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公开(公告)号：US11864322B2
公开(公告)日：2024-01-02
申请号：US18164180
申请日：2023-02-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/0298 , H05K1/189 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US20230055647A1
公开(公告)日：2023-02-23
申请号：US17407670
申请日：2021-08-20
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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公开(公告)号：US11552053B2
公开(公告)日：2023-01-10
申请号：US16912000
申请日：2020-06-25
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Pierpaolo Lupo , Praveesh Chandran
Abstract: Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.
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公开(公告)号：US10037948B2
公开(公告)日：2018-07-31
申请号：US15241665
申请日：2016-08-19
Applicant: Apple Inc.
Inventor： Phillip R. Sommer , Kishore N. Renjan , Manoj Vadeentavida
IPC: H01L21/56 , H01L23/552 , H01L23/29
CPC classification number: H01L23/552 , H01L21/56 , H01L21/565 , H01L23/293 , H01L23/3121 , H01L25/0655 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K9/0024 , H05K9/0045
Abstract: A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.
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公开(公告)号：US12148741B2
公开(公告)日：2024-11-19
申请号：US17806412
申请日：2022-06-10
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
IPC: H05K1/02 , G01D11/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L25/16 , H01R12/59 , H01R12/62 , H01R12/79 , H01R13/6581 , H01R43/20 , H05K1/18 , H05K3/14 , H05K3/18 , H10K59/131
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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Patent Agency Ranking
公开(公告)号：US11765838B2
公开(公告)日：2023-09-19
申请号：US17407670
申请日：2021-08-20
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
CPC classification number: H05K3/363 , H05K1/189 , H05K3/0014 , H05K3/3436 , H05K3/4038 , H05K2201/10151 , H05K2203/048
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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公开(公告)号：US20230089258A1
公开(公告)日：2023-03-23
申请号：US17478221
申请日：2021-09-17
Applicant: Apple Inc.
Inventor： Lan H. Hoang , Takayoshi Katahira , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Manoj Vadeentavida , Jing Tao
Abstract: Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.
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公开(公告)号：US11576262B2
公开(公告)日：2023-02-07
申请号：US17212983
申请日：2021-03-25
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US11313741B2
公开(公告)日：2022-04-26
申请号：US16711247
申请日：2019-12-11
Applicant: Apple Inc.
Inventor： Pierpaolo Lupo , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida
IPC: H01L23/538 , G01K13/20 , G01K1/08 , G01K7/02 , G01K7/16 , H01L23/00 , H01L23/28 , H01L23/498
Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.
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公开(公告)号：US20210405313A1
公开(公告)日：2021-12-30
申请号：US16912000
申请日：2020-06-25
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Pierpaolo Lupo , Praveesh Chandran
Abstract: Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.
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