公开(公告)号：US20190018053A1

公开(公告)日：2019-01-17

申请号：US15649600

申请日：2017-07-13

Applicant: APPLIED MATERIALS, INC.

Inventor： ANANTHKRISHNA JUPUDI ,  YUEH SHENG OW ,  JACOB NEWMAN ,  PREETHAM RAO ,  YUICHI WADA ,  VINODH RAMACHANDRAN

IPC: G01R29/08 ,  H01L21/67 ,  H05B6/80 ,  H05B6/64

Abstract: An apparatus for relaying microwave field intensity in a microwave cavity. In some embodiments, the apparatus comprises a microwave transparent substrate with at least one Radio Frequency (RF) detector that is capable of detecting a microwave field and generating a signal associated with a field intensity of the detected microwave field and a transmitter that receives the signal associated with the detected microwave field from the RF detector and transmits or stores information about the detected microwave field intensity. In some embodiments, the apparatus relays the microwave intensity via a wired, wireless, or optical transmitter located in proximity of the RF detector.

公开(公告)号：US20180226282A1

公开(公告)日：2018-08-09

申请号：US15887446

申请日：2018-02-02

Applicant: APPLIED MATERIALS, INC.

Inventor： SIEW KIT HOI ,  Ananthkrishna JUPUDI ,  YUEH SHENG OW

IPC: H01L21/67 ,  G01J1/42 ,  G01J3/45 ,  G01J5/08 ,  G01J5/00

CPC classification number: H01L21/67248 ,  G01J1/42 ,  G01J3/45 ,  G01J5/0007 ,  G01J5/026 ,  G01J5/0821 ,  G01J5/0896 ,  H01L21/67115

Abstract: In some embodiments, an apparatus for processing substrates includes: a substrate support within a processing chamber; a light source directly coupled to a light isolator and configured to deliver incident light to and through a first surface of the substrate when disposed on the substrate support; an optical fiber having a first end spaced apart a first distance from the first surface and a second end directly coupled to the light source via a coupling element; a photodetector directly coupled to the second end of the optical fiber via the coupling element and configured to receive a first reflected light beam reflected off the first surface and a second reflected light beam reflected off an inner boundary of a second surface of the substrate, opposite the first surface; and a signal processor to determine a temperature of the substrate based on the first and second reflected light beams.