

公开(公告)日：2021-11-04

申请号：US17241241

申请日：2021-04-27

Applicant: Applied Materials, Inc.

Inventor： Yuanhong Guo ,  Sheng Michael Guo ,  Marek W. Radko ,  Steven Victor Sansoni ,  Nagendra Madiwal ,  Matvey Farber ,  Pingping Gou ,  Song-Moon Suh ,  Jeffrey C. Hudgens ,  Yuji Murayama ,  Anurag Bansal ,  Shaofeng Chen ,  Michael Kuchar

IPC: B24B7/07 ,  B24B1/00

Abstract: A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.

公开(公告)号：US20210313204A1

公开(公告)日：2021-10-07

申请号：US16839360

申请日：2020-04-03

Applicant: APPLIED MATERIALS, INC.

Inventor： Kumaresan Kuppannan ,  Ofer Amir ,  Michael Kuchar

IPC: H01L21/67 ,  F16K51/02 ,  F16K3/18 ,  H01L21/673

Abstract: Disclosed is a wafer processing system, a dual gate system, and methods for operating these systems. The dual gate system may have a first gate, a second gate, a gate connector coupled to the first gate and to the second gate, and actuator coupled to the gate connector. The actuator is configured to seal the first gate against a first slot or open the first slot via vertical motion. The actuator is also configured to seal the second gate against a second slot or open the second slot via a combination of vertical motion and horizontal motion.

公开(公告)号：US10381247B2

公开(公告)日：2019-08-13

申请号：US15238604

申请日：2016-08-16

Applicant: Applied Materials, Inc.

Inventor： Nagendra V. Madiwal ,  Robert Irwin Decottignies ,  Andrew Nguyen ,  Paul B. Reuter ,  Angela R. Sico ,  Michael Kuchar ,  Travis Morey ,  Mitchell DiSanto

IPC: H01L21/67 ,  C23C14/56 ,  C23C16/44 ,  C23C16/455

Abstract: An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.

公开(公告)号：US20190214284A1

公开(公告)日：2019-07-11

申请号：US16359561

申请日：2019-03-20

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.