Epoxy group-containing copolymer and radiation sensitive resin
compositions thereof
    16.
    发明授权
    Epoxy group-containing copolymer and radiation sensitive resin compositions thereof 失效
    含环氧基团的共聚物及其辐射敏感树脂组合物

    公开(公告)号:US5530036A

    公开(公告)日:1996-06-25

    申请号:US356544

    申请日:1994-12-15

    摘要: An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained From (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and optionally (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided another epoxy-group containing thermosetting resin composition which contains the above component (A), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.

    摘要翻译: 含有环氧基的热固性树脂组合物,其包含(A)从(a)至少一种选自不饱和羧酸和不饱和羧酸酐的成分得到的共聚物,(b)含环氧基的不饱和化合物,(c) 单烯烃不饱和化合物和任选的(d)共轭二烯不饱和化合物,和(B)用于溶解上述共聚物的有机溶剂。 还提供另一种含环氧基的热固性树脂组合物,其含有上述组分(A),(C)具有至少一个烯属不饱和双键的可聚合化合物和(D)光聚合引发剂。 这些含环氧基的热固性树脂组合物的保存稳定性优异。

    Hot melt adhesive composition
    17.
    发明申请
    Hot melt adhesive composition 审中-公开
    热熔胶组成

    公开(公告)号:US20070135543A1

    公开(公告)日:2007-06-14

    申请号:US10580456

    申请日:2004-11-25

    IPC分类号: C09J7/02

    CPC分类号: C09J11/06 C08K5/05

    摘要: [Problem] To provide an adhesive composition which is used for fixing a semiconductor wafer or the like onto a substrate, exhibits firm adhesion with high heat resistance in the wafer grinding stage and is melted by heating to enable easy peeling after the completion of the wafer grinding stage. [Means to solve problem] The hot-melt adhesive composition of the invention is a composition containing as a main component a crystalline compound having a melting temperature of 50 to 300° C., and has a melting temperature width of not more than 30° C. and a melt viscosity of not more than 0.1 Pa·s. The crystalline compound as a main component is desired to be an organic compound composed of elements of C, H and O only and having a molecular weight of not more than 1000, preferably an aliphatic compound or an alicyclic compound, particularly preferably a compound having a steroid skeleton and/or a hydroxyl group.

    摘要翻译: [问题]为了提供用于将半导体晶片等固定到基板上的粘合剂组合物,在晶片研磨阶段中显示出牢固的粘合性,并且通过加热熔化,从而能够在晶片完成之后容易地剥离 研磨阶段。 解决问题的手段本发明的热熔粘合剂组合物是以熔融温度为50〜300℃,熔融温度为30℃以下的结晶化合物为主要成分的组合物 C.熔体粘度不大于0.1Pa·s。 作为主要成分的结晶化合物优选仅由C,H和O元素构成,分子量不超过1000的有机化合物,优选脂族化合物或脂环族化合物,特别优选具有 类固醇骨架和/或羟基。

    Composition and method for temporarily fixing solid
    18.
    发明授权
    Composition and method for temporarily fixing solid 有权
    用于临时固定固体的组合物和方法

    公开(公告)号:US07186448B2

    公开(公告)日:2007-03-06

    申请号:US10483178

    申请日:2003-05-12

    摘要: The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.

    摘要翻译: 本发明涉及一种暂时且牢固地将两种固体彼此固定的方法以及该方法中使用的组合物,该方法是暂时固定的方法,其包括用液晶化合物临时固定两种固体,或 包含液晶化合物的组合物。 该方法用于临时固定用于化学机械抛光的焊盘的方法,例如,当固体是用于晶片的化学机械抛光的焊盘时,抛光固定在基板表面上的半导体器件的晶片 用于半导体器件,另一个是用于固定焊盘的基板。