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公开(公告)号:US20180209846A1
公开(公告)日:2018-07-26
申请号:US15879365
申请日:2018-01-24
Applicant: Apple Inc.
Inventor: Shingo Mandai , Andrew Kenneth John McMahon , Cristiano L. Niclass , Thierry Oggier , Tal Kaitz , Moshe Laifenfeld
Abstract: The sensitivity of one or more single-photon avalanche diodes (SPAD) in a SPAD detector is modulated over time. The sensitivity of all of the SPADs may be modulated, or the sensitivity of one section of the SPADs can be modulated differently from another section of the SPADs. Various techniques for modulating the sensitivity are disclosed.
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公开(公告)号:US20180090536A1
公开(公告)日:2018-03-29
申请号:US15713477
申请日:2017-09-22
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass , Nobuhiro Karasawa , Xiaofeng Fan , Arnaud Laflaquiere , Gennadiy A. Agranov
IPC: H01L27/146 , H04N5/355 , H04N5/3745 , H04N5/378 , H04N5/357 , H04N5/376
CPC classification number: H01L27/14665 , G01S7/4861 , G01S7/4863 , H01L27/14603 , H01L27/14609 , H01L27/1461 , H01L27/14616 , H01L27/14623 , H01L27/14627 , H01L27/14629 , H01L27/1463 , H01L27/14632 , H01L27/14634 , H01L27/1464 , H01L27/14643 , H01L31/02027 , H01L31/03529 , H01L31/107 , H04N5/35572 , H04N5/3577 , H04N5/3698 , H04N5/37452 , H04N5/3765 , H04N5/378
Abstract: A back-illuminated single-photon avalanche diode (SPAD) image sensor includes a sensor wafer stacked vertically over a circuit wafer. The sensor wafer includes one or more SPAD regions, with each SPAD region including an anode gradient layer, a cathode region positioned adjacent to a front surface of the SPAD region, and an anode avalanche layer positioned over the cathode region. Each SPAD region is connected to a voltage supply and an output circuit in the circuit wafer through inter-wafer connectors. Deep trench isolation elements are used to provide electrical and optical isolation between SPAD regions.
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公开(公告)号:US20250102631A1
公开(公告)日:2025-03-27
申请号:US18673072
申请日:2024-05-23
Applicant: Apple Inc.
Inventor: Siddharth Joshi , Arnaud Laflaquiere , Nicolas Hotellier , Cristiano L. Niclass , Keith Lyon
Abstract: Disclosed are electronic devices that include an array of light emitting diodes and photosensors formed in a single semiconductor chip. The light emitting diodes may be structured as vertical exterior cavity surface-emitting laser diodes (VECSELs). The photosensors may be formed as resonant cavity photosensors (RCPDs). The VECSELs and the RCPDs of the array may be formed in a common set of semiconductor layers of the single semiconductor chip and separated by isolation regions formed in the common set of semiconductor layers. Also disclosed are dual chip transmitter-receiver systems including a first semiconductor chip having an array of both VECSELs and RCPDs formed in common set of semiconductor layers, and a second semiconductor chip electrically connected to the first semiconductor chip and including control circuitry to enable laser emission from the VECSELs and light reception by the RCPDs.
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公开(公告)号:US20250085400A1
公开(公告)日:2025-03-13
申请号:US18830624
申请日:2024-09-11
Applicant: Apple Inc.
Inventor: Xiaoyin Zhu , Ali M. Khan , Andrea Manavella , Andrej Halabica , April D. Schriker , Austin Y. Seol , Bhavin J. Bijlani , Caihua Chen , Chin Han Lin , Cristiano L. Niclass , David Sicard , Eric D. Aspnes , Hazel A. McInnes , Henry M. Daghighian , Igor Raginski , Jiayang Cao , Jibum Cha , Jili Liu , Jose M. Infante Herrero , Julien Sarry , Karen A. Cabrera , Lorenzo Ferrari , Niv Gilboa , Noriaki Saika , Pietro R. Binetti , Pushkar Pandit , Reema Shalan , Scott T. Smith , Shifa Xu , Shingo Mandai , Shujun Tang , Sibi Sutty , Susan A. Thompson , Teimour T. Maleki , Thierry Oggier , Vikrant Dhamdhere , Yohai Zmora , Yuanlin Xie , Wee Keat Chong
IPC: G01S7/481 , G01S17/894 , G03B30/00 , H04N13/239 , H04N23/51 , H04N23/56 , H04N23/74
Abstract: An optoelectronic assembly includes: (i) a substrate having a cavity, (ii) an optoelectronic device, which is disposed over the cavity and includes an array of multiple emitters configured to emit a predefined number of light beams in response to receiving one or more electrical signals, and (iii) an integrated circuit (IC), which is mounted within the cavity, between the substrate and the optoelectronic device, and is configured to drive the one or more electrical signals to the optoelectronic device.
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公开(公告)号:US10928492B2
公开(公告)日:2021-02-23
申请号:US16877121
申请日:2020-05-18
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass
IPC: G01S7/4863 , G01J1/44 , G01S7/4865 , G01S17/10 , H01L27/146 , H01L31/107
Abstract: A single-photon avalanche diode (SPAD) detector includes a pixel array comprising multiple pixels and a memory operably connected to the pixel array. Each pixel includes a SPAD. Various techniques for accumulating signals received from the same SPAD over multiple scans and storing the accumulated signals in the memory are disclosed.
