公开(公告)号：US11324113B2

公开(公告)日：2022-05-03

申请号：US16843282

申请日：2020-04-08

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Nicholas T. Gabriel ,  Ronald D. Jesme ,  Andrew J. Ouderkirk ,  Ravi Palaniswamy ,  Andrew P. Bonifas ,  Alejandro Aldrin A. Narag, II ,  Robert M. Jennings ,  Robin E. Gorrell

IPC: H05K1/02 ,  H01Q1/22 ,  H01Q1/36 ,  H05K1/16 ,  H05K1/18 ,  G06K19/02

Abstract: Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.

公开(公告)号：US10692843B2

公开(公告)日：2020-06-23

申请号：US15032770

申请日：2014-12-02

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Jian Xia Gao ,  Alejandro Aldrin A. Narag, II ,  Nathan P. Kreutter ,  Andrew J. Ouderkirk

IPC: H01L33/64 ,  H01L25/075 ,  H05K1/18 ,  H05K1/02 ,  H01L33/62

Abstract: A flexible polymeric dielectric layer (12) having first and second major surfaces, the first major surface having a conductive layer (20) thereon, the dielectric layer having at least one conduit (10) extending from the second major surface to the first major surface, the conduit having at least one lateral dimension of at least about one centimeter and being at least partially filled with conductive material (18), the conductive layer including at least one conductive feature (21) substantially aligned with the conduit (10), the conductive feature (21) supporting a plurality of light emitting semiconductor devices (22).

公开(公告)号：US20190181323A1

公开(公告)日：2019-06-13

申请号：US16310734

申请日：2017-06-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jae Yong Lee ,  Roger W. Barton ,  Emily L. Bowen ,  Donato G. Caraig ,  Gareth A. Hughes ,  Ravi Palaniswamy ,  James F. Poch ,  Michael W. Dolezal

IPC: H01L35/32 ,  H01L35/04 ,  H01L35/34

Abstract: At least some aspects of the present disclosure direct to a flexible thermoelectric module. The thermoelectric module includes a flexible substrate, a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements, a first set of connectors, and a second set of connectors. The substrate includes a plurality of vias filled with an electrically conductive material or thermoelectric elements. In some cases, the plurality of p-type thermoelectric elements and the plurality of n-type thermoelectric elements are disposed on the flexible substrate.

公开(公告)号：US20190181322A1

公开(公告)日：2019-06-13

申请号：US16310697

申请日：2017-06-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jae Yong Lee ,  Roger W. Barton ,  Donato G. Caraig ,  Ankit Mahajan ,  Ravi Palaniswamy ,  James F. Poch

IPC: H01L35/32 ,  H01L35/04

Abstract: At least some aspects of the present disclosure direct to a thermoelectric tape. The thermoelectric tape comprises a substrate having a plurality of vias, a series of flexible thermoelectric modules connected in parallel, and two conductive buses running longitudinally along the thermoelectric tape. Each flexible thermoelectric module includes a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements. The series of flexible thermoelectric modules are electrically connected to the conductive buses.

公开(公告)号：US20190114003A1

公开(公告)日：2019-04-18

申请号：US16090301

申请日：2017-03-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jian Xia Gao ,  Ravi Palaniswamy ,  Peng Seong Ang

IPC: G06F3/044 ,  G06F3/045

Abstract: A capacitive touch sensitive apparatus includes a touch sensitive viewing area configured to detect a location of a touch applied to the touch sensitive viewing area by detecting a change in a coupling capacitance. A border area surrounds the touch sensitive viewing area. An electrically conductive first electrode includes an active portion disposed in and extending across the touch sensitive viewing area and an end portion at an end of the first electrode disposed in the border area for connection to a controller. The active portion of the first electrode has a substantially uniform first sheet resistance across the viewing area. The end portion of the first electrode is patterned in the form of an electrically conductive mesh including a plurality of interconnected conductive traces defining a plurality of interstices therebetween, the traces having substantially the first sheet resistance, and the interstices having a higher second sheet resistance.

