公开(公告)号：US20190018053A1

公开(公告)日：2019-01-17

申请号：US15649600

申请日：2017-07-13

Applicant: APPLIED MATERIALS, INC.

Inventor： ANANTHKRISHNA JUPUDI ,  YUEH SHENG OW ,  JACOB NEWMAN ,  PREETHAM RAO ,  YUICHI WADA ,  VINODH RAMACHANDRAN

IPC: G01R29/08 ,  H01L21/67 ,  H05B6/80 ,  H05B6/64

Abstract: An apparatus for relaying microwave field intensity in a microwave cavity. In some embodiments, the apparatus comprises a microwave transparent substrate with at least one Radio Frequency (RF) detector that is capable of detecting a microwave field and generating a signal associated with a field intensity of the detected microwave field and a transmitter that receives the signal associated with the detected microwave field from the RF detector and transmits or stores information about the detected microwave field intensity. In some embodiments, the apparatus relays the microwave intensity via a wired, wireless, or optical transmitter located in proximity of the RF detector.

公开(公告)号：US20210057244A1

公开(公告)日：2021-02-25

申请号：US16545537

申请日：2019-08-20

Applicant: APPLIED MATERIALS, INC.

Inventor： VINODH RAMACHANDRAN ,  ANANTHKRISHNA JUPUDI ,  CHENG-HSIUNG TSAI ,  YUEH SHENG OW ,  PREETHAM P. RAO ,  RIBHU GAUTAM ,  PRASHANT AGARWAL

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/66 ,  H05B6/64

Abstract: Methods and apparatus for processing a substrate are provided. The apparatus, for example, can include a process chamber comprising a chamber body defining a processing volume and having a view port coupled to the chamber body; a substrate support disposed within the processing volume and having a support surface to support a substrate; and an infrared temperature sensor (IRTS) disposed outside the chamber body adjacent the view port to measure a temperature of the substrate when being processed in the processing volume, the IRTS movable relative to the view port for scanning the substrate through the view port.

公开(公告)号：US20200378006A1

公开(公告)日：2020-12-03

申请号：US16424302

申请日：2019-05-28

Applicant: APPLIED MATERIALS, INC.

Inventor： RIBHU GAUTAM ,  ANANTHKRISHNA JUPUDI ,  TUCK FOONG KOH ,  PREETHAM P. RAO ,  VINODH RAMACHANDRAN ,  YUEH SHENG OW ,  YUICHI WADA ,  CHENG-HSIUNG TSAI ,  KAI LIANG LIEW

IPC: C23C16/511 ,  C23C16/54 ,  B01J19/12

Abstract: Methods and apparatus for a substrate processing chamber are provided herein. In some embodiments, a substrate processing chamber includes a chamber body having sidewalls defining an interior volume having a polygon shape; a selectively sealable elongated opening disposed in an upper portion of the chamber body for transferring one or more substrates into or out of the chamber body; a funnel disposed at a first end of the chamber body, wherein the funnel increases in size along a direction from an outer surface of the chamber body to the interior volume; and a pump port disposed at a second end of the chamber body opposite the funnel.

公开(公告)号：US20200350230A1

公开(公告)日：2020-11-05

申请号：US16460979

申请日：2019-07-02

Applicant: APPLIED MATERIALS, INC.

Inventor： RIBHU GAUTAM ,  ANANTHKRISHNA JUPUDI ,  VINODH RAMACHANDRAN

IPC: H01L23/473 ,  F28F3/12

Abstract: Methods and apparatus for a cooling plate for solid state power amplifiers are provided herein. In some embodiments, a cooling plate of a solid state power amplifier includes a body having a rectangular shape, a first sidewall opposite a second sidewall, and a third sidewall opposite a fourth sidewall; a plurality of holes disposed on a first side of the body configured to mount a plurality of heat generating microelectronic components; and a channel having a plurality of segments disposed within the body and extending from a first port disposed on the first sidewall to a second port disposed on the first sidewall.