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公开(公告)号:US20200286946A1
公开(公告)日:2020-09-10
申请号:US16876511
申请日:2020-05-18
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass , Nobuhiro Karasawa , Xiaofeng Fan , Arnaud Laflaquiere , Gennadiy A. Agranov
IPC: H01L27/146 , G01S7/4863 , H04N5/355 , H04N5/357 , H04N5/3745 , H04N5/376 , H04N5/378 , H01L31/107 , H04N5/369
Abstract: A back-illuminated single-photon avalanche diode (SPAD) image sensor includes a sensor wafer stacked vertically over a circuit wafer. The sensor wafer includes one or more SPAD regions, with each SPAD region including an anode gradient layer, a cathode region positioned adjacent to a front surface of the SPAD region, and an anode avalanche layer positioned over the cathode region. Each SPAD region is connected to a voltage supply and an output circuit in the circuit wafer through inter-wafer connectors. Deep trench isolation elements are used to provide electrical and optical isolation between SPAD regions.
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公开(公告)号:US10305247B2
公开(公告)日:2019-05-28
申请号:US15250962
申请日:2016-08-30
Applicant: APPLE INC.
Inventor: Richard E. Bills , Andrew J. Sutton , Cristiano L. Niclass , Mina A. Rezk
IPC: G01C3/08 , H01S5/00 , G01S7/481 , G01S17/10 , G02B26/08 , G02F1/29 , H01S5/42 , G01S17/42 , H01S5/042
Abstract: An optical apparatus includes an array of lasers, which are arranged in a grid pattern having a predefined spatial pitch and are configured to emit respective beams of pulses of optical radiation. Projection optics having a selected focal length project the beams toward a target with an angular pitch between the beams defined by the spatial pitch and the focal length. A scanner scans the projected beams over a range of scan angles that is less than twice the angular pitch. Control circuitry drives the lasers and the scanner so that the pulses cover the target with a resolution finer than the angular pitch. A receiver receives and measures a time of flight of the pulses reflected from the target.
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公开(公告)号:US20190004156A1
公开(公告)日:2019-01-03
申请号:US15950186
申请日:2018-04-11
Applicant: Apple Inc.
Inventor: Cristiano L. Niclass , Scott T. Smith , Thierry Oggier
Abstract: An optical sensing device includes a light source, which is configured to emit one or more beams of light pulses at respective angles toward a target scene. An array of sensing elements is configured to output signals in response to incidence of photons on the sensing elements. Light collection optics are configured to image the target scene onto the array. Control circuitry is coupled to actuate the sensing elements only in one or more selected regions of the array, each selected region containing a respective set of the sensing elements in a part of the array onto which the light collection optics image a corresponding area of the target scene that is illuminated by the one of the beams, and to adjust a membership of the respective set responsively to a distance of the corresponding area from the device.
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公开(公告)号:US20180081061A1
公开(公告)日:2018-03-22
申请号:US15673428
申请日:2017-08-10
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass , Richard E. Bills , Moshe Laifenfeld , Mina A. Rezk , Alexander Shpunt , Ron Sokolovsky , Tal Kaitz , Ronen Akerman , Jason D. Mudge , Andrew J. Sutton
CPC classification number: G01S17/89 , G01B11/026 , G01S7/4814 , G01S7/4817 , G01S7/484 , G01S7/4863 , G01S7/4865 , G01S7/4868 , G01S17/10 , G02F1/292
Abstract: An electro-optical device includes a laser, which is configured to emit toward a scene pulses of optical radiation. An array of detectors are configured to receive the optical radiation that is reflected from points in the scene and to output signals indicative of respective times of arrival of the received radiation. A controller is coupled to drive the laser to emit a sequence of pulses of the optical radiation toward each of a plurality of points in the scene and to find respective times of flight for the points responsively to the output signals, while controlling a power of the pulses emitted by the laser by counting a number of the detectors outputting the signals in response to each pulse, and reducing the power of a subsequent pulse in the sequence when the number is greater than a predefined threshold.
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公开(公告)号:US20250054930A1
公开(公告)日:2025-02-13
申请号:US18778986
申请日:2024-07-21
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass , Pengfei Sun , Vyshakh Sanjeev
IPC: H01L25/16 , G01S17/34 , G02B6/12 , G02B6/42 , G02B6/43 , H01L23/00 , H01L27/144 , H01L31/02 , H01L31/0232 , H01L31/107 , H01S5/026 , H01S5/183
Abstract: An optoelectronic device includes a first semiconductor die, having first and second surfaces and including a first array of transceiver elements. Each transceiver element includes an optical transducer, which directs outgoing coherent optical radiation through the first surface toward a target and to receive incoming optical radiation that has been reflected from the target. A single-photon optical detector outputs electrical pulses in response to photons of the incoming optical radiation. A waveguide conveys the incoming optical radiation from the optical transducer to the single-photon optical detector. A second semiconductor die is bonded to the second surface of the first semiconductor die and includes a second array of logic circuits, which are coupled to receive and process the electrical pulses output by the single-photon optical detectors in corresponding ones of the transceiver elements.
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