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公开(公告)号：US20250085400A1
公开(公告)日：2025-03-13
申请号：US18830624
申请日：2024-09-11
Applicant: Apple Inc.
Inventor： Xiaoyin Zhu , Ali M. Khan , Andrea Manavella , Andrej Halabica , April D. Schriker , Austin Y. Seol , Bhavin J. Bijlani , Caihua Chen , Chin Han Lin , Cristiano L. Niclass , David Sicard , Eric D. Aspnes , Hazel A. McInnes , Henry M. Daghighian , Igor Raginski , Jiayang Cao , Jibum Cha , Jili Liu , Jose M. Infante Herrero , Julien Sarry , Karen A. Cabrera , Lorenzo Ferrari , Niv Gilboa , Noriaki Saika , Pietro R. Binetti , Pushkar Pandit , Reema Shalan , Scott T. Smith , Shifa Xu , Shingo Mandai , Shujun Tang , Sibi Sutty , Susan A. Thompson , Teimour T. Maleki , Thierry Oggier , Vikrant Dhamdhere , Yohai Zmora , Yuanlin Xie , Wee Keat Chong
IPC: G01S7/481 , G01S17/894 , G03B30/00 , H04N13/239 , H04N23/51 , H04N23/56 , H04N23/74
Abstract: An optoelectronic assembly includes: (i) a substrate having a cavity, (ii) an optoelectronic device, which is disposed over the cavity and includes an array of multiple emitters configured to emit a predefined number of light beams in response to receiving one or more electrical signals, and (iii) an integrated circuit (IC), which is mounted within the cavity, between the substrate and the optoelectronic device, and is configured to drive the one or more electrical signals to the optoelectronic device.
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公开(公告)号：US12081689B2
公开(公告)日：2024-09-03
申请号：US17946016
申请日：2022-09-15
Applicant: Apple Inc.
Inventor： Julien Sarry , Henry M. Daghighian
CPC classification number: H04M1/0264 , H04N23/52 , H04N23/55 , H04N23/57
Abstract: Embodiments are disclosed for shielding of an optical element of an imaging device in a mobile device. In an embodiment, an imaging device includes: an optical element; a metallic shielding enclosure, wherein the optical element is partially located within the metallic shielding enclosure; an electrically conductive coating layer applied on a surface of the optical element that is outside the metallic shielding enclosure, wherein the electrically conductive coating layer is electrically connected to the metallic shielding enclosure.
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公开(公告)号：US20240098165A1
公开(公告)日：2024-03-21
申请号：US17946016
申请日：2022-09-15
Applicant: Apple Inc.
Inventor： Julien Sarry , Henry M. Daghighian
CPC classification number: H05K9/003 , H04M1/0264
Abstract: Embodiments are disclosed for shielding of an optical element of an imaging device in a mobile device. In an embodiment, an imaging device includes: an optical element; a metallic shielding enclosure, wherein the optical element is partially located within the metallic shielding enclosure; an electrically conductive coating layer applied on a surface of the optical element that is outside the metallic shielding enclosure, wherein the electrically conductive coating layer is electrically connected to the metallic shielding enclosure.
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公开(公告)号：US20250112383A1
公开(公告)日：2025-04-03
申请号：US18378091
申请日：2023-10-09
Applicant: Apple Inc.
Inventor： Steven Webster , Henry M. Daghighian , Jee Tung Tan , Peter Chin Ting Soon
IPC: H01R12/62 , H01R12/77 , H01R13/6592 , H01R24/50
Abstract: Examples can provide extended-range high-speed interconnect by providing microcoax cables in a hybrid flexible circuit board, which can be referred to as a hybrid flex or microcoax flex. This hybrid flex can be used to convey signals an extended distance within an electronic device. Multiple signals can be conveyed using corresponding microcoax cables. The microcoax cables can include a center conductor, an insulating layer, and an outside shield layer. The cables can be held in position in the hybrid flex relative to each other by a polyimide or other insulative layer. Copper layers can be provided on either or both the top and bottom of the polyimide or other insulative layer. Additional conductors can be embedded in the polyimide other insulative layer to convey power and ground. The microcoax and other conductors can be soldered to a flexible circuit board or other substrate using jet soldering.
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