公开(公告)号：US20220165547A1

公开(公告)日：2022-05-26

申请号：US17103697

申请日：2020-11-24

Applicant: Applied Materials, Inc.

Inventor： Vishwas Kumar PANDEY ,  Eric Kihara SHONO ,  Christopher S. OLSEN ,  Tobin KAUFMAN-OSBORN ,  Erika HANSEN ,  Rene GEORGE ,  Lara HAWRYLCHAK ,  Hansel LO ,  Kartik Bhupendra SHAH

IPC: H01J37/32 ,  H01L21/67 ,  C23C16/50 ,  C23C16/455

Abstract: Provided herein is a gas source comprising a flow conduit having an interior volume and an open end, a remote plasma source fluidly coupled to the flow conduit, a secondary gas source extending inwardly of the interior volume of the flow conduit, the secondary gas source including at least one gas port therein positioned to flow a secondary gas inwardly of the interior volume of the flow conduit.

公开(公告)号：US20240026522A1

公开(公告)日：2024-01-25

申请号：US18479297

申请日：2023-10-02

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Schubert CHU ,  Nyi Oo MYO ,  Kartik Bhupendra SHAH ,  Zhiyuan YE ,  Richard O. COLLINS

IPC: C23C14/24 ,  C23C14/50 ,  H01L21/67

CPC classification number: C23C14/24 ,  C23C14/50 ,  H01L21/67017

Abstract: Embodiments disclosed herein generally provide improved control of gas flow in processing chambers. In at least one embodiment, a liner for a processing chamber includes an annular body having a sidewall and a vent formed in the annular body for exhausting gas from inside to outside the annular body. The vent comprises one or more vent holes disposed through the sidewall. The liner further includes an opening in the annular body for substrate loading and unloading.

公开(公告)号：US20220322492A1

公开(公告)日：2022-10-06

申请号：US17223940

申请日：2021-04-06

Applicant: Applied Materials, Inc.

Inventor： Shu-Kwan LAU ,  Brian Hayes BURROWS ,  Zhiyuan YE ,  Richard O. COLLINS ,  Enle CHOO ,  Danny D. WANG ,  Shainish NELLIKKA ,  Toshiyuki NAKAGAWA ,  Abhishek DUBE ,  Ala MORADIAN ,  Kartik Bhupendra SHAH

IPC: H05B3/00

Abstract: A process chamber includes a chamber body having a ceiling disposed above a floor with a chassis and an injector ring disposed therebetween. Upper and lower clamp rings secure the upper and floors, respectively, in place. An upper heating module is coupled to the upper clamp ring above the ceiling. A lower heating module is coupled to the lower clamp ring below the floor.

公开(公告)号：US20210272776A1

公开(公告)日：2021-09-02

申请号：US17324892

申请日：2021-05-19

Applicant: Applied Materials, Inc.

Inventor： Vishwas Kumar PANDEY ,  Kartik Bhupendra SHAH ,  Christopher S. OLSEN ,  Agus Sofian TJANDRA ,  Hansel LO ,  Eric Kihara SHONO ,  Hemantha RAJU

IPC: H01J37/32 ,  C23C16/455

Abstract: Embodiments of the present disclosure generally relate to a processing chamber for conformal oxidation of high aspect ratio structures. The processing chamber includes a chamber body with a first side and a second side opposite the first side, and a flow assembly disposed in the first side. The flow assembly includes a flow divider to direct fluid flow away from a center of a substrate disposed in a processing region of the processing chamber. The flow divider includes a crescent shaped first side, a top, and a bottom. The processing chamber also includes a distributed pumping structure located adjacent to the second side. The flow assembly is designed to reduce flow constriction of the radicals, leading to increased radical concentration and flux.