公开(公告)号：US20250118583A1

公开(公告)日：2025-04-10

申请号：US18377572

申请日：2023-10-06

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Shankar KODLE ,  Thomas BREZOCZKY

IPC: H01L21/677 ,  H01L21/67

Abstract: A method including processing substrates in two stations on separate processing lines. In the first station of the first processing line, the method may include: loading a first substrate, and delivering a resource for a first configurable period, during which the resource is locked out from the first station of the second processing line. In the first station of the second processing line, the method may include: loading a second substrate, and delivering a resource for a second configurable period, during which the resource is locked out from the first station of the first processing line.

公开(公告)号：US20250069915A1

公开(公告)日：2025-02-27

申请号：US18811911

申请日：2024-08-22

Applicant: Applied Materials, Inc.

Inventor： Thomas BREZOCZKY ,  Punnati KRUSHNA REDDY ,  Azhar ALI M.A. ,  Kirankumar Neelasandra SAVANDAIAH ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Dhritiman Subha KASHYAP

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/677 ,  H01L21/687

Abstract: Degas stations for degassing substrates that are conveyed through a substrate processing system on a magnetically levitated carrier and related methods are provided. The method includes magnetically levitating a carrier with a substrate disposed thereon in a first position between a reflector assembly and a heater assembly disposed within a housing of the station. The method further includes moving both the reflector assembly and the heater assembly from a retracted position to an extended position while the carrier is disposed between the reflector assembly and heater assembly. The method further includes degassing the substrate disposed on the carrier with the heater assembly while the reflector assembly and heater assembly are each in the extended position, wherein the degassing includes pumping a purge gas through a gas port formed in at least one of the reflector assembly or the heater assembly towards the substrate.

公开(公告)号：US20240153803A1

公开(公告)日：2024-05-09

申请号：US18141931

申请日：2023-05-01

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

IPC: H01L21/677 ,  C23C14/34 ,  C23C14/50 ,  C23C14/56 ,  C23C16/458 ,  H01F7/20 ,  H01L21/687

CPC classification number: H01L21/67709 ,  C23C14/34 ,  C23C14/50 ,  C23C14/566 ,  C23C16/4583 ,  H01F7/206 ,  H01L21/67712 ,  H01L21/68742

Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

公开(公告)号：US20230178416A1

公开(公告)日：2023-06-08

申请号：US17923908

申请日：2021-04-12

Applicant: Applied Materials, Inc.

Inventor： Sreenath SOVENAHALLI ,  Kirankumar Neelasandra SAVANDAIAH ,  Bhaskar PRASAD ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/687

CPC classification number: H01L21/68742

Abstract: A floating pin for positioning a substrate relative to a substrate support includes a shaft configured to move through a guide hole in a substrate support, and a pin head including a top surface and a flat shoulder surface disposed between the top surface and the shaft. The flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.

公开(公告)号：US20230073011A1

公开(公告)日：2023-03-09

申请号：US17900318

申请日：2022-08-31

Applicant: Applied Materials, Inc.

Inventor： Zhiyong WANG ,  Halbert CHONG ,  Irena H. WYSOK ,  Jianxin LEI ,  Rongjun WANG ,  Lei ZHOU ,  Kirankumar Neelasandra SAVANDAIAH ,  Sundarapandian Ramalinga Vijayalakshmi REDDY

IPC: H01J37/34 ,  C23C14/56

Abstract: Methods and apparatus reduce defects in substrates processed in a physical vapor (PVD) chamber. In some embodiments, a method for cleaning a process kit disposed in an inner volume of a process chamber includes positioning a non-sputtering shutter disk on a substrate support of the PVD chamber; energizing an oxygen-containing cleaning gas disposed in the inner volume of the PVD chamber to create a plasma reactive with carbon-based materials; and heating the process kit having a carbon-based material adhered thereto while exposed to the plasma to remove at least a portion of the carbon-based material adhered to the process kit.

公开(公告)号：US20220415635A1

公开(公告)日：2022-12-29

申请号：US17359348

申请日：2021-06-25

Applicant: Applied Materials, Inc.

Inventor： Srinivasa Rao YEDLA ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Hari Prasath RAJENDRAN

IPC: H01J37/34 ,  C23C14/54 ,  C23C14/35

Abstract: Aspects of the disclosure provided herein generally provide a substrate processing system that includes: a processing chamber including: a top plate having an array of process station openings disposed therethrough surrounding a central axis, a bottom plate having a first central opening, and a plurality of side walls between the top plate and the bottom plate; a plurality of heaters disposed in the top plate and the bottom plate and configured in a plurality of regions; and a system controller configured to independently control the plurality of heaters in each region.

公开(公告)号：US20220076979A1

公开(公告)日：2022-03-10

申请号：US17016030

申请日：2020-09-09

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Nitin Bharadwaj SATYAVOLU ,  Thomas BREZOCZKY

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  B65G47/92

Abstract: A pedestal assembly for a processing region and comprising first pins coupled to a substrate support, configured to mate with first terminals of an electrostatic chuck, and are configured to be coupled to a first power source. Each of the first pins comprises an interface element, and a compliance element supporting the interface element. Second pins are coupled to the substrate support, configured to mate with second terminals of the electrostatic chuck, and configured to couple to a second power source. Alignment elements are coupled to the substrate support and are configured to interface with centering elements of the electrostatic chuck. The flexible element is coupled to the substrate support, configured to interface with a passageway of the electrostatic chuck, and configured to be coupled to a gas source.

公开(公告)号：US20220076978A1

公开(公告)日：2022-03-10

申请号：US17016010

申请日：2020-09-09

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Nitin Bharadwaj SATYAVOLU ,  Srinivasa Rao YEDLA

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/687 ,  B65G47/92

Abstract: In one example, a substrate support for a processing chamber comprises a plurality of pins and a plurality of alignment elements. The plurality of pins are configured to mate with terminals of an electrostatic chuck. The plurality of pins are configured to be coupled to one or more power sources. The plurality of alignment elements are configured to interface with a plurality of centering elements of the electrostatic chuck to center the electrostatic chuck with the substrate support. Each of the plurality of alignment elements is configured to interface with a slot of a corresponding one of the plurality of centering elements.

公开(公告)号：US20220028712A1

公开(公告)日：2022-01-27

申请号：US16939629

申请日：2020-07-27

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Srinivasa Rao YEDLA

IPC: H01L21/67 ,  H01L21/66

Abstract: Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive electromagnetic energy emitted from the back surface of the substrate support. The temperature measuring assembly measures an intensity of the electromagnetic energy entering the assembly and generates intensity signals. An apparent temperature of the substrate is determined based on the intensity signals.

公开(公告)号：US20210407778A1

公开(公告)日：2021-12-30

申请号：US16916494

申请日：2020-06-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Jiao SONG ,  Anthony Chih-Tung CHAN ,  David GUNTHER ,  Kirankumar Neelasandra SAVANDAIAH ,  Irena H. WYSOK

IPC: H01J37/34 ,  C23C14/35

Abstract: Methods and apparatus for processing a substrate are provided herein. In embodiments, a magnetron assembly for use in a PVD chamber includes: a base plate having a first side, a second side opposite the first side, and a central axis; a magnet plate rotatably coupled to the base plate, wherein the magnet plate rotates with respect to the base plate about an offset axis; a magnet assembly coupled to the magnet plate offset from the offset axis and configured to rotate about the central axis and the offset axis; a first motor coupled to the base plate to rotate the magnet assembly about the central axis; and a second motor coupled to the magnet plate to control an angular position thereof and to position the magnet assembly in each of a plurality of fixed angular positions defining a plurality of different fixed radii.