公开(公告)号：US09754869B2

公开(公告)日：2017-09-05

申请号：US14651533

申请日：2013-03-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Alejandro Aldrin II Agcaoili Narag ,  Ravi Palaniswamy ,  Bee Leng Tan ,  Antonny Enojo Flor

IPC: H01L23/49 ,  H01L33/62 ,  H01L33/64 ,  H01L23/498 ,  H01S5/022 ,  H01L33/48

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49866 ,  H01L23/49894 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01S5/02272 ,  H01S5/02276 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.

公开(公告)号：US20150318237A1

公开(公告)日：2015-11-05

申请号：US14651533

申请日：2013-03-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Alejandro Aldrin II Agcaoili Narag ,  Ravi Palaniswamy ,  Antonny Enojo Flor

IPC: H01L23/498 ,  H01L33/62 ,  H01S5/022 ,  H01L33/48

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49866 ,  H01L23/49894 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01S5/02272 ,  H01S5/02276 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.

Abstract translation: 提供了一种用于支撑LESD的物品，其包括具有在其上具有导电层的第一主表面和第二主表面的电介质层，所述电介质层具有从第二主表面延伸到第一主表面的至少三个通孔，导电 层，其至少包括第一和第二导电特征，其中所述第一导电特征与至少第一通孔的开口相邻，并且所述第二导电特征与至少第二和第三通孔的开口相邻。