Window in thin polishing pad
    11.
    发明授权

    公开(公告)号:US11826875B2

    公开(公告)日:2023-11-28

    申请号:US17494631

    申请日:2021-10-05

    CPC classification number: B24B37/205 B24B37/22 B24B37/24

    Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

    PRINTING CHEMICAL MECHANICAL POLISHING PAD HAVING WINDOW OR CONTROLLED POROSITY

    公开(公告)号:US20210245322A1

    公开(公告)日:2021-08-12

    申请号:US17240934

    申请日:2021-04-26

    Abstract: A method of fabricating a polishing pad includes determining a desired distribution of voids to be introduced within a polymer matrix of a polishing layer of the polishing pad. Electronic control signals configured to be read by a 3D printer are generated which specify the locations where a polymer matrix precursor is to be deposited, and specify the locations of the desired distribution of voids where no material is to be deposited. A plurality of layers of the polymer matrix corresponding to the plurality of the first locations is successfully deposited with the 3D printer. Each layer of the plurality of layers of polymer matrix is deposited by ejecting a polymer matrix precursor from a nozzle. The polymer matrix precursor is solidified to form a solidified polymer matrix having the desired distribution of voids.

    Window in Thin Polishing Pad
    14.
    发明申请

    公开(公告)号:US20190152017A1

    公开(公告)日:2019-05-23

    申请号:US16252513

    申请日:2019-01-18

    Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

    SUBSTRATE SUPPORT ASSEMBLY
    18.
    发明申请

    公开(公告)号:US20170345691A1

    公开(公告)日:2017-11-30

    申请号:US15679099

    申请日:2017-08-16

    Abstract: An electrostatic chuck comprises a ceramic body having a first surface and a second surface that is on an opposite side of the ceramic body to the first surface, the ceramic body comprising a through-hole between the first surface and the second surface. The electrostatic chuck further comprises a thermally conductive base that supports the ceramic body and comprises a second hole that lines up with the through-hole, wherein the second hole is to fluidly couple to a source of heat transfer gas. The electrostatic chuck further comprises a bonding layer between the ceramic body and the thermally conductive base, the bonding layer comprising a space between an opening of the through-hole on the second surface and the gas introduction path.

    PRINTED CHEMICAL MECHANICAL POLISHING PAD HAVING CONTROLLED POROSITY
    20.
    发明申请
    PRINTED CHEMICAL MECHANICAL POLISHING PAD HAVING CONTROLLED POROSITY 有权
    印刷化学机械抛光垫具有控制的孔隙度

    公开(公告)号:US20150174826A1

    公开(公告)日:2015-06-25

    申请号:US14549443

    申请日:2014-11-20

    Abstract: A method of fabricating a polishing pad includes determining a desired distribution of voids to be introduced within a polymer matrix of a polishing layer of the polishing pad. Electronic control signals configured to be read by a 3D printer are generated which specify the locations where a polymer matrix precursor is to be deposited, and specify the locations of the desired distribution of voids where no material is to be deposited. A plurality of layers of the polymer matrix corresponding to the plurality of the first locations is successfully deposited with the 3D printer. Each layer of the plurality of layers of polymer matrix is deposited by ejecting a polymer matrix precursor from a nozzle. The polymer matrix precursor is solidified to form a solidified polymer matrix having the desired distribution of voids.

    Abstract translation: 制造抛光垫的方法包括确定要引入抛光垫的抛光层的聚合物基质内的空隙的期望分布。 产生配置为由3D打印机读取的电子控制信号,其指定要沉积聚合物基质前体的位置,并且指定在没有材料沉积的情况下所需的空隙分布的位置。 对应于多个第一位置的多个聚合物基体层被成功地沉积在3D打印机中。 通过从喷嘴喷射聚合物基质前体而沉积多层聚合物基质的每一层。 聚合物基质前体被固化以形成具有所需空隙分布的固化聚合物基质。

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