公开(公告)号：US20190035993A1

公开(公告)日：2019-01-31

申请号：US16135317

申请日：2018-09-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Hiromitsu Kosugi

IPC: H01L33/62 ,  B32B15/08 ,  B32B27/28 ,  H01L33/48 ,  H01L33/58 ,  B32B7/12 ,  H05K1/03 ,  H05K1/18 ,  H05K3/28

CPC classification number: H01L33/62 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/202 ,  B32B2457/202 ,  H01L33/486 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2201/10106

Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

公开(公告)号：US20180084635A1

公开(公告)日：2018-03-22

申请号：US15554251

申请日：2016-02-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy

IPC: H05K1/02 ,  H01L33/64 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0209 ,  H01L33/642 ,  H05K1/0207 ,  H05K1/111 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/09681 ,  H05K2201/09827 ,  H05K2201/10106 ,  Y02P70/611

Abstract: A flexible multilayer substrate for attaching a light emitting semiconductor device includes a first dielectric layer, a circuit layer on the first dielectric layer; a first thermally conductive layer on the circuit layer; a discontinuous metal support layer having a plurality of openings therethrough disposed on the first thermally conductive layer, and a second thermally conductive layer on the support layer. The flexible multilayer substrate further includes a plurality of conductive vias extending through the first dielectric layer such that the circuit layer is in communication with the plurality of conductive vias. The first and second thermally conductive layers are in contact within said openings.

公开(公告)号：US09817173B2

公开(公告)日：2017-11-14

申请号：US14378128

申请日：2013-01-24

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Andrew J. Ouderkirk ,  Justina Sze Ying Lee ,  Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Kelly Reed Ingham

IPC: G02B6/00 ,  F21V8/00 ,  G02F1/1335

CPC classification number: G02B6/0028 ,  G02B6/0006 ,  G02B6/0013 ,  G02B6/0023 ,  G02F1/133615

Abstract: A backlight system for a display is described. The system can include an anamorphic light guide that comprises a light receiving portion, a light diverting portion, and a light output portion. The light receiving portion receives light having an area illuminating a first aspect ratio and the output light portion outputs light having an area illuminating a second aspect ratio, the second aspect ratio greater than the first aspect ratio by at least an order of magnitude. The light input face is substantially perpendicular to light output face. The etendue of the light is substantially preserved.

公开(公告)号：US09754869B2

公开(公告)日：2017-09-05

申请号：US14651533

申请日：2013-03-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Alejandro Aldrin II Agcaoili Narag ,  Ravi Palaniswamy ,  Bee Leng Tan ,  Antonny Enojo Flor

IPC: H01L23/49 ,  H01L33/62 ,  H01L33/64 ,  H01L23/498 ,  H01S5/022 ,  H01L33/48

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49866 ,  H01L23/49894 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01S5/02272 ,  H01S5/02276 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.

公开(公告)号：US20230019334A1

公开(公告)日：2023-01-19

申请号：US17779623

申请日：2019-12-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Antonny Flor ,  Sheldon B. Ruiz ,  Milind B. Sabade

IPC: H01L35/34 ,  H01L35/16 ,  H01L35/22 ,  H01L35/30 ,  H01L35/32

Abstract: The present disclosure relates to a method of fabricating a thermoelectric device. The method includes disposing a metal layer on a dielectric layer to form a sub-assembly, forming patterned circuits on the metal layer, forming blind vias in the dielectric layer, fabricating first thermoelectric elements in a first series of blind vias, and fabricating second thermoelectric elements in a second series of blind vias to form thermoelectric units with the first thermoelectric elements and the patterned circuits. The sub-assembly is configured to be joined to an adjacent sub-assembly along a first direction, and the first and second thermoelectric elements of each thermoelectric unit are aligned in a second direction substantially perpendicular to the first direction. The present disclosure further relates to a thermoelectric device which includes a plurality of thermoelectric units forming a strip extending in a first direction.